公开(公告)号：US20200083593A1

公开(公告)日：2020-03-12

申请号：US16456048

申请日：2019-06-28

Applicant: Samsung Electro-Mechanics.,Co., Ltd.

Inventor： Seong Hee CHOI ,  Sang Jong LEE ,  Sung Yong AN ,  Jae Yeong KIM ,  Ju Hyoung PARK

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q13/08 ,  H01Q5/10 ,  H01Q21/24 ,  H01Q9/30

Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.

公开(公告)号：US20190279811A1

公开(公告)日：2019-09-12

申请号：US16169616

申请日：2018-10-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee Soo YOON ,  Jae Woon PARK ,  Seung Jae SONG ,  Sang Jong LEE ,  Min Ki JUNG ,  Seung Hee HONG ,  Su Bong JANG

IPC: H01F27/28 ,  H01F27/29

Abstract: A coil component includes: a body; a coil part including a coil pattern embedded in the body and having at least one turn winding around on one direction; first and second external electrodes disposed on a surface of the body and connected to the coil part; and a shielding via having a permeability higher than that of the body and extending along the one direction in the body.

公开(公告)号：US20190189600A1

公开(公告)日：2019-06-20

申请号：US15962577

申请日：2018-04-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hyun LIM ,  Han KIM ,  Eun Jung JO ,  Jung Ho SHIM ,  Sang Jong LEE ,  Hyung Joon KIM

IPC: H01L25/10 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L25/0657 ,  H01L2224/18 ,  H01L2225/1058

Abstract: The fan-out semiconductor package includes: a metal member including a metal plate having a first through-hole and second through-holes and metal posts disposed in the second through-holes; a semiconductor chip disposed in the first through-hole; an encapsulant covering at least portion of each of the metal member and the semiconductor chip and filling at least portions of each of the first and second through-holes; a wiring layer disposed on the encapsulant; first vias electrically connecting the wiring layer and the connection pads to each other; and second vias electrically connecting the wiring layer and the metal posts to each other, wherein a height of the second vias is greater than that of the first vias or a thickness of the metal plate is the same as that of the metal post.

公开(公告)号：US20190066905A1

公开(公告)日：2019-02-28

申请号：US16004809

申请日：2018-06-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Hee HONG ,  Seung Jae SONG ,  Min Ki JUNG ,  Sang Jong LEE

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A coil component may include a body with a plurality of coils with insulating layers interposed therebetween. The plurality of coils may include first and second coils having a different number of turns. The first and second coils may be connected to each other in parallel.

公开(公告)号：US20180033559A1

公开(公告)日：2018-02-01

申请号：US15432189

申请日：2017-02-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Su Bong JANG ,  Sang Jong LEE ,  Hee Soo YOON

IPC: H01G4/33 ,  H01G4/018 ,  H01G4/012

CPC classification number: H01G4/33 ,  H01G4/012 ,  H01G4/018

Abstract: A thin film capacitor includes: a body in which first and second internal electrodes and dielectric layers are alternately stacked; and a plurality of first vias disposed in the body and electrically connected to the first internal electrodes and a plurality of second vias disposed in the body and electrically connected to the second internal electrodes. Each of the first and second vias includes two regions on left and right sides of a central portion, the two regions being alternately disposed in a stacking direction.

公开(公告)号：US20180012697A1

公开(公告)日：2018-01-11

申请号：US15493564

申请日：2017-04-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Ki JUNG ,  Su Bong JANG ,  Sang Jong LEE

IPC: H01F27/28 ,  H01F1/36 ,  H01F27/245 ,  H01F27/29

CPC classification number: H01F1/36 ,  H01F17/0013 ,  H01F27/292 ,  H01F2017/0073

Abstract: A coil component includes a body, a coil disposed inside of the body and forming one coil track when being viewed in a laminated direction, external electrodes disposed on an outer surface of the body. The coil track includes corner portions and linear portions connecting the respective corner portions to each other, and a line width of the corner portion is greater than that of the linear portion.

公开(公告)号：US20170005519A1

公开(公告)日：2017-01-05

申请号：US15196426

申请日：2016-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Jong LEE ,  Han KIM ,  Tae Ho YUN ,  Kang Heon HUR ,  Su Bong JANG

IPC: H02J50/10 ,  H02J50/80 ,  H02J50/90

CPC classification number: H02J50/10 ,  H01F27/006 ,  H01F38/14 ,  H01F2038/143 ,  H02J7/025 ,  H02J50/80 ,  H02J50/90 ,  H04B5/0037

Abstract: A wireless power receiving device includes a first coil partially disposed in an outer region and configured to transmit and/or receive data; and a second coil disposed inwardly of an inner boundary line of the outer region and configured to receive wirelessly transmitted power, wherein a center defined by an inner boundary line and a center defined by an outer boundary line of the second coil are different from each other.

Abstract translation: 无线电力接收装置包括部分地设置在外部区域中并被配置为发送和/或接收数据的第一线圈; 以及第二线圈，其设置在所述外部区域的内边界线的内侧，并被配置为接收无线发射的功率，其中由所述第二线圈的外边界线限定的内边界线和中心限定的中心彼此不同 。