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公开(公告)号：US20110091157A1
公开(公告)日：2011-04-21
申请号：US12581709
申请日：2009-10-19
IPC分类号： G02B6/26
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译： 描述了包括使用光学互连耦合的三维（3D）芯片堆叠的多芯片模块（MCM）。 在该MCM中，设置在3D堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到第三光耦合器的第二光耦合器， 光波导。 第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。 此外，第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面）或从第二方向到光波导。 注意，与第二方向相关联的光路通过中间芯片中的衬底中的开口。
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公开(公告)号：US08768123B2
公开(公告)日：2014-07-01
申请号：US13566598
申请日：2012-08-03
IPC分类号： G02B6/02
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译： 多芯片模块（MCM）包括使用光学互连耦合的一堆芯片。 在堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到光波导的第二光耦合器。 第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。 第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面中）或从第二方向到光波导。 与第二方向相关联的光路通过中间芯片中的基板的开口。
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公开(公告)号：US20130195461A1
公开(公告)日：2013-08-01
申请号：US13361866
申请日：2012-01-30
IPC分类号： H04J14/02
CPC分类号： H04J14/02 , H04B10/506 , H04J14/0221
摘要： An optical source includes a set of N light sources that provide a corresponding set of N optical signals having N carrier wavelengths. These optical signals are combined into a seed optical signal and transported to a substrate using an optical fiber. This substrate includes a set of K optical amplifiers that amplify the seed optical signal and provide a set of M output optical signals on a corresponding set of M output optical waveguides (where M is less than K). In this way, a total power of the set of M output optical signals may be significantly larger than that of the seed optical signal, thereby ensuring that a majority of a power efficiency of the optical source is associated with power efficiencies of the set of K optical amplifiers instead of power efficiencies of the set of N light sources.
摘要翻译： 光源包括一组N个光源，其提供具有N个载波波长的相应的一组N个光信号。 这些光信号被组合成种子光信号，并使用光纤传输到基板。 该衬底包括一组放大种子光信号的K个放大器，并在相应的一组M个输出光波导（其中M小于K）上提供一组M个输出光信号。 以这种方式，一组M个输出光信号的总功率可以显着大于种子光信号的总功率，从而确保光源的大部分功率效率与该组K的功率效率相关联 光放大器而不是N组光源的功率效率。
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公开(公告)号：US20120321251A1
公开(公告)日：2012-12-20
申请号：US13566598
申请日：2012-08-03
IPC分类号： G02B6/26
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译： 多芯片模块（MCM）包括使用光学互连耦合的一堆芯片。 在堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到光波导的第二光耦合器。 第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。 第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面中）或从第二方向到光波导。 与第二方向相关联的光路通过中间芯片中的基板的开口。
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公开(公告)号：US20120177318A1
公开(公告)日：2012-07-12
申请号：US12986062
申请日：2011-01-06
IPC分类号： G02F1/01
CPC分类号： G02F1/025 , G02F2001/0157
摘要： During operation of an electro-absorption modulator, an optical signal is conveyed, using an optical waveguide in the electro-absorption modulator, to a semiconductor layer that substantially fills a gap between two portions of the optical waveguide. Then, the optical signal is electro-absorption modulated by selectively applying a voltage to electrodes that produces an electric field, approximately perpendicular to the midline of the optical waveguide, in the semiconductor layer. These electrodes are coupled to the edges of the semiconductor layer at the periphery along the width of the semiconductor layer by intervening layers. Furthermore, the intervening layers include a material that has a lower index of refraction than the semiconductor layer, and a lower optical absorption than the electrodes.
摘要翻译： 在电吸收调制器的操作期间，使用电吸收调制器中的光波导将光信号传送到基本上填充光波导的两个部分之间的间隙的半导体层。 然后，通过选择性地向在半导体层中产生大致垂直于光波导的中线的电场的电极施加电压来对光信号进行电吸收调制。 这些电极通过中间层沿半导体层的宽度在周边连接到半导体层的边缘。 此外，中间层包括具有比半导体层低的折射率的材料，并且具有比电极更低的光学吸收。
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公开(公告)号：US20110169522A1
公开(公告)日：2011-07-14
申请号：US12685159
申请日：2010-01-11
申请人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
发明人： Kannan Raj , Xuezhe Zheng , Ashok V. Krishnamoorthy , Ronald Ho , Michael O. McCracken , David K. McElfresh , John E. Cunningham
IPC分类号： H03K19/003
CPC分类号： H03K19/177
摘要： A multi-chip module (MCM) is described. This MCM includes multiple sites, where a given site in the multiple sites includes multiple chips with proximity connectors that communicate information through proximity communication within the MCM via multiple components associated with the given site. Note that the MCM includes global redundancy and local redundancy at the given site. In particular, the global redundancy involves providing one or more redundant sites in the multiple sites. Furthermore, the local redundancy involves providing one or more redundant chips in the multiple chips and one or more redundant components in the multiple components.
摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括多个站点，其中多个站点中的给定站点包括具有邻近连接器的多个芯片，其通过与给定站点相关联的多个组件在MCM内通过邻近通信传递信息。 请注意，MCM包括给定站点的全局冗余和本地冗余。 特别地，全局冗余涉及在多个站点中提供一个或多个冗余站点。 此外，本地冗余包括在多个芯片中提供一个或多个冗余芯片以及在多个组件中提供一个或多个冗余组件。
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公开(公告)号：US07889996B2
公开(公告)日：2011-02-15
申请号：US11962415
申请日：2007-12-21
CPC分类号： H04J14/02 , H04B10/801 , H04J14/0227 , H04Q11/0062 , H04Q2011/0096
摘要： Embodiments of a system are described. This system includes an array of chip modules (CMs) that are configured to communicate data signals with each other via optical communication. In a given CM module, optical signal paths, such as waveguides, are routed in the same way as in the other CMs in the array. In this way, a common optical design in the CMs may be used in the system to prevent data conflicts during the optical communication.
摘要翻译： 描述系统的实施例。 该系统包括被配置为经由光通信彼此通信数据信号的芯片模块（CM）阵列。 在给定的CM模块中，诸如波导的光信号路径以与阵列中的其他CM相同的方式路由。 以这种方式，可以在系统中使用CM中的普通光学设计来防止光通信期间的数据冲突。
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公开(公告)号：US07574077B2
公开(公告)日：2009-08-11
申请号：US11515207
申请日：2006-08-31
IPC分类号： G02B6/42
CPC分类号： G02B6/12007 , G02B6/29341 , G02B6/43 , H01L23/48 , H01L24/10 , H01L24/13 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L25/0657 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/81136 , H01L2224/81801 , H01L2224/83136 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/0106 , H01L2924/01066 , H01L2924/01067 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10157 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： An assembly comprising first and second electronic devices and an optical coupling device that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. The first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device. Further, the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide. Thus, the optical coupling device optically couples the first optical waveguide to the second optical waveguide.
摘要翻译： 一种组件，包括第一和第二电子设备以及将第一电子设备上的光波导光耦合到第二电子设备上的光波导的光耦合设备。 以这种方式，设备之间的光学邻近通信是可能的。 电子设备可以是集成电路芯片。 第一光波导相对于光耦合装置定位，以将光信号引导到光耦合装置。 此外，第二光波导相对于光耦合装置定位，以接收从光耦合装置指向第二光波导的光信号。 因此，光耦合装置将第一光波导光学耦合到第二光波导。
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公开(公告)号：US09316784B2
公开(公告)日：2016-04-19
申请号：US13479109
申请日：2012-05-23
CPC分类号： G02B6/12009 , G02B6/29326 , G02B6/29328 , G02B6/2938 , G02B6/43 , G02B2006/12107
摘要： An MCM may include a single optical routing layer that provides point-to-point connectivity among N chips in the MCM, such as all-to-all connectivity or full-mesh point-to-point connectivity. Moreover, the optical routing layer may include: N optical waveguides optically coupled to the N chips and a cyclic de-multiplexer, optically coupled to the N optical waveguides, that routes optical signals among the N optical waveguides without optical-waveguide crossing in the optical routing layer. For example, the cyclic de-multiplexer may include: an array-waveguide-grating (AWG) wavelength router and/or an echelle-grating wavelength router.
摘要翻译： MCM可以包括在MCM中的N个芯片之间提供点对点连接的单个光路由层，诸如全对连接或全网点对点连接。 此外，光路由层可以包括：光学耦合到N个芯片的N个光波导和光学耦合到N个光波导的循环去多路复用器，其在N个光波导中路由光信号，而在光学器件中没有光波导交叉 路由层。 例如，循环去多路复用器可以包括：阵列波导光栅（AWG）波长路由器和/或梯形光栅波长路由器。
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公开(公告)号：US08755655B2
公开(公告)日：2014-06-17
申请号：US12564701
申请日：2009-09-22
CPC分类号： G02B6/423 , G02B6/12 , G02B6/30 , G02B6/36 , G02B6/42 , G02B6/4228 , G02B6/4231 , G02B6/43 , H04B10/803
摘要： An optical module is described. This optical module includes at least two optical devices that communicate with each other using edge-to-edge optical coupling of an optical signal between optical components in the two optical devices. Note that the edge-to-edge optical coupling may occur without mode converters at edges of either of the optical devices. Furthermore, the edge-to-edge optical coupling may be facilitated by an alignment substrate, which is mechanically coupled to the two optical devices. This alignment substrate aligns the edges of the two optical devices so that they are approximately parallel to each other, and aligns the optical components in the two optical devices.
摘要翻译： 描述光学模块。 该光学模块包括使用两个光学装置中的光学部件之间的光信号的边缘到边缘光耦合来彼此通信的至少两个光学装置。 注意，边缘到边缘光耦合可能在任何光学器件的边缘处没有模式转换器。 此外，边缘到边缘光耦合可以通过机械耦合到两个光学器件的对准衬底来促进。 该对准衬底对准两个光学器件的边缘，使得它们彼此近似平行，并对准两个光学器件中的光学部件。
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