公开(公告)号：US6157866A

公开(公告)日：2000-12-05

申请号：US878787

申请日：1997-06-19

申请人： Michael R. Conboy ,  Danny C. Shedd ,  Elfido Coss, Jr.

发明人： Michael R. Conboy ,  Danny C. Shedd ,  Elfido Coss, Jr.

IPC分类号： H01L21/00 ,  G06F19/00

CPC分类号： H01L21/67276 ,  G05B2219/31078 ,  G05B2219/31286 ,  G05B2219/45026 ,  Y02P90/083 ,  Y02P90/10 ,  Y10S414/14

摘要： An automated material handling system is presented for a manufacturing facility divided into separate fabrication areas. The automated material handling system plans and carries out the movement of work pieces between fabrication areas and maintains a database indicating the location of each work piece within the manufacturing facility. In one embodiment, the automated material handling system accomplishes the containerless transfer of semiconductor wafers through a wall separating a first and second fabrication areas. The wafers are transported within containers (e.g., wafer boats). The material handling system includes a number of transfer tools, including air lock chambers, mass transfer systems, robotic arms, and stock areas. The material handling system also includes a control system which governs the operations of the transfer tools as well as the dispersal of containers. The air lock chambers provide isolation between fabrication areas while permitting the transfer of wafers between the fabrication areas. A mass transfer system positioned within each air lock chamber allows for containerless transfer of wafers through the air lock chamber. The stock areas provide storage areas for containers adjacent to the air lock chambers. The robotic arms are used to move containers between the stock areas and the air lock chambers. The control system includes a main processor, a remote processor associated with each fabrication area, an internal network transmission medium coupling the main processor to the remote processors, and a cell network transmission medium within each fabrication area coupling the corresponding remote processor to one or more transfer tools.

摘要翻译： 对于分为独立制造区域的制造设施，提供了一种自动化材料处理系统。 自动化材料处理系统计划并执行工件在制造区域之间的移动，并且维护指示制造设备内每个工件的位置的数据库。 在一个实施例中，自动化材料处理系统通过分隔第一和第二制造区域的壁实现半导体晶片的无容器转移。 晶片在容器（例如，晶片舟皿）内运输。 材料处理系统包括许多转运工具，包括气锁室，传质系统，机器人手臂和库区。 材料处理系统还包括控制传送工具的操作以及容器分散的控制系统。 气锁室在制造区域之间提供隔离，同时允许在制造区域之间传送晶片。 定位在每个空气锁定室内的传质系统允许通过空气锁定腔容器无盘地传送晶片。 库区为靠近气锁室的容器提供储存区域。 机器人手臂用于在储存区域和气锁室之间移动容器。 控制系统包括主处理器，与每个制造区域相关联的远程处理器，将主处理器连接到远程处理器的内部网络传输介质，以及将相应的远程处理器连接到一个或多个的每个制造区域内的小区网络传输介质 转移工具。

公开(公告)号：US6005281A

公开(公告)日：1999-12-21

申请号：US852317

申请日：1997-05-07

申请人： Michael R. Conboy ,  Elfido Coss, Jr.

发明人： Michael R. Conboy ,  Elfido Coss, Jr.

IPC分类号： H01L21/68 ,  H01L27/04 ,  H01L27/02

CPC分类号： H01L21/68

摘要： An apparatus and method are presented for non-contact manipulation of a semiconductor die during semiconductor device manufacturing. Multiple die manipulation circuits are formed within specific regions of die areas of a semiconductor wafer. The die manipulation circuits may be formed upon a frontside surface of the wafer or upon a backside surface of the wafer. Following separation of the semiconductor dice from the wafer, a die is positioned above a horizontal surface of a die manipulation apparatus. Each die manipulation circuit receives alternating current (a.c.) power via an alternating magnetic field and uses the a.c. power to produce a static magnetic field. The static magnetic field opposes static magnetic fields formed around one or more levitation coils of the horizontal surface, causing the die to be levitated above the horizontal surface. By varying the relative strengths of the magnetic fields created by the levitation coils, "waves" of magnetic flux may be formed. Such waves of magnetic flux may be used to move the die parallel to the horizontal surface, or to rotate the die in a horizontal plane about an axis normal to the horizontal surface. Each die manipulation circuit includes a pickup coil, a levitation coil, a rectifier, and a capacitor. The horizontal surface of the die manipulation apparatus includes transmitter coils in addition to levitation coils. Each transmitter coil receives a.c. electrical power and produces an alternating magnetic field in response to the a.c. electrical power.

摘要翻译： 在半导体器件制造期间提供了用于半导体管芯的非接触操作的装置和方法。 在半导体晶片的管芯区域的特定区域内形成多个管芯电路。 管芯操作电路可以形成在晶片的前侧表面上或晶片的背侧表面上。 在将半导体晶片从晶片分离之后，将模具定位在模具操纵装置的水平表面上方。 每个管芯操作电路通过交变磁场接收交流（a.c.）电源，并使用交流电。 电源产生静磁场。 静磁场反对在水平表面的一个或多个悬浮线圈周围形成的静磁场，导致模具在水平面上浮起。 通过改变由悬浮线圈产生的磁场的相对强度，可以形成磁通的“波”。 这种磁通量波可以用于平行于水平表面移动模具，或者使模具在垂直于水平表面的轴线的水平平面内旋转。 每个管芯操作电路包括拾取线圈，悬浮线圈，整流器和电容器。 模具操纵装置的水平表面除了悬浮线圈之外还包括发送器线圈。 每个发射器线圈接收一个 电力并响应于交流电场产生交变磁场。 电力。

公开(公告)号：US5444637A

公开(公告)日：1995-08-22

申请号：US127941

申请日：1993-09-28

申请人： Greg A. Smesny ,  Michael R. Conboy

发明人： Greg A. Smesny ,  Michael R. Conboy

IPC分类号： H01L21/00 ,  H01L21/66 ,  H01L23/544 ,  H01L21/70

CPC分类号： B24B37/013 ,  H01L21/67253 ,  H01L22/26 ,  H01L22/34 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/3011

摘要： A semiconductor wafer is provided for sensing and recording processing conditions to which the wafer is exposed. The wafer can also write the recorded processing conditions to an external output device connectable to the wafer. The wafer includes a plurality of regions spaced across the wafer, and at least one sensor placed within each region. The sensor can sense a single processing condition such as, e.g., pressure, temperature, fluidic flow rate, or gas composition. If more than one processing condition is to be measured, then more than one sensor can be placed in each region to provide a sensed reading across the entire wafer surface necessary for gradient measurements. The wafer further includes signal acquisition/conditioning circuit which receives analog signals from each of the sensors placed upon the wafer and converts the analog signals to corresponding digital signals. Digital signals can then be stored within and processed by a processor also formed within the wafer. The semiconductor wafer further includes input/output probe pads which receive external input to the wafer circuitry and output stored information from the circuitry.

摘要翻译： 提供半导体晶片用于感测和记录晶片暴露于其中的处理条件。 晶片还可以将记录的处理条件写入可连接到晶片的外部输出设备。 晶片包括跨晶片隔开的多个区域，以及放置在每个区域内的至少一个传感器。 传感器可以感测单个处理条件，例如压力，温度，流体流速或气体组成。 如果要测量多于一个的处理条件，则可以在每个区域中放置多于一个传感器，以便在梯度测量所需的整个晶片表面上提供感测读数。 晶片还包括信号采集/调理电路，其接收放置在晶片上的每个传感器的模拟信号，并将模拟信号转换成相应的数字信号。 然后，数字信号可以存储在也在晶片内形成的处理器中并由其处理。 半导体晶片还包括输入/​​输出探针焊盘，其接收晶片电路的外部输入并从电路输出存储的信息。

公开(公告)号：US06954883B1

公开(公告)日：2005-10-11

申请号：US10044340

申请日：2002-01-11

申请人： Elfido Coss, Jr. ,  Michael R. Conboy ,  Susan Hickey

发明人： Elfido Coss, Jr. ,  Michael R. Conboy ,  Susan Hickey

IPC分类号： G06F11/00

CPC分类号： G05B19/41875 ,  G05B2219/32196 ,  G05B2219/45031 ,  H01L21/67253 ,  H01L21/67288 ,  H01L22/20 ,  Y02P90/22

摘要： A method and an apparatus for performing fault detection using real-time or near real-time data from a database. A first process on at least one semiconductor wafer is performed. Data is acquired on at least one of a real-time basis and a near real-time basis, the data comprising at least one of a process state data, a tool state data, and an integrated metrology data resulting from the first processing of semiconductor wafer. The data is stored in a database. A fault detection analysis is performed based upon the data acquired from the database based upon a trigger signal that causes data to be extracted from the database on a substantially real time basis.

摘要翻译： 一种用于使用来自数据库的实时或近实时数据执行故障检测的方法和装置。 执行至少一个半导体晶片的第一工艺。 以实时和近实时为基础的至少一个采集数据，所述数据包括由半导体的第一处理产生的过程状态数据，工具状态数据和集成测量数据中的至少一个 晶圆。 数据存储在数据库中。 基于从数据库获取的数据基于触发信号执行故障检测分析，该触发信号使数据基本上实时地从数据库中提取出来。

公开(公告)号：US06629012B1

公开(公告)日：2003-09-30

申请号：US09479403

申请日：2000-01-06

申请人： Terrence J. Riley ,  Qingsu Wang ,  Michael R. Conboy ,  Michael L. Miller ,  W. Jarrett Campbell

发明人： Terrence J. Riley ,  Qingsu Wang ,  Michael R. Conboy ,  Michael L. Miller ,  W. Jarrett Campbell

IPC分类号： G06F1900

CPC分类号： H01L21/67253 ,  G05B19/4184 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/22

摘要： A metbod for perforning a wafer-less qualification of a processing tool includes creating a wafer-less qualification model for the processing tool. Qualification data is generated from the processing tool iiiring a wafer-less qualification process. The qualification data is compared with the wafer-less qualification model. The processig tool is determined to be operating in a predefined state based on the comparison of the qualification data with the wafer-less qualification model.

摘要翻译： 用于穿透无晶圆处理工具的资格的metbod包括为处理工具创建无晶圆的鉴定模型。 资格数据是从处理工具生成的，不需要无晶圆资格认证。 将资格数据与无晶圆资格认证模型进行比较。 基于资格数据与无晶圆资格认证模型的比较，流程工具被确定为在预定状态下操作。

公开(公告)号：US06567718B1

公开(公告)日：2003-05-20

申请号：US09627874

申请日：2000-07-28

申请人： William J. Campbell ,  Jeremy Lansford ,  Michael R. Conboy

发明人： William J. Campbell ,  Jeremy Lansford ,  Michael R. Conboy

IPC分类号： G06F1900

CPC分类号： G05B19/4184 ,  G05B2219/32234 ,  G05B2219/45031 ,  Y02P90/14 ,  Y10T70/5628

摘要： A method for monitoring consumable performance in a processing tool comprises storing a performance model of the processing tool; receiving a consumable item characteristic of a consumable item in the processing tool; determining a predicted processing rate for the processing tool based on the consumable item characteristic and the performance model; determining an actual processing rate of the processing tool; and determining a replacement interval for the consumable item based on at least the actual processing rate. A processing system includes a processing tool and an automatic process controller. The processing tool is adapted to process wafers and includes a consumable item.

摘要翻译： 一种用于监视处理工具中的消耗性能的方法，包括存储处理工具的性能模型; 在所述处理工具中接收消耗品特征的消耗品; 基于消耗品特征和性能模型确定处理工具的预测处理速率; 确定所述处理工具的实际处理速率; 以及至少基于所述实际处理速率确定所述消耗品的替换间隔。 处理系统包括处理工具和自动过程控制器。 处理工具适于处理晶片并且包括消耗品。

公开(公告)号：US06556882B1

公开(公告)日：2003-04-29

申请号：US09401089

申请日：1999-09-22

申请人： Michael R. Conboy ,  Elfido Coss, Jr. ,  Qingsu Wang

发明人： Michael R. Conboy ,  Elfido Coss, Jr. ,  Qingsu Wang

IPC分类号： G06F1900

CPC分类号： H01L22/20

摘要： A method and apparatus for performing manufacturing system analysis upon a manufacturing network. Real-time production data is collected. The real-time production data is stored in a static file database. A real-time data flow is emulated using said real-time production data from said static file database. A reactive function analysis is performed.

摘要翻译： 一种用于在制造网络上执行制造系统分析的方法和装置。 收集实时生产数据。 实时生产数据存储在静态文件数据库中。 使用来自所述静态文件数据库的所述实时生产数据来模拟实时数据流。 进行反应性功能分析。

公开(公告)号：US06403905B1

公开(公告)日：2002-06-11

申请号：US09496874

申请日：2000-02-02

申请人： Michael R. Conboy ,  Elfido Coss, Jr. ,  Russel Shirley

发明人： Michael R. Conboy ,  Elfido Coss, Jr. ,  Russel Shirley

IPC分类号： B07C500

CPC分类号： H01L21/67271 ,  G03F7/70741 ,  Y10S209/933

摘要： A system and method for stocking and sorting reticles used in a semiconductor fabrication facility, the facility having a material handling system that presents a reticle to a photolithography process area. In an example embodiment of the reticle management system, a reticle storage system and a reticle sorting apparatus are coupled to a host system that is adapted to track and control the movement of reticles in the material handling system. The host system is capable of interfacing with a management input module that integrates management directives into the reticle flow plan in the manufacturing process. The result is a reticle management system that is flexible enough to manage a finite number of reticles and pods in minimizing the delivery time of a reticle to the desired location while responding to changing conditions external to the manufacturing process.

摘要翻译： 一种用于在半导体制造设备中使用的放线和分类掩模版的系统和方法，该设备具有将光罩呈现于光刻工艺区域的材料处理系统。 在掩模版管理系统的示例性实施例中，掩模版存储系统和掩模版分类装置耦合到适于跟踪和控制材料处理系统中的标线的运动的主机系统。 主机系统能够与管理输入模块进行接口，管理输入模块将管理指令集成到制造过程中的标线流程图中。 结果是一种掩模版管理系统，其足够灵活以管理有限数量的光罩和荚，以最小化掩模版到所需位置的传送时间，同时响应制造过程外部的变化条件。

公开(公告)号：US06392403B1

公开(公告)日：2002-05-21

申请号：US09496531

申请日：2000-02-02

申请人： Michael R. Conboy ,  Elfido Coss, Jr. ,  Russel Shirley ,  Eric Christensen

发明人： Michael R. Conboy ,  Elfido Coss, Jr. ,  Russel Shirley ,  Eric Christensen

IPC分类号： G01R3128

CPC分类号： H01L21/67294 ,  G01R31/01 ,  H01L21/67271

摘要： An apparatus and a system for stocking and sorting wafers in a wafer processing system reduce cycle time in manufacturing and reduce excessive handling of delicate wafers. In an example embodiment, the apparatus includes in an enclosure having therein a scanner adapted to identify codes located on the wafer carriers that indicate the position of a wafer within the carrier. A sorting mechanism for sorting wafers and carriers within the enclosure is also included as well as a computer arrangement that communicates with the management system of the wafer processing system. One of the advantages of the present invention is the reduction in cycle time that is achieved by sorting wafers immediately on demand while at a stocking location.

摘要翻译： 用于在晶片处理系统中放置和分选晶片的装置和系统减少制造中的周期时间并减少精细晶片的过度处理。 在一个示例性实施例中，该装置包括在其中具有扫描器的外壳中，扫描器适于识别位于晶片载体上的代码，其指示晶片在载体内的位置。 还包括用于在外壳内分选晶片和载体的分拣机构以及与晶片处理系统的管理系统通信的计算机装置。 本发明的优点之一是通过在放养位置时立即分选晶片来实现循环时间的减少。

公开(公告)号：US06216948B1

公开(公告)日：2001-04-17

申请号：US09175624

申请日：1998-10-20

申请人： Michael R. Conboy ,  Russel Shirley

发明人： Michael R. Conboy ,  Russel Shirley

IPC分类号： G06K1500

CPC分类号： G06K7/10861 ,  G06K2017/0045

摘要： An apparatus for identification of work pieces and protection of equipment used to operate on the work pieces in a computer controlled manufacturing arrangement. The equipment to be protected includes at least one receptacle for holding a work piece, and the apparatus comprises a rail and an electronic sensor mounted to the rail. The rail is shaped to generally to surround a selected portion of the equipment and is arranged to be supported proximate the equipment to deflect objects from the equipment. The electronic sensor is mounted to the rail at a location to sense a work piece in the receptacle and arranged to be coupled to the computer.

摘要翻译： 用于在计算机控制的制造布置中识别工件和用于在工件上操作的设备的保护的装置。 待保护的设备包括用于保持工件的至少一个插座，并且该装置包括安装在轨道上的轨道和电子传感器。 轨道的形状大体上围绕设备的选定部分，并被布置成靠近设备被支撑以使物体偏离设备。 电子传感器安装在导轨上，以便感测插座中的工件，并布置成与计算机相连。