Method for attaching a fluid container to a fluid ejector in a fluid ejection device
    52.
    发明授权
    Method for attaching a fluid container to a fluid ejector in a fluid ejection device 失效
    将流体容器附接到流体喷射装置中的流体喷射器的方法

    公开(公告)号:US07294223B2

    公开(公告)日:2007-11-13

    申请号:US10766008

    申请日:2004-01-29

    IPC分类号: B29C65/00

    摘要: A method for joining fluid containers and fluid ejectors in a fluid ejecting device are provided. The fluid container includes one or more heat stakes and a substrate includes one or more apertures for receiving the heat stakes and one or more three-dimensional features in the vicinity of the one or more apertures. The fluid ejector and optionally an elastic member are interposed between the fluid container and the substrate. Thermal energy is applied to the one or more heat stakes so that the one or more heat stakes soften to occupy the apertures and three-dimensional features of the substrate and pressure is applied to maintain contact between the fluid container, elastic member, fluid ejector and substrate. The present invention is also directed to substrate including one or more apertures for receiving heat stakes and one or more three-dimensional features in the vicinity of the one or more apertures.

    摘要翻译: 提供了一种在流体喷射装置中连接流体容器和流体喷射器的方法。 流体容器包括一个或多个热桩,并且衬底包括用于接收热桩的一个或多个孔和一个或多个孔附近的一个或多个三维特征。 流体喷射器和可选地弹性构件插入在流体容器和基底之间。 将热能施加到一个或多个热桩上,使得一个或多个热桩软化以占据孔,并且施加衬底的三维特征并施加压力以保持流体容器,弹性构件,流体喷射器和 基质。 本发明还涉及包括用于接收热桩的一个或多个孔和在一个或多个孔附近的一个或多个三维特征的衬底。

    Semiconductor device and method of controlling said semiconductor device
    55.
    发明申请
    Semiconductor device and method of controlling said semiconductor device 有权
    半导体装置及其控制方法

    公开(公告)号:US20060215477A1

    公开(公告)日:2006-09-28

    申请号:US11290001

    申请日:2005-11-30

    IPC分类号: G11C8/00

    摘要: A semiconductor device includes: memory blocks each having groups of memory cells that are connected to word lines; select gates for selecting the groups of memory cells; and an apply circuit that applies, at the time of reading data, a back bias to the select gates of unselected memory blocks.

    摘要翻译: 半导体器件包括:各自具有连接到字线的存储器单元组的存储器块; 选择用于选择存储器单元组的门; 以及在读取数据时向未选择的存储块的选择栅极施加反向偏置的施加电路。

    Ink jet recording device
    56.
    发明授权

    公开(公告)号:US06623094B2

    公开(公告)日:2003-09-23

    申请号:US09984216

    申请日:2001-10-29

    申请人: Hiroki Murakami

    发明人: Hiroki Murakami

    IPC分类号: B41J207

    摘要: An ink jet recording head having improved printing performance and improved manufacturing efficiency, a manufacturing method of the ink jet recording head, and an ink jet recording device. A head chip in which nozzles for jetting ink droplets are formed is fitted in an opening of an ink manifold via rubber sealing members, and the chip is exposed to the interior of ink supply chambers. Thus, the chip is efficiently cooled by the ink, and the temperature of the ink can be controlled so as to be within a predetermined range. Accordingly, no heat sink is necessary, and as a result, the head is easily manufactured and made compact. Since the chip is fitted in the manifold opening via the sealing members, application of an adhesive and curing time are unnecessary. Thus, manufacturing efficiency is improved.

    Silicon wafer and epitaxial silicon wafer utilizing same
    57.
    发明授权
    Silicon wafer and epitaxial silicon wafer utilizing same 有权
    硅晶片和外延硅晶片利用它们

    公开(公告)号:US06569535B2

    公开(公告)日:2003-05-27

    申请号:US10017295

    申请日:2001-12-18

    IPC分类号: C30B1520

    摘要: A silicon wafer characterized in that the laser scattering tomography defect occurrence region accounts for at least 80% of the wafer surface area and that the laser scattering tomography defects have a mean size of not more than 0.1 &mgr;m, with the density of those defects which exceed 0.1 &mgr;m in size being not more than 1×105 cm−3, and wafers derived from this wafer as the raw material by heat treatment for oxide precipitate formation, by heat treatment for denuded layer formation or by epitaxial layer formation on the surface are useful as semiconductor materials.

    摘要翻译: 一种硅晶片,其特征在于,激光散射层析成像缺陷发生区域占晶片表面积的至少80%,并且激光散射层析成像缺陷的平均尺寸不大于0.1μm,其中这些缺陷的密度超过 0.1μm大小不大于1×10 5 cm -3,通过热处理形成氧化物沉淀物的原料,通过热处理,在表面上形成剥离层或通过外延层形成,从该晶片衍生的晶片可用作半导体 材料

    Scrambled transmission system
    58.
    发明授权
    Scrambled transmission system 失效
    加扰传输系统

    公开(公告)号:US5621799A

    公开(公告)日:1997-04-15

    申请号:US325057

    申请日:1994-10-19

    摘要: A scrambled transmission system for transmitting a digital data containing variable length coding conforming to a MPEG standard includes a scramble key generator for generating a scramble key at a timing of each GOP head. A GOP head detector detects each GOP head and causes the scramble key generator to refresh the scramble key. A seed generator generates a scramble seed based on said scramble key at a timing of each slice head. A slice head detector detects each slice head and causes the seed generator to refresh the scramble seed. A random number generator scrambles the digital data based on the scramble seed. A multiplexer embeds the scramble key in the extension.sub.-- and.sub.-- user.sub.-- data of the scrambled data.

    摘要翻译: 用于发送包含符合MPEG标准的可变长度编码的数字数据的加扰传输系统包括用于在每个GOP头的定时产生加扰密钥的加密密钥发生器。 GOP头检测器检测每个GOP头并使加扰密钥发生器刷新加扰密钥。 种子发生器在每个切片头的定时基于所述加扰密钥产生加扰种子。 切片头检测器检测每个切片头并使种子发生器刷新加扰种子。 随机数发生器基于加扰种子对数字数据进行加扰。 多路复用器将加扰密钥嵌入加扰数据的扩展和用户数据。

    Electroluminescent device having improved electrode terminals
    59.
    发明授权
    Electroluminescent device having improved electrode terminals 失效
    具有改善的电极端子的电致发光器件

    公开(公告)号:US5483120A

    公开(公告)日:1996-01-09

    申请号:US132232

    申请日:1993-10-06

    申请人: Hiroki Murakami

    发明人: Hiroki Murakami

    摘要: A transparent electrode, luminescent layer, back electrode are formed on one side of a first insulative substrate. A second insulative substrate is adhered to the first insulative substrate by an insulative adhesive. The back electrode is divided into two sub-electrodes. A pair of electrode pads are formed on the second insulative substrate so as to be opposed to at least respective parts of the sub-electrodes, and connected to those parts of the sub-electrodes by a conductive connector.

    摘要翻译: 透明电极,发光层,背面电极形成在第一绝缘基板的一侧。 第二绝缘基板通过绝缘粘合剂附着在第一绝缘基板上。 背电极被分成两个子电极。 一对电极焊盘形成在第二绝缘基板上,以便与副电极的至少相应部分相对,并且通过导电连接器连接到副电极的那些部分。