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51.发明授权Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board 有权用于粘附焊料粉末的装置和将焊料粉末粘附到电子电路板上的方法公开(公告)号：US08752754B2
公开(公告)日：2014-06-17
申请号：US13522547
申请日：2011-01-18
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
CPC分类号： H05K3/3478 , B23K1/0016 , B23K1/203 , B23K3/06 , B23K2101/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/1527 , H05K2203/1554
摘要： Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container.
摘要翻译： 公开了一种用于粘附焊料粉末以将焊料粉末细微地附着到电子电路板的装置以及将焊料粉末粘附到电子电路板的方法。 用于粘附焊料粉末的装置包括容纳电子电路板和焊料粉末的容器; 设置在所述容器中的用于保持所述电子电路板的板保持部，使得其表面大致面向上下方向; 倾斜装置，其将容器的初始位置设定为容器沿第一方向倾斜的倾斜位置，并且使容器沿与第一方向相反的第二方向从初始位置倾斜，并使容器倾斜 回到第一个方向; 以及设置有偏心马达的振动装置，所述偏心马达设置在容器的底部的中心，通过旋转轴的旋转而向容器的底部提供振动;以及控制装置，用于将偏心马达的旋转轴设置在 与容器的倾斜方向相同的方向。
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公开(公告)号：US08661659B2
公开(公告)日：2014-03-04
申请号：US13266379
申请日：2010-04-12
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： H05K3/36
CPC分类号： H05K3/3478 , H05K3/3489 , H05K2203/041 , H05K2203/043 , H05K2203/124 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.
摘要翻译： 提供一种制造电路板的方法，其可以通过防止在形成焊料凸块期间的焊料剥离和针状晶体的产生来稳定地提供正常的电路板。 制造电路板的方法包括以下步骤：通过向电路板的端子的表面施加粘附性赋予化合物来形成粘合剂层; 将焊料颗粒附着到粘合剂层上; 将包括有机碱的氢卤酸盐的活化剂施加到焊料颗粒上，并通过在等于或低于焊料熔点的温度下加热焊料颗粒所附着的电路板来固定焊料颗粒; 将焊剂施加到已经固定有焊料颗粒的电路板上; 并通过加热电路板来熔化焊料颗粒。
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公开(公告)号：US08123111B2
公开(公告)日：2012-02-28
申请号：US11910256
申请日：2006-03-28
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
CPC分类号： H05K3/3484 , B23K1/0016 , B23K3/06 , B23K2101/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/1527
摘要： A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.
摘要翻译： 一种焊接电路板的制造方法，其特征在于，在设置在印刷电路板上的导电电路电极的表面赋予粘合性，形成赋予粘着性的区域。 在赋予粘合性的区域上形成焊料粉末并加热印刷电路板，从而熔化焊料从而形成焊料电路。 将焊料粉末放置在容器中。 具有表面已经赋予粘性的电极的印刷线路板被放置在容器中。 将容器倾斜，从而将焊料粉末沉积在赋予粘性的区域上。
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公开(公告)号：US08038051B2
公开(公告)日：2011-10-18
申请号：US11579879
申请日：2005-05-10
申请人： Takekazu Sakai , Takashi Shoji
发明人： Takekazu Sakai , Takashi Shoji
IPC分类号： B23K31/02
CPC分类号： H05K3/3484 , H05K2203/0292 , H05K2203/0425 , H05K2203/0485 , Y10T29/49144
摘要： A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of heating the substrate, thereby fusing the soldering powder, and forming a solder circuit.
摘要翻译： 一种用于将焊接粉末沉积到电子电路板的方法包括以下步骤：向基底的暴露的金属表面施加粘性并将焊接粉末沉积在液体中的所得粘着部分上。 该方法还可以包括加热基板，从而熔化焊接粉末并形成焊接电路的步骤。
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公开(公告)号：US08026885B2
公开(公告)日：2011-09-27
申请号：US11951403
申请日：2007-12-06
申请人： Junichi Maruyama , Yoshihisa Ooishi , Kikuo Ono , Takashi Shoji
发明人： Junichi Maruyama , Yoshihisa Ooishi , Kikuo Ono , Takashi Shoji
CPC分类号： G09G3/2025 , G09G2310/061
摘要： A display device and system are disclosed, wherein the display system is so configured that an n-fold rate increasing circuit is arranged with a signal generating device instead of with the display device to realize a low-cost n-fold rate impulse-type drive. The n-fold rate display data is output to the display device from the signal generating device, and the display device includes a circuit to subject the input n-fold rate display data to the data conversion process for the n-fold rate impulse drive. In addition to the n-fold rate display data, an identification signal for identifying the position of the turn of the frames of the original video signal is input to the display device to prevent the erroneous data conversion operation.
摘要翻译： 公开了一种显示装置和系统，其中显示系统被配置为使得n倍率增加电路与信号发生装置而不是显示装置一起布置，以实现低成本的n倍率脉冲型驱动 。 n倍率显示数据从信号发生装置输出到显示装置，并且显示装置包括用于使输入的n倍率显示数据进行n倍速率脉冲驱动的数据转换处理的电路。 除了n倍率显示数据之外，将用于识别原始视频信号的帧的转动位置的识别信号输入到显示装置，以防止错误的数据转换操作。
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公开(公告)号：US07709804B2
公开(公告)日：2010-05-04
申请号：US12219345
申请日：2008-07-21
IPC分类号： G01T1/24
CPC分类号： G01T1/2928 , G01T1/244 , G01T1/246
摘要： A radiation detector includes a substrate, a lower electrode disposed on the substrate, a radiation detecting layer formed on the upper surface of the lower electrode, an upper electrode formed on the upper surface of the radiation detecting layer, a protection layer which is formed on the upper electrode, whose end portion extends to an end surface of the substrate and which covers the upper electrode, and a reinforcement member which is formed from the lower surface of the substrate to the surface of the protection layer and which covers the end portion of the protection layer.
摘要翻译： 辐射检测器包括基板，设置在基板上的下电极，形成在下电极的上表面上的放射线检测层，形成在辐射检测层的上表面上的上电极，形成在辐射检测层上的保护层 所述上部电极的端部延伸到所述基板的端面并且覆盖所述上部电极;以及加强部件，其从所述基板的下表面到所述保护层的表面形成，并且覆盖所述上部电极的所述端部的端部 保护层。
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公开(公告)号：US20100038411A1
公开(公告)日：2010-02-18
申请号：US12516978
申请日：2007-12-03
申请人： Takashi Shoji , Takekazu Sakai
发明人： Takashi Shoji , Takekazu Sakai
IPC分类号： B23K1/20
CPC分类号： H05K3/3484 , H05K2203/0126 , H05K2203/0485
摘要： A conductive circuit board is produced by imparting tackiness to the conductive circuit surface on a printed wiring board, attaching solder powder to the tacky area by supplying a slurry containing solder powder, and then heating the printed wiring board to melt the solder, thereby forming a solder circuit. In the solder circuit prepared by this method, tackiness is imparted to portions of the circuit with an insufficient amount of solder attached thereto and solder powder is attached to these tacky areas, or a solder paste is applied to the portions of the circuit with an insufficient amount of solder attached, and the solder powder or solder paste is melted to rectify the solder circuit, thereby producing a conductive circuit board with little variation in the amount of solder attached.
摘要翻译： 通过向印刷电路板上的导电电路表面赋予粘性，通过供给含有焊料粉末的浆料将焊料粉末附着在粘性区域，然后加热印刷线路板来熔化焊料，从而形成导电电路板 焊接电路。 在通过该方法制备的焊料回路中，粘附部分的电路的焊料附着量不足，焊料粉末附着在这些粘性区域，或者焊锡膏被施加到电路部分不足 焊料的附着量，焊料粉末或焊锡膏熔化，使焊锡电路整流，从而制造导电电路板，焊接量不大。
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公开(公告)号：US20090056977A1
公开(公告)日：2009-03-05
申请号：US11910256
申请日：2006-03-28
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
CPC分类号： H05K3/3484 , B23K1/0016 , B23K3/06 , B23K2101/42 , H05K2203/0292 , H05K2203/0425 , H05K2203/043 , H05K2203/1527
摘要： A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to thereby form a solder circuit. The solder powder is placed in a vessel. The printed wiring board having the electrode whose surface has been imparted with tackiness is placed in the vessel. The vessel is tilted to thereby deposit the solder powder on the tackiness-imparted area.
摘要翻译： 一种焊接电路板的制造方法，其特征在于，在设置在印刷电路板上的导电电路电极的表面赋予粘合性，形成赋予粘着性的区域。 在赋予粘合性的区域上形成焊料粉末并加热印刷电路板，从而熔化焊料从而形成焊料电路。 将焊料粉末放置在容器中。 具有表面已经赋予粘性的电极的印刷线路板被放置在容器中。 将容器倾斜，从而将焊料粉末沉积在赋予粘性的区域上。
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公开(公告)号：US07450685B2
公开(公告)日：2008-11-11
申请号：US11581487
申请日：2006-10-17
IPC分类号： G01N23/223
CPC分类号： G01N23/223 , G01N2223/076
摘要： A scanning X-ray fluorescence spectrometer includes a quantitatively analyzing device (18) which calculates the concentration of hexavalent chrome based on the fact that the peak spectroscopic angle, at which the maximum intensity is attained in Cr—Kα line (22), changes depending on the ratio of the concentration of the hexavalent chrome vs. the concentration of the intensity of the total chrome. A plurality of detecting device (23) having different resolutions as a combination of a divergence slit (11), a spectroscopic device (6), a receiving slit (20) and a detector (8) is provided such that when the change of the peak spectroscopic angle is to be detected, a detecting device (23B) having a higher resolution than that of the detecting device (23A), which is selected when the concentration or the intensity of the total chrome is to be determined, is selected.
摘要翻译： 扫描X射线荧光光谱仪包括：计算六价铬浓度的定量分析装置（18），其基于在Cr-Kalpha线（22）中获得的最大强度的峰值分光角随着取决于 关于六价铬的浓度与总铬的强度的浓度的比率。 具有分散狭缝（11），分光装置（6），接收狭缝（20）和检测器（8）的组合的具有不同分辨率的多个检测装置（23）被设置成使得当 要检测峰值分光角度，选择当要确定总铬的浓度或强度时选择的具有比检测装置（23A）高的分辨率的检测装置（23B） 。
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公开(公告)号：US20080238848A1
公开(公告)日：2008-10-02
申请号：US11877899
申请日：2007-10-24
申请人： Yoshihisa Oishi , Junichi Maruyama , Takashi Shoji , Kikuo Ono
发明人： Yoshihisa Oishi , Junichi Maruyama , Takashi Shoji , Kikuo Ono
IPC分类号： G09G3/36
CPC分类号： G09G5/34 , G09G5/02 , G09G2320/0242 , G09G2320/0261
摘要： A hold-type display device reduces the blur of a moving image and makes less conspicuous the color shift caused due to different blur positions among RGB. In the case where the relative brightness of the video data of one or two of the three primary colors RGB changes from between 0 and 0.5 inclusive for the previous frame to between 0 and 0.5 inclusive for the present frame, the video image of the one or two colors is delayed by one frame and displayed.
摘要翻译： 保持型显示装置减少运动图像的模糊，并且由于RGB中的不同模糊位置而引起的颜色偏移不太明显。 在本帧的三原色RGB中的一个或两个的视频数据的相对亮度从前一帧的0和0.5之间变化到0和0.5之间的情况下，对于本帧，视频图像 两种颜色被延迟一帧并显示。
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