摘要:
A method for producing a storage cell includes forming a polycrystalline silicon layer on a semiconductor body having at least one selection transistor disposed in a first plane. An interspace is formed between two adjacent structures of the layer and one of the adjacent structures of the layer is placed on a surface of a first silicon plug. A cell plate electrode is formed in the interspace and a trench is formed in the layer. The trench reaches as far as the first plug surface and is filled with an insulating layer. The-layer is removed. A storage capacitor having a high-epsilon or ferroelectric dielectric and a storage node electrode is formed. The capacitor is disposed in a second plane in and above the body. The insulating layer is replaced with silicon to form a second silicon plug directly connected to the first plug. The second plug is electrically connected to the storage node electrode, and the first plane is electrically connected to the second plane through the first and second plugs.
摘要:
A memory cell arrangement, and method for producing same, which includes vertical MOS transistors as memory cells wherein the information is stored by means of at least three different threshold voltage values of the transistors by multi-level programming. One threshold voltage value is obtained by the thickness of the gate dielectric in the sense of a thick oxide transistor and the other threshold voltage values are obtained by different channel dopings. The arrangement can be produced with an area requirement for each memory cell of 2 F2 (F: minimum structure size).
摘要:
A first structure of a circuit configuration and a first alignment structure are produced in the region of a surface of a first substrate. The first alignment structure scatters electron beams differently than its surroundings. A second substrate, which is more transmissive to electron beams than the first alignment structure, is connected to the first substrate in such a way that the second substrate is disposed above the surface of the first substrate. In order to align a mask with respect to the first structure, a position of the first alignment structure is determined with the aid of electron beams. With the aid of the mask, at least one second structure of the circuit configuration is produced in the region of an uncovered upper surface of the second substrate. The first structure may be a metallic line encapsulated by insulating material. A contact may connect the first structure to the second structure. With the aid of electron beam lithography, at least one second alignment structure may be produced in the region of the upper surface of the second substrate, using which the mask is aligned.
摘要:
A memory cell configuration contains a multiplicity of memory cells in a semiconductor substrate. Each of the memory cells has a selection transistor connected between a bit line and a storage element. The memory cells can each be driven via a first word line and a second word line, the first word line and the second word line crossing one another. The memory cell configuration is, in particular, a DRAM configuration.
摘要:
A read-only memory cell arrangement having planar MOS transistors which are arranged in parallel rows. Neighboring rows run alternately on the bottom of longitudinal trenches and run between neighboring longitudinal trenches. Bit lines run transversely and word lines run parallel to the longitudinal trenches. The memory cell arrangement can be produced with an area per memory cell of 2F.sup.2 (F-minimum structure size).
摘要:
In a read-only memory cell arrangement having first memory cells which contain a vertical MOS transistor, and having second memory cells which do not contain vertical MOS transistors, the memory cells are arranged along opposite flanks of strip-shaped parallel insulation trenches (16). The width of the insulation trenches (16) is preferably equal to their separation, so that the memory cell arrangement can be produced with a space requirement of 2F.sup.2 per memory cell, F being the minimum structure size in the respective technology.
摘要:
A first MOS transistor and a second MOS transistor are connected in series with a first complementary MOS transistor and a second complementary MOS transistor that are connected in parallel with one another. The transistors are each realized as a vertical layer sequence that forms the source, channel and drain and that which has a sidewall at which a gate dielectric and a gate electrode are arranged. The complementary MOS transistors connected in parallel with one another are realized in a common layer sequence of the source, channel and drain. The layer sequences that form the series-connected transistors are arranged above one another. The circuit structure is manufactured by epitaxal definition of the layer sequences, such as by molecular beam epitaxy.
摘要:
For a top of a passenger car, a noise/thermal insulating intermediate layer and an interior ceiling are arranged inside an exterior top covering of the top for muffling noise and for achieving an effective thermal protection against heat and coldness. So that an inflating of the top covering is avoided during a driving operation at speed, the top covering, supporting layers of the intermediate layer and the interior ceiling are attached to a plurality of transversely extending bows of the top.
摘要:
A ceramic filter for filtering molten iron is disclosed. The ceramic filter is made from a high-melting ceramic material having an open-celled foam structure, a variable bulk density in different portions of the filter, and at least one afflux surface. In order to filter molten iron efficiently, the ratio of filter surface to filter volume should be in the range of about 0.0003 to 9 m.sup.2 /cm.sup.3, the specific filter resistance should be in the range of about 0.1 to 0.9 bar-cm at a flow rate of 5 m.sup.3 /hour, and the pressure loss .DELTA.p across the filter should depend on the specific resistance .rho., the filter length, and the surface area of the afflux plane F in accordance with the relationship: ##EQU1## A method for filtering molten iron using this ceramic filter is also disclosed. In this method, the ceramic filter is located near the point in the casting system where the molten iron has its greatest kinetic energy. The molten iron is first caused to flow tangentially by the afflux plane of the ceramic filter and then is deflected to create turbulence directly before the afflux plane of the filter.
摘要:
There is disclosed a process for applying a refractory filler and a hydrate of Al(H.sub.2 PO.sub.4).sub.3 or polyphosphates as a binder to a single or multi-layered carrier material to form a single or multi-layered, thin-walled structure subsequently hardened on the carrier material. The hardening is preferably conducted at a temperature below 400.degree. C. There is thus obtained a phosphate-bonded, thin-walled shaped article which is refractory at temperatures above 1300.degree. C.
摘要翻译:公开了将耐火填料和Al(H 2 PO 4)3或多磷酸盐的水合物作为粘合剂施加到单层或多层载体材料上以形成单层或多层薄壁结构的方法,随后在 载体材料。 硬化优选在低于400℃的温度下进行。因此,获得了在1300℃以上耐火材料的磷酸盐键合的薄壁形状的制品。