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公开(公告)号:US11049882B2
公开(公告)日:2021-06-29
申请号:US16743080
申请日:2020-01-15
Applicant: Japan Display Inc.
Inventor: Isao Suzumura , Kazufumi Watabe , Yoshinori Ishii , Hidekazu Miyake , Yohei Yamaguchi
IPC: H01L27/12 , H01L27/32 , H01L29/786 , H01L29/51 , H01L29/24 , G02F1/1368 , G02F1/133 , G02F1/1362 , H01L29/417 , H01L29/423 , H01L29/49
Abstract: The object of the present invention is to make it possible to form an LTPS TFT and an oxide semiconductor TFT on the same substrate. A display device includes a substrate having a display region in which pixels are formed. The pixel includes a first TFT using an oxide semiconductor 109. An oxide film 110 as an insulating material is formed on the oxide semiconductor 109. A gate electrode 111 is formed on the oxide film 110. A first electrode 115 is connected to a drain of the first TFT via a first through hole formed in the oxide film 110. A second electrode 116 is connected to a source of the first TFT via a second through hole formed in the oxide film 110.
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公开(公告)号:US20180364509A1
公开(公告)日:2018-12-20
申请号:US16109834
申请日:2018-08-23
Applicant: Japan Display Inc.
Inventor: Yohei Yamaguchi , Arichika Ishida , Hidekazu Miyake , Hiroto Miyake , Isao Suzumura
IPC: G02F1/1368 , G02F1/1343 , G02F1/1362 , H01L27/12 , H01L29/786 , H01L29/423
CPC classification number: G02F1/1368 , G02F1/134309 , G02F1/13439 , G02F1/136209 , G02F1/136227 , G02F2001/136218 , G02F2001/13685 , G02F2202/10 , H01L27/1225 , H01L29/42384 , H01L29/78633 , H01L29/7869
Abstract: According to one embodiment, a display device includes an insulating substrate, a thin-film transistor including a semiconductor layer formed on a layer above the insulating substrate, a gate electrode which at least partly overlaps the semiconductor layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer, and a light shielding layer formed between the thin-film transistor and the insulating substrate to at least partly overlap the semiconductor layer, the light shielding layer electrically connected to the gate electrode.
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公开(公告)号:US10088728B2
公开(公告)日:2018-10-02
申请号:US15662385
申请日:2017-07-28
Applicant: Japan Display Inc.
Inventor: Yohei Yamaguchi , Arichika Ishida , Hidekazu Miyake , Hiroto Miyake , Isao Suzumura
IPC: G02F1/1362 , H01L29/786 , H01L27/12 , G02F1/1368 , G02F1/1343 , H01L29/423
Abstract: According to one embodiment, a display device includes an insulating substrate, a thin-film transistor including a semiconductor layer formed on a layer above the insulating substrate, a gate electrode which at least partly overlaps the semiconductor layer, and a first electrode and a second electrode which are electrically connected to the semiconductor layer, and a light shielding layer formed between the thin-film transistor and the insulating substrate to at least partly overlap the semiconductor layer, the light shielding layer electrically connected to the gate electrode.
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公开(公告)号:US10026754B2
公开(公告)日:2018-07-17
申请号:US15585401
申请日:2017-05-03
Applicant: Japan Display Inc.
Inventor: Isao Suzumura , Kazufumi Watabe , Yoshinori Ishii , Hidekazu Miyake , Yohei Yamaguchi
IPC: H01L27/12 , H01L29/786 , H01L29/51 , H01L29/24 , G02F1/1368 , G02F1/133 , G02F1/1362 , H01L29/417 , H01L29/423 , H01L29/49 , H01L27/32
Abstract: The object of the present invention is to make it possible to form an LIPS TFT and an oxide semiconductor TFT on the same substrate. A display device includes a substrate having a display region in which pixels are formed. The pixel includes a first TFT using an oxide semiconductor 109. An oxide film 110 as an insulating material is formed on the oxide semiconductor 109. A gate electrode 111 is formed on the oxide film 110. A first electrode 115 is connected to a drain of the first TFT via a first through hole formed in the oxide film 110. A second electrode 116 is connected to a source of the first TFT via a second through hole formed in the oxide film 110.
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公开(公告)号:US09964824B2
公开(公告)日:2018-05-08
申请号:US14793106
申请日:2015-07-07
Applicant: Japan Display Inc.
Inventor: Isao Suzumura , Arichika Ishida , Norihiro Uemura , Hidekazu Miyake , Hiroto Miyake , Yohei Yamaguchi
IPC: G09G3/36 , G02F1/1368 , G02F1/1333 , G02F1/1362 , H01L27/12
CPC classification number: G02F1/1368 , G02F1/133345 , G02F1/136227 , H01L27/1288
Abstract: According to one embodiment, a display device includes a TFT on an insulating substrate. The TFT includes a gate electrode, an insulating layer on the gate electrode, a semiconductor layer on the insulating layer, and a source electrode and a drain electrode each provided in contact with at least a part of the semiconductor layer. The source and drain electrodes have a laminated structure including a lower layer, an intermediate layer and an upper layer. The source and drain electrodes include sidewalls each including a first tapered portion on the upper layer side, a second tapered portion on the lower layer side and a sidewall protective film attached to the second tapered portion. The taper angle of the first tapered portion is smaller than that of the second tapered portion.
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56.
公开(公告)号:US09391213B2
公开(公告)日:2016-07-12
申请号:US14245102
申请日:2014-04-04
Applicant: Japan Display Inc.
Inventor: Isao Suzumura , Norihiro Uemura , Takeshi Noda , Hidekazu Miyake , Yohei Yamaguchi
IPC: H01L29/786 , H01L27/12
CPC classification number: H01L29/78696 , G02F1/133345 , G02F1/133512 , G02F1/133514 , G02F1/1337 , G02F1/134309 , G02F1/1368 , G02F2001/133357 , H01L27/1225 , H01L27/1285 , H01L29/24 , H01L29/78606 , H01L29/78618 , H01L29/78633 , H01L29/7869 , H01L29/78693
Abstract: In a bottom gate thin film transistor using a first oxide semiconductor layer as a channel layer, the first oxide semiconductor layer and second semiconductor layers include In and O. An (O/In) ratio of the second oxide semiconductor layers is equal to or larger than that of the first oxide semiconductor layer, and a film thickness thereof is thicker than that of the first oxide semiconductor layer.
Abstract translation: 在使用第一氧化物半导体层作为沟道层的底栅极薄膜晶体管中,第一氧化物半导体层和第二半导体层包括In和O.第二氧化物半导体层的(O / In)比等于或大于 比第一氧化物半导体层的厚度厚,其厚度比第一氧化物半导体层厚。
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