Reactive silica particles, process for manufacturing the same, use of the same
    51.
    发明授权
    Reactive silica particles, process for manufacturing the same, use of the same 有权
    活性二氧化硅颗粒,制造方法相同,使用相同

    公开(公告)号:US06528604B1

    公开(公告)日:2003-03-04

    申请号:US09645934

    申请日:2000-08-25

    IPC分类号: C08F3008

    摘要: Reactive silica particles capable of producing coatings exhibiting excellent scratch resistance, weather resistance, adhesiveness, and curability, while satisfying a wide spectrum of performances from transparency to semi-transparency and providing a glossy surface as well as a frosty surface. Reactive silica particles comprises silica particles and an organic compound chemically bonded to the silica particles via a silyloxy group, wherein the organic compound has a polymerizable unsaturated group, a group represented by the following formula (1), (wherein X is a group selected from —NH—, —O—, and —S— and Y is a group selected from oxygen and sulfur, provided that when X is —O—, Y is a sulfur atom), and a group represented by the following formula (2), (wherein Z is a group selected from oxygen and sulfur).

    摘要翻译: 能够产生耐刮擦性,耐候性,粘合性和固化性优异的涂层的活性二氧化硅颗粒,同时满足从透明度到半透明度的广泛性能,并提供光泽表面以及霜面。 活性二氧化硅颗粒包括二氧化硅颗粒和通过甲硅烷氧基化学键合到二氧化硅颗粒上的有机化合物,其中有机化合物具有可聚合不饱和基团,由下式(1)表示的基团(其中X是选自 -NH-,-O-和-S-,Y是选自氧和硫的基团,条件是当X是-O-,Y是硫原子)和由下式(2)表示的基团时, (其中Z为选自氧和硫的基团)。

    Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
    54.
    发明授权
    Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound 有权
    包含环氧支链脂环族化合物的光固化性液体树脂组合物

    公开(公告)号:US06287745B1

    公开(公告)日:2001-09-11

    申请号:US09252239

    申请日:1999-02-18

    IPC分类号: G03C908

    摘要: The present invention relates to a photocurable liquid resin composition comprising: (A) a cationically polymerizable organic compound; (B) a cationic photopolymerization initiator; (C) an ethylenically unsaturated monomer; (D) a radical photopolymerization initiator; (E) a polyether polyol compound having one or more hydroxyl groups in one molecule; and, optionally, includes elastomer particles having a specific particle diameter and/or an epoxy-branched alicyclic compound.

    摘要翻译: 本发明涉及一种光固化液体树脂组合物,其包含:(A)阳离子可聚合有机化合物; (B)阳离子光聚合引发剂; (C)烯属不饱和单体; (D)自由基光聚合引发剂; (E)在一个分子中具有一个或多个羟基的聚醚多元醇化合物; 并且任选地包括具有特定粒径的弹性体颗粒和/或环氧支链的脂环族化合物。

    Photo-curable resin composition and process for preparing resin-basedmold
    55.
    发明授权
    Photo-curable resin composition and process for preparing resin-basedmold 失效
    光固化树脂组合物和树脂基模制品的制备方法

    公开(公告)号:US5932625A

    公开(公告)日:1999-08-03

    申请号:US865676

    申请日:1997-05-30

    摘要: A photo-curable resin composition suitable as a material for photo-fabricating and capable of producing cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The resin composition contains a monomer component containing (A) 30-70 wt % of a polyfunctional unsaturated monomer having a cyclic structure and (B) 70-30 wt % of a monofunctional unsaturated monomer having a cyclic structure of which the homopolymer has a glass transition temperature (Tg) of 70.degree. C. or higher; (C) a photo-initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler to 100 parts by volume of the monomer components and the photo-initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 100.degree. C. or higher.

    摘要翻译: 适合作为光致制造材料的光固化性树脂组合物,能够制造具有优异的机械强度和高耐热性的固化物。 进一步公开了一种树脂基模具的成型方法,其提供优异的成型尺寸精度和极好的重复耐久性。 树脂组合物含有含有(A)30-70重量%的具有环状结构的多官能不饱和单体的单体成分,(B)70-30重量%具有均聚物具有玻璃的环状结构的单官能不饱和单体 转变温度(Tg)为70℃以上; (C)光引发剂; 和(D)平均粒径或平均纤维长度为1-50μm的无机填料,其中无机填料与100体积份单体组分和光引发剂的比例为100-160份 ,由光固化性树脂组合物制造的固化树脂的热变形温度为100℃以上。

    Photo-curable resin composition and process for preparing resin-based
mold
    56.
    发明授权
    Photo-curable resin composition and process for preparing resin-based mold 失效
    光固化树脂组合物和树脂基模具的制备方法

    公开(公告)号:US5874041A

    公开(公告)日:1999-02-23

    申请号:US865781

    申请日:1997-05-30

    CPC分类号: C08F222/1006

    摘要: A photo-curable resin composition suitable as a material for optical molding. The composition can produce cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The composition contains a monomer component which contains (A) 20-80 wt % of a urethane-bond polyfunctional (meth)acrylate having a number average molecular weight of 1,000 or less and (B) 80-20 wt % of an ethylenically unsaturated monomer containing a cyclic structure and at least one ethylenically unsaturated bond in the molecule and of which the homopolymer has a glass transition temperature of 50.degree. C. or higher; (C) a photopolymerization initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler for 100 parts by volume of said monomer components and the photopolymerization initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 80.degree. C. or higher.

    摘要翻译: 适合作为光学成型用材料的光固化性树脂组合物。 该组合物可以产生具有优异的机械强度和高耐热性的固化产物。 进一步公开了一种树脂基模具的成型方法,其提供优异的成型尺寸精度和极好的重复耐久性。 该组合物含有(A)20〜80重量%的数均分子量为1000以下的氨基甲酸酯键多官能(甲基)丙烯酸酯,(B)80〜20重量%的烯属不饱和单体 在分子中含有环状结构和至少一个烯属不饱和键,其均聚物的玻璃化转变温度为50℃以上; (C)光聚合引发剂; 和(D)平均粒径或平均纤维长度为1-50μm的无机填料,其中100体积份的所述单体成分和光聚合引发剂的无机填料的比例为100〜160份 由光固化型树脂组合物制造的固化树脂的体积,热变形温度为80℃以上。