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公开(公告)号：US11244937B2
公开(公告)日：2022-02-08
申请号：US16706799
申请日：2019-12-08
Applicant: Industrial Technology Research Institute
Inventor： Wei-Sheng Su , Chia-Hsin Chao , Mao-Chi Lin , Yen-Hsiang Fang , Li-Chun Huang , Ming-Hsien Wu
IPC: G09G3/32 , G02B5/08 , H01L25/16 , H01L23/498 , H01L23/544
Abstract: A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.
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公开(公告)号：US20210375982A1
公开(公告)日：2021-12-02
申请号：US17385954
申请日：2021-07-27
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
IPC: H01L27/15
Abstract: A display array including a semiconductor stacked layer, an insulating layer, a plurality of electrode pads, and a driving backplane is provided. The semiconductor stacked layer has a plurality of light emitting regions arranged along a reference plane. The insulating layer is disposed to an outer surface of the semiconductor stacked layer and contacts the semiconductor stacked layer. The insulating layer has a plurality of openings respectively corresponding to the plurality of light emitting regions. The electrode pads are disposed to the insulating layer and are respectively electrically connect the plurality of light emitting regions through the plurality of openings. The driving backplane is disposed to the semiconductor stacked layer and electrically connected to the plurality of electrode pads, wherein a light emitting material layer of the semiconductor stacked layer has consistency along an extension direction of the reference plane.
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公开(公告)号：US20210264180A1
公开(公告)日：2021-08-26
申请号：US17317899
申请日：2021-05-12
Applicant: Industrial Technology Research Institute
Inventor： Chia-Hsin Chao , Yen-Hsiang Fang , Ming-Hsien Wu
Abstract: A biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED). The image sensor is disposed on the substrate. The optical layer is disposed on the image sensor and includes a diffraction pattern. The IR LED is disposed on the diffraction pattern of the optical layer. The optical layer is located between the IR LED and the image sensor.
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公开(公告)号：US20190355785A1
公开(公告)日：2019-11-21
申请号：US16232069
申请日：2018-12-26
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
Abstract: A display array including a semiconductor stacked layer, an insulating layer, a plurality of electrode pads, and a driving backplane is provided. The semiconductor stacked layer has a plurality of light emitting regions. The insulating layer is disposed to an outer surface of the semiconductor stacked layer and contacts the semiconductor stacked layer. The insulating layer has a plurality of openings. The electrode pads are disposed to the insulating layer. The driving backplane is disposed to the semiconductor stacked layer. The electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane via the openings of the insulating layer to drive the light emitting regions. The electrode pads are located in the openings of the insulating layer and separated by the insulating layer, and the adjacent light emitting regions in the semiconductor stacked layer are not patterned.
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公开(公告)号：US20190285805A1
公开(公告)日：2019-09-19
申请号：US16430447
申请日：2019-06-04
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Yen-Hsiang Fang , Shih-Hao Wang , Yi-Chen Lin
IPC: G02B6/34 , G02B6/42 , H01S5/042 , H01S5/12 , G01J1/04 , G01J1/02 , H04B10/079 , H05K3/30 , G02B6/30 , G02B6/12
Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.
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Patent Agency Ranking
公开(公告)号：US20180032826A1
公开(公告)日：2018-02-01
申请号：US15730687
申请日：2017-10-11
Applicant: Industrial Technology Research Institute
Inventor： Chia-Hsin Chao , Yen-Hsiang Fang , Ming-Hsien Wu , Po-Hsun Wang
Abstract: A biometric device includes a substrate, an image sensor, at least one infrared light emitting diode (IR LED), a supporting structure and an optical layer. The image sensor is disposed on the substrate. The at least one IR LED is disposed on the substrate. The supporting structure is disposed on the substrate and located between the image sensor and the at least one infrared light emitting diode. The optical layer is disposed on the supporting structure, covers the image sensor, and includes a coded pattern.
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公开(公告)号：US20170162091A1
公开(公告)日：2017-06-08
申请号：US14979543
申请日：2015-12-28
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Yen-Hsiang Fang , Yao-Jun Tsai
CPC classification number: G09G3/006 , G09G3/32 , G09G2300/0439 , G09G2320/0233 , G09G2320/0295 , G09G2330/08 , G09G2330/10 , H01L27/156 , H01L33/38 , H01L2224/11
Abstract: A display pixel suitable for being arranged on a carrier is provided. The display pixel includes a plurality of light-emitting diode chips. The light-emitting diode chips are disposed on and electrically connected to the carrier. Each of the light-emitting diode chips respectively serves as a sub-pixel and includes a semiconductor device layer, and the semiconductor device layer includes a display light-emitting mesa and at least one redundant light-emitting mesa. During a period of driving each of the light-emitting diode chips, one of the display light-emitting mesa and the at least one redundant light-emitting mesa in each of the light-emitting diode chips is capable of emitting light. A display panel including a plurality of the display pixels mentioned above is also provided.
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公开(公告)号：US20170032203A1
公开(公告)日：2017-02-02
申请号：US15221615
申请日：2016-07-28
Applicant: Industrial Technology Research Institute
Inventor： Chia-Hsin Chao , Yen-Hsiang Fang , Ming-Hsien Wu
Abstract: A biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED). The image sensor is disposed on the substrate. The optical layer is disposed on the image sensor and includes a diffraction pattern. The IR LED is disposed on the diffraction pattern of the optical layer. The optical layer is located between the IR LED and the image sensor.
Abstract translation: 生物测定装置包括基板，图像传感器，光学层和至少一个红外发光二极管（IR LED）。 图像传感器设置在基板上。 光学层设置在图像传感器上并且包括衍射图案。 IR LED设置在光学层的衍射图案上。 光学层位于红外LED和图像传感器之间。
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59.发明申请公开(公告)号：US20160268491A1
公开(公告)日：2016-09-15
申请号：US15060616
申请日：2016-03-04
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Yen-Hsiang Fang
CPC classification number: H01L22/20 , H01L24/75 , H01L24/81 , H01L33/0079 , H01L33/0095
Abstract: A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.
Abstract translation: 电子设备的拾取和放置过程包括：在载体上形成阵列排列的多个电子器件，其中具有导电图案的第一导电层设置在每个电子器件和载体之间，宽度 的电子装置大于相应的导电图案; 通过拾取和放置模块有选择地从载体上拾取电子装置的部分和相应的第一导电层; 以及通过拾取和放置模块将电子设备的部件和相应的第一导电层放置在目标衬底上。 还提供电子模块。
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公开(公告)号：US20160172536A1
公开(公告)日：2016-06-16
申请号：US14583775
申请日：2014-12-29
Applicant: Industrial Technology Research Institute
Inventor： Chia-Lung Tsai , Yen-Hsiang Fang , Pao-Chu Tzeng
CPC classification number: H01L33/40
Abstract: A semiconductor light-emitting structure including a first-type doped semiconductor layer, a second-type doped semiconductor layer, a light-emitting layer, a first electrode, a second electrode, and a magnetic layer is provided. The light-emitting layer is disposed between the first-type doped semiconductor layer and the second-type doped semiconductor layer. The first electrode is electrically connected to the first-type doped semiconductor layer, and the second electrode is electrically connected to the second-type doped semiconductor layer. The magnetic layer connects the first electrode and the first-type doped semiconductor layer. At least a portion of the magnetic layer is magnetic, and the bandgap of at least another portion of the magnetic layer is greater than 0 eV and is less than or equal to 5 eV. The material of the magnetic layer includes metal, metal oxide, or a combination thereof.
Abstract translation: 提供了包括第一掺杂半导体层，第二掺杂半导体层，发光层，第一电极，第二电极和磁性层的半导体发光结构。 发光层设置在第一掺杂半导体层和第二掺杂半导体层之间。 第一电极电连接到第一掺杂半导体层，第二电极与第二掺杂半导体层电连接。 磁性层连接第一电极和第一掺杂半导体层。 磁性层的至少一部分是磁性的，并且磁性层的至少另一部分的带隙大于0eV且小于或等于5eV。 磁性层的材料包括金属，金属氧化物或其组合。
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