公开(公告)号：US20150187685A1

公开(公告)日：2015-07-02

申请号：US14644268

申请日：2015-03-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stephan Preuss ,  Michael Zitzlsperger

IPC: H01L23/495 ,  G01R31/26 ,  G01R27/02

CPC classification number: H01L23/49551 ,  G01R27/02 ,  G01R31/26 ,  H01L22/14 ,  H01L22/20 ,  H01L23/49555 ,  H01L23/49562 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.

Abstract translation: 引线框组件由导电材料形成。 引线框架组件包括第一纵向元件，至少一个第二纵向元件，多个第一引线框架部分和多个第二引线框架部分。

公开(公告)号：US20150076549A1

公开(公告)日：2015-03-19

申请号：US14346673

申请日：2012-12-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L22/32 ,  H01L24/97 ,  H01L27/15 ,  H01L33/005 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In at least one embodiment of the method, the method is used to produce optoelectronic semiconductor components. A lead frame assemblage includes a plurality of lead frames. The lead frames each includes at least two lead frame parts and the lead frames in the lead frame assemblage are electrically connected to one another by connecting webs. The lead frame assemblage is fitted on an intermediate carrier. At least a portion of the connecting webs is removed and/or interrupted. Additional electrical connecting elements are fitted between adjacent lead frames and/or lead frame parts. A potting body mechanically connects the lead frame parts of the individual lead frames to one another. The resulting structure is singulated to form the semiconductor components.

Abstract translation: 在该方法的至少一个实施例中，该方法用于产生光电子半导体部件。 引线框组合包括多个引线框架。 引线框架每个包括至少两个引线框架部件，并且引线框架组件中的引线框架通过连接网彼此电连接。 引线框组合安装在中间载体上。 连接腹板的至少一部分被去除和/或中断。 附加的电连接元件安装在相邻引线框架和/或引线框架部件之间。 灌封体将单个引线框架的引线框架部分彼此机械连接。 将所得结构单个化以形成半导体组件。

公开(公告)号：US20140353710A1

公开(公告)日：2014-12-04

申请号：US14363738

申请日：2012-12-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Zitzlsperger ,  Jürgen Holz

IPC: H01L33/62 ,  H01L33/52 ,  H01L21/66 ,  H01L25/13

CPC classification number: H01L33/62 ,  G01R31/2635 ,  H01L22/14 ,  H01L22/32 ,  H01L23/49541 ,  H01L23/49562 ,  H01L24/97 ,  H01L25/13 ,  H01L31/0203 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19107 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components.

Abstract translation: 一种方法用于生产光电半导体元件。 引线框组合包括许多引线框架。 引线框架每个包括至少两个引线框架部件，并且至少部分地经由连接幅材连接在一起。 电连接连接在相邻引线框架之间。 灌封体将引线框和引线框架部分机械地连接在一起。 至少一些连接腹板被去除和/或中断，所得到的结构被分成半导体部件。