Abstract:
A pellicle-mask assembly includes a mask substrate having an absorber pattern, and a hard pellicle held against movement with respect to the mask substrate by gas pressure.
Abstract:
An immersion lithography system for semiconductor manufacturing provides a lens assembly that moves relative to a wafer surface and includes a nozzle and drain assembly that is coupled to, and moves along, the lens assembly. The nozzle and drain assemblies may be disposed circumferentially opposite each other about the lens or an annular ring may be provided that surrounds the lens and includes a plurality of selectable alternating nozzles and drains. The nozzle and drain assemblies may rotatably surround the lens. At least a portion of the wafer being patterned is immersed in a liquid provided by the nozzle assembly and a flow direction is controlled by manipulating the nozzle and drain assemblies. Flow direction may be advantageously directed outwardly to reduce particulate contamination.
Abstract:
A mask set of two masks and a method of using these masks in a double exposure to avoid line shortening due to optical proximity effects is described. A pattern having pattern elements comprising a number of line segments, wherein each of the line segments has one or two free ends which are not connected to other mask pattern elements is to be transferred to a layer of resist. A first mask is formed by adding line extensions to each of the free ends of the line segments. A cutting mask is formed comprising rectangles enclosing each of the line extensions wherein one of the sides of said rectangles is coincident with the corresponding free end of said line segment. The first mask has opaque regions corresponding to the extended line segments. The cutting mask has transparent regions corresponding to the cutting pattern. In another embodiment a pattern having pattern openings comprising a number of line segments. In this embodiment the cutting pattern comprises rectangles having the same width as said line segments and add length to the line segments.
Abstract:
A method and apparatus for correcting defects in a phase shift mask to be used in photolithography. More specifically, the method of the invention includes creating a second repair mask which contains phase shifters. Regions surrounding the defects on the first mask are made opaque. The design circuitry located in these defective regions is copied onto the second mask. During a second exposure the design circuitry is placed onto the semiconductor wafer. Therefore, this method and apparatus provides an inexpensive solution to a difficult problem.
Abstract:
A jig for positioning an image mask and image receiving medium which includes a housing having a central bore, first means within the bore for supporting a mask or image receiving medium, a flexible diaphragm, second means for drawing vacuum, and a third means for applying superatmospheric pressure on one side of the diaphragm to deform it towards the first means to ensure proper positioning of the mask and image receiving medium. Also, the process for positioning the mask and image receiving medium is provided.
Abstract:
A dynamic pattern display and optical data processing system is provided including magnetic bubble devices which may be operated in real-time to produce two and three dimensional patterns such as holograms, kinoform lenses and complex filters. Th display pattern is obtained by directing a linearly polarized light beam through a combination including a one-quarter waveplate, a plurality of two-dimensional magnetic bubble arrays and another one-quarter wave plate, all combined in a stack arrangement. In one embodiment a combination is provided which functions as a phase filter and in another embodiment including more bubble arrays, the combination functions as a phase and intensity filter. The display patterns are multi-phase or multi-tone (gray scale) and multi-phase in character. Each magnetic bubble array in the phase and phase and intensity filter embodiments constitutes a layer which differs in thickness from the other magnetic bubble layers. Each magnetic bubble array is also electronically driven by its own bubble propagating circuit which produces, in most embodiments, a different "local phase" or "local transmissivity" which is a function of whether a bubble or an empty space is propagated to the location. The number of levels of transmitted phase or intensity and phase is an exponential function of the number of magnetic bubble layers, thus n layers provides 2.sup.n steps of transmitted phase or intensity and phase modification and a four layer structure provides a sixteen level phase or phase and intensity display. The electronic portion of the structure may be driven by signals representing mathematical expressions, patterns, manual inputs and the like to generate holograms, kineform lenses, complex filters, three-dimensional television pictures, and other display and optical information processing applications.
Abstract:
A pattern generator includes a minor array plate having a mirror, at least one electrode plate disposed over the minor array plate, a lens let disposed over the minor, and at least one insulator layer sandwiched between the mirror array plate and the electrode plate. The electrode plate includes a first conducting layer and a second conducting layer. The lens let has a non-straight sidewall formed in the electrode plate. The pattern generator further includes at least one insulator sandwiched between two electrode plates. The non-straight sidewall can be a U-shaped sidewall or an L-shaped sidewall.
Abstract:
Provided is an alignment mark having a plurality of sub-resolution elements. The sub-resolution elements each have a dimension that is less than a minimum resolution that can be detected by an alignment signal used in an alignment process. Also provided is a semiconductor wafer having first, second, and third patterns formed thereon. The first and second patterns extend in a first direction, and the third pattern extend in a second direction perpendicular to the first direction. The second pattern is separated from the first pattern by a first distance measured in the second direction. The third pattern is separated from the first pattern by a second distance measured in the first direction. The third pattern is separated from the second pattern by a third distance measured in the first direction. The first distance is approximately equal to the third distance. The second distance is less than twice the first distance.
Abstract:
The present disclosure provides a photomask. The photomask includes a substrate. The photomask also includes a plurality of patterns disposed on the substrate. Each pattern is phase shifted from adjacent patterns by different amounts in different directions. The present disclosure also includes a method for performing a lithography process. The method includes forming a patternable layer over a wafer. The method also includes performing an exposure process to the patternable layer. The exposure process is performed at least in part through a phase shifted photomask. The phase shifted photomask contains a plurality of patterns that are each phase shifted from adjacent patterns by different amounts in different directions. The method includes patterning the patternable layer.
Abstract:
A method for electron-beam writing to a medium includes positioning the medium within an e-beam writing machine so that the medium is supported by a stage and is exposed to an e-beam source. The method also includes writing a pattern to the medium using a plurality of independently-controllable beams of the e-beam source, in which the pattern comprises a plurality of parallel strips. Each of the parallel strips is written using multiple ones of the independently-controllable beams.