公开(公告)号：US20190165250A1

公开(公告)日：2019-05-30

申请号：US16097600

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Thomas L. SOUNART ,  Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Shawna M. LIFF ,  Johanna M. SWAN

IPC: H01L41/09 ,  H01L41/113 ,  B81B3/00 ,  G01L9/00

Abstract: Embodiments of the invention include a pressure sensing device having a membrane that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material positioned in proximity to the membrane, and an electrode in contact with the piezoelectric material. The membrane deflects in response to a change in ambient pressure and this deflection causes a voltage to be generated in the piezoelectric material with this voltage being proportional to the change in ambient pressure.

公开(公告)号：US20190121038A1

公开(公告)日：2019-04-25

申请号：US16098406

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Johanna M. SWAN ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Feras EID ,  Baris BICEN ,  Thomas L. SOUNART ,  Shawna M. LIFF ,  Valluri R. RAO

IPC: G02B6/42

Abstract: Embodiments of the invention include an optoelectronic package that allows for in situ alignment of optical fibers. In an embodiment, the optoelectronic package may include an organic substrate. Embodiments include a cavity formed into the organic substrate. Additionally, the optoelectronic package may include an actuator formed on the organic substrate that extends over the cavity. In one embodiment, the actuator may include a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer. According to an additional embodiment of the invention, the actuator may include a first portion and a second portion. In order to allow for resistive heating and actuation driven by thermal expansion, a cross-sectional area of the first portion of the beam may be greater than a cross-sectional area of the second portion of the beam.

公开(公告)号：US20190033576A1

公开(公告)日：2019-01-31

申请号：US16072161

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Feras EID ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Shawna M. LIFF ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/08 ,  H01L41/09 ,  H01L41/253

Abstract: Embodiments of the invention include a display formed on an organic substrate and methods of forming such a device. According to an embodiment, an array of pixel mirrors may be formed on the organic substrate. For example, each of the pixel mirrors is actuatable about one or more axes out of the plane of the organic substrate. Additionally, embodiments of the invention may include an array of routing mirrors formed on the organic substrate. According to an embodiment, each of the routing mirrors is actuatable about two axes out of the plane of the organic substrate. In embodiments of the invention, a light source may be used for emitting light towards the array of routing mirrors. For example, light emitted from the light source may be reflected to one or more of the pixel mirrors by one of the routing mirrors.

公开(公告)号：US20190033575A1

公开(公告)日：2019-01-31

申请号：US16072157

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Feras EID ,  Johanna M. SWAN ,  Shawna M. LIFF ,  Aleksandar ALEKSOV ,  Thomas L. SOUNART ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/08 ,  H01L41/047 ,  H01L41/27 ,  H01L41/332 ,  H01L41/314

Abstract: Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.

公开(公告)号：US20190032272A1

公开(公告)日：2019-01-31

申请号：US16072165

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Feras EID ,  Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Baris BICEN ,  Thomas L. SOUNART ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: D06M10/06 ,  D06M11/46 ,  D06M11/47 ,  H01L41/29 ,  H01L41/316 ,  H01L41/187 ,  H01L41/047

Abstract: Embodiments of the invention include an active fiber with a piezoelectric layer that has a crystallization temperature that is greater than a melt or draw temperature of the fiber and methods of forming such active fibers. According to an embodiment, a first electrode is formed over an outer surface of a fiber. Embodiments may then include depositing a first amorphous piezoelectric layer over the first electrode. Thereafter, the first amorphous piezoelectric layer may be crystallized with a pulsed laser annealing process to form a first crystallized piezoelectric layer. In an embodiment, the pulsed laser annealing process may include exposing the first amorphous piezoelectric layer to radiation from an excimer laser with an energy density between approximately 10 and 100 mJ/cm2 and pulse width between approximately 10 and 50 nanoseconds. Embodiments may also include forming a second electrode over an outer surface of the crystallized piezoelectric layer.

公开(公告)号：US20180097458A1

公开(公告)日：2018-04-05

申请号：US15283117

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Feras EID ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H02N2/02 ,  H01L41/09 ,  H01L41/187 ,  H01L41/18

CPC classification number: H02N2/023 ,  G01J3/42 ,  H01L27/20 ,  H02N2/025 ,  H02N2/026 ,  H02N2/101

Abstract: Embodiments of the invention include a self-propelled sensor system. In an embodiment, the self-propelled sensor system includes a piezoelectrically actuated motor that is integrated with a substrate. In an embodiment, the self-propelled sensor system may also include a sensor and an integrated circuit electrically coupled to the piezoelectrically actuated motor. Embodiments of the invention may also include self-propelled sensor systems that include plurality of piezoelectrically actuated motors. In an embodiment the piezoelectrically actuated motors may be one or more different types of motors including, but not limited to, stick and slip motors, inchworm stepping motors, standing acoustic wave motors, a plurality of piezoelectrically actuated cantilevers, and a piezoelectrically actuated diaphragm. Additional embodiments of the invention may include a plurality of self-propelled sensor systems that are communicatively coupled to form a sensor mesh.

公开(公告)号：US20180007796A1

公开(公告)日：2018-01-04

申请号：US15201323

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： John J. BROWNE ,  Andrew MACLEAN ,  Shawna M. LIFF

IPC: H05K3/34

CPC classification number: H05K3/34 ,  G06F13/00 ,  H05K1/0293 ,  H05K1/141 ,  H05K2201/0305 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10212 ,  H05K2203/1115 ,  H05K2203/173

Abstract: Techniques and mechanisms for controlling configurable circuitry including an antifuse. In an embodiment, the antifuse is disposed in or on a substrate, the antifuse configured to form a solder joint to facilitate interconnection of circuit components. Control circuitry to operate with the antifuse is disposed in, or at a side of, the same substrate. The antifuse is activated based on a voltage provided at an input node, where the control circuitry automatically transitions through a pre-determined sequence of states in response to the voltage. The pre-determined sequence of states coordinates activation of one or more fuses and switched coupling one or more circuit components to the antifuse. In another embodiment, multiple antifuses, variously disposed in or on the substrate, are configured each to be activated based on the voltage provided at an input node.

公开(公告)号：US20180006208A1

公开(公告)日：2018-01-04

申请号：US15199894

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01L41/113 ,  G06F1/16 ,  H01L41/16

CPC classification number: H01L41/1136 ,  B81B2201/0235 ,  B81B2207/012 ,  B81C1/00476 ,  G06F1/1633 ,  G06F1/1694 ,  G06F2200/1637 ,  H01L41/1132 ,  H01L41/16

Abstract: Embodiments of the invention include a sensing device that includes a base structure having a proof mass that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. The proof mass deflects in response to application of an external force or acceleration and this deflection causes a stress in the piezoelectric material which generates a voltage differential between the first and second electrodes.

公开(公告)号：US20180004357A1

公开(公告)日：2018-01-04

申请号：US15199906

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Adel A. ELSHERBINI ,  Feras EID ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Shawna M. LIFF

IPC: G06F3/043 ,  H03H9/25 ,  G06F3/041

CPC classification number: G06F3/0436 ,  G06F3/0416 ,  H01L2924/15311 ,  H01L2924/181 ,  H03H9/25 ,  H01L2924/00012

Abstract: Embodiments of the invention include an acoustic sensing device having a piezoelectric transmit transducer to receive input electrical signals and to generate a surface acoustic wave to be transmitted along a surface of the sensing device which is integrated with an organic substrate. The sensing device also includes a piezoelectric receive transducer to receive the surface acoustic wave and to generate output electrical signals and an input region integrated with the organic substrate. The input region is capable of receiving input which changes an acoustic amplitude of the surface acoustic wave.

公开(公告)号：US20180001640A1

公开(公告)日：2018-01-04

申请号：US15199899

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Feras EID ,  Shawna M. LIFF ,  Sasha N. OSTER ,  Thomas L. SOUNART ,  Georgios C. DOGIAMIS ,  Adel A. ELSHERBINI ,  Johanna M. SWAN

IPC: B41J2/14

CPC classification number: B41J2/14298 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2002/14266 ,  B41J2202/13

Abstract: Embodiments of the invention include a piezoelectric package integrated jet device. In one example, the jet device includes a vibrating membrane positioned between first and second cavities of an organic substrate, a piezoelectric material coupled to the vibrating membrane which acts as a first electrode, and a second electrode in contact with the piezoelectric material. The vibrating membrane generates fluid flow through an orifice in response to application of an electrical signal between the first and second electrodes.