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公开(公告)号：US11498269B2
公开(公告)日：2022-11-15
申请号：US16606001
申请日：2018-04-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Kristopher J. Erickson , Anthony William McLennan , Lihua Zhao
IPC: B29C64/188 , B33Y30/00 , B29C64/268 , B29C64/165 , B33Y40/20
Abstract: Example post-print processing of three dimensional (3D) printed objects are disclosed. An example system includes an energy source to apply energy to a selected portion of an outer surface of a 3D printed object. The energy provided by the energy source is to cause a polymer of the selected portion to melt and reflow. The selected portion and a non-selected portion of the outer surface to form a pattern on the outer surface of the 3D printed object. A controller to direct the energy of the energy source to the selected portion of the outer surface.
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公开(公告)号：US11413687B2
公开(公告)日：2022-08-16
申请号：US16080230
申请日：2017-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Kristopher J. Erickson , Thomas C. Anthony
IPC: B22F10/14 , B33Y10/00 , B33Y70/00 , B29C64/165 , B28B1/00 , C04B35/622 , C04B35/634 , C04B35/64 , B22F1/054
Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.
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公开(公告)号：US20220097307A1
公开(公告)日：2022-03-31
申请号：US17414677
申请日：2019-06-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Jarrid Wittkopf , Rafael Ballagas , David Wayne George , Lihua Zhao , William J. Allen
IPC: B29C64/386 , B33Y30/00 , B33Y50/00
Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes an additive manufacturing device to form a three-dimensional (3D) printed object. A placement device of the additive manufacturing system is to embed a sensing system into build material used to form the 3D printed object. The sensing system is to measure a manufacturing condition during formation of the 3D printed object. The additive manufacturing system also includes a controller to associate manufacturing condition with the 3D printed object.
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公开(公告)号：US20220097306A1
公开(公告)日：2022-03-31
申请号：US17414543
申请日：2019-06-18
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Jarrid Wittkopf , Rafael Ballagas , David Wayne George , Lihua Zhao , William J. Allen
IPC: B29C64/386 , G06Q10/06 , B29C64/379 , G06Q10/00 , G06Q50/04
Abstract: In one example in accordance with the present disclosure, a system is described. The system includes a reader to read an identifier from a storage element associated with a part. An extractor of the system extracts, based on the identifier, lifecycle conditions specific to the part. A controller of the system alters manufacturing operations based on extracted lifecycle conditions for the part.
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公开(公告)号：US20210362232A1
公开(公告)日：2021-11-25
申请号：US16606045
申请日：2018-07-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Krzysztof Nauka , Seongsik Chang , Kristopher J. Erickson
Abstract: A three-dimensional (3D) printing device may include a pulsed electromagnetic radiation source; a build platform to maintain a number of layers of build material thereon and receive pulsed electromagnetic radiation from the pulsed electromagnetic radiation source; a micromirror array to selectively direct the pulsed electromagnetic radiation from the pulsed electromagnetic radiation source to the build material on the build platform; and a coolant tank with coolant therein to cool the micromirror array.
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Patent Agency Ranking
公开(公告)号：US20210323068A1
公开(公告)日：2021-10-21
申请号：US16605406
申请日：2018-06-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Krzysztof Nauka , John Samuel Dilip Jangam , Kristopher J. Erickson
Abstract: The present disclosure is drawn to a material set including a powder bed material and a binder fluid. The powder bed material can be from 80 wt % to 100 wt % metal particles having a metal core and a thin metal layer on the core, and the metal particles having a D50 particle size distribution value ranging from 4 μm to 150 μm and the thin metal layer having an average thickness from 20 nm to 2 μm. The binder fluid can adhere a first portion of the powder bed material relative to a second portion of the powder bed material not in contact with the binder fluid.
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公开(公告)号：US20210154924A1
公开(公告)日：2021-05-27
申请号：US17045783
申请日：2018-08-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , John Samuel Dilip Jangam , Adekunle Olubummo
Abstract: Examples of binder agents for a three-dimensional (3D) printing process are disclosed. In an example, the binder agent includes copper nanoparticles and a liquid vehicle. In this example, the liquid vehicle includes an antioxidant, polyethylene glycol hexadecyl ether, and a balance of water. Another example of the binder agent includes stainless steel nanoparticles and a liquid vehicle. In this example, the liquid vehicle includes polyethylene glycol hexadecyl ether, and a balance of water. Still another example of the binder agent includes nickel nanoparticles and a liquid vehicle. The liquid vehicle includes an antioxidant; a symmetric triblock copolymer including poly(ethylene oxide) and poly(propylene oxide), and a balance of water.
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公开(公告)号：US11008479B2
公开(公告)日：2021-05-18
申请号：US16076918
申请日：2017-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Paul Olubummo , Lihua Zhao , Kristopher J. Erickson , Howard S. Tom , Aja Hartman
IPC: C09D11/54 , B33Y10/00 , B33Y30/00 , B29C64/165 , B29C64/393 , C09D11/033 , C09D11/037 , C09D11/30 , B33Y50/02 , B33Y70/00 , B29C64/112 , B29C64/20 , C09D11/101 , C09D11/102 , C09D11/328 , C09D11/38
Abstract: An example of a fusing agent includes a tetraphenyldiamine-based dye, alkyldiphenyloxide disulfonate, 1-methyl-2-pyrrolidone, and a balance of water. The fusing agent excludes a strong reducing species. The fusing agent may be incorporated into a three-dimensional printing method or a three-dimensional printing system. In an example of the three-dimensional printing method, a polymeric or polymeric composite build material is applied. The fusing agent is selectively applied on at least a portion of the polymeric or polymeric composite build material. The polymeric or polymeric composite build material is exposed to electromagnetic radiation to fuse the portion of the polymeric or polymeric composite build material in contact with the fusing agent to form a layer.
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公开(公告)号：US10647053B2
公开(公告)日：2020-05-12
申请号：US16072123
申请日：2016-05-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Lihua Zhao , Howard S. Tom , Aja Hartman , Yan Zhao , Andrew E. Fitzhugh
IPC: B27N5/00 , B29C41/22 , B29C67/04 , B29C70/28 , B29C71/04 , B29C64/112 , B33Y70/00 , B33Y10/00 , B33Y50/02 , B29C67/00 , B29C64/165 , B29C64/264
Abstract: In an example of a three-dimensional (3D) printing method, a polymeric build material is applied. A fusing agent is selectively applied on at least a portion of the polymeric build material. A mechanical tailoring agent is selectively applied on at least a region of the portion. The polymeric build material is exposed to radiation, thereby fusing the at least the portion of the polymeric build material in contact with the fusing agent to form a layer. The mechanical tailoring agent forms a composite layer in the at least the region, and the composite layer has a different mechanical property than that of an area of the layer not in contact with the mechanical tailoring agent.
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公开(公告)号：US20190160534A1
公开(公告)日：2019-05-30
申请号：US16264681
申请日：2019-02-01
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kristopher J. Erickson , Krzysztof Nauka , Thomas Anthony , Lihua Zhao , Howard S. Tom
Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles, The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.
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