Abstract:
To cool the diaphragm of a spectral discharge lamp having an anode and a cathode between which a discharge is established, which discharge is controlled by the diaphragm, a fluid supply and removal duct is connected to a cooling circuit in or on the diaphragm structure to supply, for example, water to cool the diaphragm. The tube or bulb of the lamp may be in form of a jacketed enclosure through which cooling water is conducted, preferably in the same supply and removal circuit as that for the diaphragm structure.
Abstract:
A measuring system for detecting measuring signals during a penetration movement of a penetration body into a surface of a test body, in particular for determining the scratch resistance of the surface of the test body, or during a scanning movement of the penetration body on the surface of the test body, in particular for determining the surface roughness, including a housing with a power generating device, which is operatively connected to a penetration body for generating a displacement movement of the penetration body along a longitudinal axis of the housing, and which actuates a penetration movement of the penetration body into the surface of the test body to be examined, or which positions the penetration body on the surface of the test body for scanning, and having at least one first measuring device for measuring the penetration depth into the surface of the test body or a displacement movement of the penetration body along the longitudinal axis of the housing during a scanning movement on the surface of the test body. The power generating device is actuated by a pressure medium for the penetration movement of the penetration body.
Abstract:
A method for electrically activating a measurement stand with a movement of at least one measuring probe (26) from a starting position (31) into a measuring position (32) and also a measurement stand for supporting a measuring probe, in particular for measuring the thickness of thin layers, in which a motor (34) is activated by a control arrangement (25), which moves a ram (23) up and down via a drive arrangement (35), wherein a retainer (24) is provided on the ram (23), to which retainer the measuring probe (26) can be fastened, in which a freewheel is activated between the drive arrangement (35) and the ram (33) as soon as the measuring probe (26) or retainer (23) is set down in the measuring position (32) on an item to be measured (14) and the movement of the drive arrangement (35) is decoupled from the vertical movement of the ram (23), wherein a movement speed of the at least one measuring probe (14) from the starting position (31) into the measuring position (32) is reduced by mechanical damping or electrical damping before the measuring position (32) is reached.
Abstract:
The invention relates to a measuring probe for measuring the thickness of thin layers with a housing (14), having at least one sensor element (17), which is received in the housing (14) at least slightly moveably along a longitudinal axis (16) and which comprises at least one winding device (44), which is allocated to the longitudinal axis (16), having a spherical positioning cap (21) facing the outer front face of the housing (14), said cap being arranged in the longitudinal axis (16), wherein the spherical positioning cap (21) has a basic body (55) that has a cylindrical core section (56) and a pol cap (58) arranged on a front face of the core section (56), wherein the winding device (44) is allocated to the spherical positioning cap (21), said winding device being formed from a discoidal or annular carrier (49) with at least one Archimedean coil (51) arranged thereon and with the basic body (55) consisting of a ferritic material and the pol cap consisting of a hard metal.
Abstract:
The invention relates to a measurement stand for holding a measuring probe intended in particular for measuring the thickness of thin layers, and to a method for controlling the measurement stand.
Abstract:
An optoelectronic semiconductor device includes an optoelectronic semiconductor layer sequence on a metal carrier element, which includes as a first component silver and as a second component a material having a lower coefficient of thermal expansion than silver, wherein the first and second components are intermixed in the metal carrier element.
Abstract:
The invention relates to a measurement stand for holding a measuring probe intended in particular for measuring the thickness of thin layers, and to a method for controlling the measurement stand.
Abstract:
The invention relates to a calibration standard, especially for the calibration of devices for the non-destructive measurement of the thickness of thin layers, with a carrier layer (12) consisting of a basic material and a standard (17) applied on the carrier layer (12), said standard having the thickness of the layer to be measured at which the device is to be calibrated, with the carrier layer (12) comprising a plane-parallel measuring surface (16) to its bearing surface (14), that the standard (17) comprises a bearing surface (18) plane-parallel with its measuring surface (19) for bearing on the measuring surface (16) of the carrier layer (12), and that the standard (17) is permanently provided on the carrier layer (12) by means of plating by rubbing.
Abstract:
The invention relates to a method for emitting measuring values on a display (27) for a display device. According to said method, the measuring values that are recorded by a measuring device (24) on at least one test object (11) are forwarded to a signal processing device; a measuring value is detected at each measuring point (14-21) on the test object (11), or a plurality of measuring values are detected at each measuring point (14-21) on the test object (11); the average value is determined at each measuring point (14-21), from the number of detected measuring values; the average values of the respective measuring points (14-21) on at least one test object (11) are sorted according to the rank thereof in an evaluation device comprising an electronic calculator; and said average values are represented on the display (27) together with an upper and a lower boundary line.
Abstract:
A memory module has a memory cell configuration. For the purpose of testing the memory cell configuration, the memory module has a test structure with at least two test circuits, which are disposed in a distributed fashion on the memory module and are connected to one another via a common test switching bus, which can be connected to an address bus of the memory module via a decoupling circuit during a test operation.