摘要:
A method for detecting defects on a specimen includes mounting a specimen on a table with which is movable, obliquely projecting a laser as a line onto a surface of the specimen, detecting with an image sensor an image of light formed by light reflected from the specimen and passed through a filter which blocks scattered light resulting from repetitive patterns formed on the specimen, processing a signal outputted from the image sensor to extract defects of the specimen, and a displaying information of defects extracted by the signal processor.
摘要:
A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.
摘要:
A method for recording information on a rewritable recording medium includes recording synchronizing signal information in a synchronizing signal portion on the medium, recording data information in a data portion of the medium after the synchronizing signal portion by forming marks in the data portion, and substantially randomly inverting the marks and spaces between the marks each time the information is recorded. The marks for particular areas of the medium are different in a physical property from other areas of the medium and data information is recorded in association with both ends of each of the marks. Upon rewriting of at least the recorded synchronizing signal information, a length of the synchronizing signal portion changes and a start position of the synchronizing signal portion changes, and wherein a change of the synchronizing signal information start position is smaller than a change of the length of the synchronizing signal portion.
摘要:
A method and a system for processing a semiconductor device intended to improve the overlay accuracy of a semiconductor device product, particularly in its device area, in carrying out the mix-and-match exposure process are designed to calculate the difference of exposure distortions between two layers in the device area and the difference of exposure distortions between the two layers at the overlay measurement mark position from data of exposure field distortions of two exposure tools used for the mix-and-match exposure process and data of device area and overlay measurement mark position of the product, calculate a modification value which relates both differences to each other, calculate a first exposure condition correction value from the measurement result of overlay, and carry out the exposure process based on a second exposure condition correction value which is evaluated by modifying the first exposure condition correction value with the modification value.
摘要:
A system for manufacturing a semiconductor device which predicts a difference in registration error between a circuit pattern and an overlay mark from a pattern dimension, illumination conditions and the wave aberration of an exposure lens, feeds a correction value based on the predicted difference back to an exposure device and modifies an overlay inspection data control limit.
摘要:
A reticle inspecting apparatus for inspecting a reticle for defects has a transparent of translucent substrate, a circuit pattern formed on the front surface of the substrate, and a phase shifter formed of a light-transmissive film on the front surface of the substrate. In the apparatus, a detection optical system is disposed so as not to gather directly reflected light and directly transmitted light and so as to gather scattered light and diffracted light which has been scattered and diffracted, respectively, by the reticle. This detection optical system enables separation of the gathered light by direction of illumination using detectors and spatial filters disposed respectively on Fourier transform planes to intercept light diffracted by straight edges of the circuit pattern, so as to form images of gathered light on the detectors. A signal processing system having a signal processing unit calculates defects on the basis of the output signals of the detectors and displays the calculated data on a display.
摘要:
A process for producing an aromatic acylation product from an aromatic compound, an olefin and carbon monoxide, which comprises the steps of:(a) reacting an olefin with carbon monoxide in the presence of hydrogen fluoride and boron trifluoride at a pressure of not more than 100 kg/cm.sup.2 G to prepare an acyl fluoride synthesis solution,(b) allowing the acyl fluoride synthesis solution to absorb boron trifluoride to form a complex of acyl fluoride and boron trifluoride,(c) subjecting an aromatic compound to an acylation reaction with a reaction mixture containing the complex of acyl fluoride and boron trifluoride, obtained in the step (b), to form a complex of boron trifluoride, hydrogen fluoride and an aromatic acylation compound, provided that the amount of the acyl fluoride in the complex of acyl fluoride and boron trifluoride is less than 1 mole per mole of the aromatic compound, and(d) separating the aromatic acylation compound from the complex formed in the step (c) by heating a reaction mixture obtained in the step (c).
摘要:
In inspecting a substrate having a transparent oxide film or a metal film formed on a surface thereof by using a dark field type inspection apparatus installing a laser light source, an illuminating beam having a high coherence causes variations in reflection strength due to multiple interferences within the transparent oxide film or an interference of scattered beams due to the surface roughness of the metal film occurs and which leads to degradation in the sensitivity of defect detection. The present invention solves the problem by providing a low-coherence but high-brightness illumination using a highly directive broadband light source, and a system in which the conventional laser light source is simultaneously employed to selectively use the light sources, thereby enabling a highly sensitive inspection according to the condition of a wafer.
摘要:
To prevent overlooking of a defect due to reduction in a defect signal, a defect inspection device is configured such that: light is irradiated onto an object to be inspected on which a pattern is formed; reflected, diffracted, and scattered light generated from the object by the irradiation of the light is collected, such that a first optical image resulting from the light passed through a first spatial filter having a first shading pattern is received by a first detector, whereby a first image is obtained; the reflected, diffracted, and scattered light generated from the object is collected, such that a second optical image resulting from the light passed through a second spatial filter having a second shading pattern is received by a second detector, whereby a second image is obtained; and the first and second images thus obtained are processed integrally to detect a defect candidate(s).
摘要:
In inspecting a substrate having a transparent oxide film or a metal film formed on a surface thereof by using a dark field type inspection apparatus installing a laser light source, an illuminating beam having a high coherence causes variations in reflection strength due to multiple interferences within the transparent oxide film or an interference of scattered beams due to the surface roughness of the metal film occurs and which leads to degradation in the sensitivity of defect detection. The present invention solves the problem by providing a low-coherence but high-brightness illumination using a highly directive broadband light source, and a system in which the conventional laser light source is simultaneously employed to selectively use the light sources, thereby enabling a highly sensitive inspection according to the condition of a wafer.