摘要:
Reactive silica particles capable of producing coatings exhibiting excellent scratch resistance, weather resistance, adhesiveness, and curability, while satisfying a wide spectrum of performances from transparency to semi-transparency and providing a glossy surface as well as a frosty surface. Reactive silica particles comprises silica particles and an organic compound chemically bonded to the silica particles via a silyloxy group, wherein the organic compound has a polymerizable unsaturated group, a group represented by the following formula (1), (wherein X is a group selected from —NH—, —O—, and —S— and Y is a group selected from oxygen and sulfur, provided that when X is —O—, Y is a sulfur atom), and a group represented by the following formula (2), (wherein Z is a group selected from oxygen and sulfur).
摘要:
Provided is a liquid curable resin composition which can produce transparent cured products with a high refractive index, high hardness, and superior abrasion resistance, and which can be suitably used as a coating material. The liquid curable resin composition comprises: (A) a poly-functional (meth)acrylic compound having at least three (meth) acryloyl groups in the molecule; (B) a reaction product obtained by the reaction of a compound having a polymerizable unsaturated group and alkoxysilyl group in the molecule and particles metal oxide, the metals being preferably selected from the group consisting of zirconium, antimony, zinc, tin, cerium, and titanium; and (C) a radiation polymerization initiator.
摘要:
A photocurable resin composition suitable for photo-fabrication. The resin composition capable of being promptly cured by photo-irradiation, thereby reducing fabricating time and providing cured products having excellent mechanical strength and minimized shrinkage during curing to ensure high dimensional accuracy. The composition includes (A) an oxetane compound, (B) an epoxy compound, and (C) a cationic photo-initiator.
摘要:
The present invention relates to a photocurable liquid resin composition comprising: (A) a cationically polymerizable organic compound; (B) a cationic photopolymerization initiator; (C) an ethylenically unsaturated monomer; (D) a radical photopolymerization initiator; (E) a polyether polyol compound having one or more hydroxyl groups in one molecule; and, optionally, includes elastomer particles having a specific particle diameter and/or an epoxy-branched alicyclic compound.
摘要:
A photo-curable resin composition suitable as a material for photo-fabricating and capable of producing cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The resin composition contains a monomer component containing (A) 30-70 wt % of a polyfunctional unsaturated monomer having a cyclic structure and (B) 70-30 wt % of a monofunctional unsaturated monomer having a cyclic structure of which the homopolymer has a glass transition temperature (Tg) of 70.degree. C. or higher; (C) a photo-initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler to 100 parts by volume of the monomer components and the photo-initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 100.degree. C. or higher.
摘要:
A photo-curable resin composition suitable as a material for optical molding. The composition can produce cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The composition contains a monomer component which contains (A) 20-80 wt % of a urethane-bond polyfunctional (meth)acrylate having a number average molecular weight of 1,000 or less and (B) 80-20 wt % of an ethylenically unsaturated monomer containing a cyclic structure and at least one ethylenically unsaturated bond in the molecule and of which the homopolymer has a glass transition temperature of 50.degree. C. or higher; (C) a photopolymerization initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler for 100 parts by volume of said monomer components and the photopolymerization initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 80.degree. C. or higher.