公开(公告)号：US07906173B2

公开(公告)日：2011-03-15

申请号：US11549826

申请日：2006-10-16

申请人： Kousuke Yoshihara ,  Tomohiro Iseki

发明人： Kousuke Yoshihara ,  Tomohiro Iseki

IPC分类号： B05D3/12

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then reduces a rotational speed of the target substrate to a second rotational speed lower than the first rotational speed, reduces the rotational speed of the target substrate to a third rotational speed lower than the second rotational speed or until rotational halt to adjust the film thickness of the resist solution, and accelerates the rotation of the target substrate to a fourth rotational speed higher than the third rotational speed to spin off a residue of the resist solution.

摘要翻译： 抗蚀剂涂布方法在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后将目标基板的转速降低到低于第一转速的第二转速 将目标基板的旋转速度降低到低于第二旋转速度的第三旋转速度，或者直到旋转停止，以调整抗蚀剂溶液的膜厚度，并且将目标基板的旋转加速至高于 第三旋转速度以分离抗蚀剂溶液的残留物。

公开(公告)号：US20090246397A1

公开(公告)日：2009-10-01

申请号：US12408262

申请日：2009-03-20

申请人： Kousuke Yoshihara ,  Kentaro Yoshihara

发明人： Kousuke Yoshihara ,  Kentaro Yoshihara

IPC分类号： B05D3/00 ,  B05C9/00 ,  B05C11/00

CPC分类号： G03F7/162 ,  H01L21/6715

摘要： The present invention is a resist solution supply apparatus for supplying a resist solution to a coating nozzle for discharging the resist solution to a substrate, including: a resist solution supply source storing the resist solution therein; a supply tube for supplying the resist solution from the resist solution supply source to the coating nozzle; a heating means provided on a side of the resist solution supply source along the supply tube for heating the resist solution in the supply tube to a predetermined temperature higher than room temperature; and a cooling means provided on a side of the coating nozzle along the supply tube for cooling the resist solution in the supply tube down to room temperature.

摘要翻译： 本发明是一种用于将抗蚀剂溶液供应到用于将抗蚀剂溶液排放到基底的涂布喷嘴的抗蚀剂溶液供给装置，包括：将抗蚀剂溶液存储在其中的抗蚀剂溶液供给源; 供给管，用于将抗蚀剂溶液从抗蚀剂溶液供给源供给到涂布喷嘴; 沿着供给管设置在抗蚀剂溶液供给源侧的加热装置，用于将供应管中的抗蚀剂溶液加热到高于室温的预定温度; 以及冷却装置，其沿着供给管设置在涂料喷嘴的一侧，用于将供应管中的抗蚀剂溶液冷却至室温。

公开(公告)号：US07208066B2

公开(公告)日：2007-04-24

申请号：US10649780

申请日：2003-08-28

申请人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

发明人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

IPC分类号： C23F1/00 ,  H01L21/306 ,  B05C11/00

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778 ,  Y10T29/41

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

摘要翻译： 在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。 在各个区域的底部设置用于各区域的排气的排气管。 通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

公开(公告)号：US08496991B2

公开(公告)日：2013-07-30

申请号：US13236750

申请日：2011-09-20

申请人： Kousuke Yoshihara ,  Tomohiro Iseki

发明人： Kousuke Yoshihara ,  Tomohiro Iseki

IPC分类号： B05D3/12

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： The present invention supplies a solvent to a front surface of a substrate while rotating the substrate. The substrate is acceleratingly rotated to a first number of rotations, and a resist solution is supplied to a central portion of the substrate during the accelerating rotation and the rotation at a first number of rotations. The substrate is deceleratingly rotated to a second number of rotations, and after the number of rotations of the substrate reaches the second number of rotations, the resist solution is discharged to the substrate. The substrate is then acceleratingly rotated to a third number of rotations higher than the second number of rotations so that the substrate is rotated at the third number of rotations. According to the present invention, consumption of the resist solution can be suppressed and a high in-plane uniformity can be obtained for the film thickness of the resist film.

摘要翻译： 本发明在旋转基板的同时将溶剂供给到基板的前表面。 基板被加速旋转到第一转数，并且在加速旋转期间以及以第一转数旋转时，将抗蚀剂溶液供应到基板的中心部分。 基板减速旋转到第二转数，并且在基板的转数达到第二转数之后，将抗蚀剂溶液排出到基板。 然后将衬底加速旋转到高于第二转数的第三转数，使得衬底以第三转数旋转。 根据本发明，可以抑制抗蚀剂溶液的消耗，并且可以获得抗蚀剂膜的膜厚度的高的面内均匀性。

公开(公告)号：US08480319B2

公开(公告)日：2013-07-09

申请号：US13221072

申请日：2011-08-30

申请人： Shinichi Hayashi ,  Yuichi Douki ,  Akira Miyata ,  Yuuichi Yamamoto ,  Kousuke Yoshihara ,  Nobuaki Matsuoka ,  Suguru Enokida

发明人： Shinichi Hayashi ,  Yuichi Douki ,  Akira Miyata ,  Yuuichi Yamamoto ,  Kousuke Yoshihara ,  Nobuaki Matsuoka ,  Suguru Enokida

IPC分类号： G03D5/00

CPC分类号： H01L21/6715 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67745

摘要： A process block is formed by arranging a heating-process related block on the side of a carrier block, a group of liquid-process related unit blocks, and a heating block on the side of an interface block, in this order from the side of the carrier block to the side of the interface block. The group of liquid-process related unit blocks is composed of: a group of unit blocks for coating films that is formed by stacking upward a unit block for an antireflection film, a unit block for a resist film, and a unit block for an upper layer film, in this order; and unit blocks for developing that are stacked on one another in the up and down direction with respect to the group of unit blocks for coating films. Liquid process modules of each of the liquid-process related unit blocks are arranged on the right and left sides of a transfer path for a substrate.

摘要翻译： 通过在接口块的侧面上的载体块，一组液体处理相关单元块和加热块的侧面上布置加热处理相关块来形成处理块，从侧面 载波块到接口块的一侧。 一组液相处理相关单元块由以下组成：一组用于涂覆膜的单元块，其通过向上堆叠用于抗反射膜的单元块，用于抗蚀剂膜的单元块和用于上部的单元块 层膜，按顺序; 以及用于显影的单元块相对于用于涂膜的单元块组在上下方向上彼此堆叠。 每个液体处理相关单元块的液体处理模块布置在用于基板的传送路径的右侧和左侧。

公开(公告)号：US20120021611A1

公开(公告)日：2012-01-26

申请号：US13181565

申请日：2011-07-13

申请人： Kousuke Yoshihara ,  Shinichi Hatakeyama

发明人： Kousuke Yoshihara ,  Shinichi Hatakeyama

IPC分类号： H01L21/31 ,  B05C11/08

CPC分类号： H01L21/6715

摘要： A coating treatment method includes: a first step of rotating a substrate at a first rotation number; a second step of rotating the substrate at a second rotation number being slower than the first rotation number; a third step of rotating the substrate at a third rotation number being faster than the second rotation number and slower than the first rotation number; a fourth step of rotating the substrate at a fourth rotation number being slower than the third rotation number; and a fifth step of rotating the substrate at a fifth rotation number being faster than the fourth rotation number. A supply of a coating solution to a central portion of the substrate is continuously performed from the first step to a middle of the second step or during the first step, and the fourth rotation number is more than 0 rpm and 500 rpm or less.

摘要翻译： 一种涂布处理方法，包括：以第一转数旋转基板的第一工序; 第二步骤，以比第一转数慢的第二转数旋转衬底; 第三步骤，以比所述第二转数快并且慢于所述第一转数的第三转数旋转所述衬底; 第四步骤，以比第三转数慢的第四转数旋转衬底; 以及以比第四转数快的第五转数旋转衬底的第五步骤。 从第一步骤到第二步骤的中间或第一步骤期间，连续地向基材的中心部分供给涂布液，第四转数大于0rpm，500rpm以下。

公开(公告)号：US07820243B2

公开(公告)日：2010-10-26

申请号：US11549793

申请日：2006-10-16

申请人： Kousuke Yoshihara ,  Tomohiro Iseki

发明人： Kousuke Yoshihara ,  Tomohiro Iseki

IPC分类号： B05D3/12

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.

摘要翻译： 抗蚀剂涂布方法在以第一旋转速度旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后将基板的旋转减速到低于第一转速的第二转速，或 直到旋转停止，随着转速变得更接近于第二转速或转动停止，减速步骤中的减速度变小，并且将基板的旋转加速到高于第二转速的第三转速，以使其脱离 抗蚀剂溶液的残留物。

公开(公告)号：US20070071890A1

公开(公告)日：2007-03-29

申请号：US11501740

申请日：2006-08-10

申请人： Kousuke Yoshihara ,  Hiroichi Inada

发明人： Kousuke Yoshihara ,  Hiroichi Inada

IPC分类号： B05D3/12 ,  B05C11/02 ,  B05B15/04 ,  B05C11/00

CPC分类号： H01L21/67051 ,  G03F7/162 ,  H01L21/6715

摘要： There is provided an apparatus including: a processing cup having an opening opened upward to allow a substrate to be loaded and unloaded, an exhaust port for exhausting an unnecessary atmosphere produced in forming a film applied on the substrate, and an aspiration port for aspirating external air; and an aspiration device aspirating the unnecessary atmosphere through the exhaust port, wherein when the substrate is accommodated in the opening of the processing cup, the substrate has a perimeter spaced from the opening by a predetermined gap, and below the substrate accommodated in the processing cup there is formed an exhaust flow path extending from the aspiration port to the exhaust port.

摘要翻译： 提供了一种装置，包括：处理杯，其具有向上开口以允许衬底被装载和卸载的开口;排出端口，用于排出在形成施加在衬底上的膜时产生的不必要的气氛;以及抽吸端口，用于吸入外部 空气; 以及抽吸装置，其通过所述排气口吸入不需要的气氛，其中当所述基板容纳在所述加工杯的开口中时，所述基板具有与所述开口间隔开预定间隙的周边，并且在容纳在所述加工杯中的所述基板的下方 形成从抽吸口向排气口延伸的排气流路。

公开(公告)号：US06869640B2

公开(公告)日：2005-03-22

申请号：US10162606

申请日：2002-06-06

申请人： Kousuke Yoshihara ,  Yuichi Terashita

发明人： Kousuke Yoshihara ,  Yuichi Terashita

IPC分类号： H01L21/203 ,  B05D1/00 ,  B05D3/10 ,  G03F7/16 ,  H01L21/00 ,  B05D1/36 ,  B05D3/12

CPC分类号： H01L21/6715 ,  B05D1/005 ,  B05D3/104 ,  G03F7/162

摘要： A coating film is formed by the steps of supplying a mixture of a solvent for dissolving a coating liquid and a volatilization suppressing substance for suppressing the volatilization of the solvent onto the surface of the target substrate W, expanding the mixture onto the entire surface of the target substrate W, and supplying a coating liquid onto substantially the central portion of the target substrate W that has received the mixture while rotating the target substrate W thereby expanding the coating liquid outward in the radial direction of the target substrate W thereby forming a coating film.

公开(公告)号：US08691336B2

公开(公告)日：2014-04-08

申请号：US13069522

申请日：2011-03-23

申请人： Kousuke Yoshihara ,  Katsunori Ichino

发明人： Kousuke Yoshihara ,  Katsunori Ichino

IPC分类号： B05D3/12 ,  G06F19/00

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A coating treatment method includes: a first step of discharging a coating solution from a nozzle to a central portion of a substrate while acceleratingly rotating the substrate, to apply the coating solution over the substrate; a second step of then decelerating the rotation of the substrate and continuously rotating the substrate; and a third step of then accelerating the rotation of the substrate to dry the coating solution on the substrate. In the first step, the acceleration of the rotation of the substrate is changed in the order of a first acceleration, a second acceleration higher than the first acceleration, and a third acceleration lower than the second acceleration to acceleratingly rotate the substrate at all times.

摘要翻译： 一种涂布处理方法，其特征在于，包括：在将基板加速旋转的同时将涂布液从喷嘴排出到基板的中央部的第一工序，将涂布液涂布在基板上; 第二步骤，然后使基板的旋转减速并连续旋转基板; 以及第三步骤，然后加速基底的旋转以将涂层溶液干燥在基底上。 在第一步骤中，基板的旋转的加速度以第一加速度，比第一加速度高的第二加速度和比第二加速度低的第三加速度的顺序改变，以一直加速旋转基板。