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公开(公告)号：US20210384609A1
公开(公告)日：2021-12-09
申请号：US17022239
申请日：2020-09-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Yong AN , Joong Jin NAM , Jae Yeong KIM
Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.
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公开(公告)号：US20210175613A1
公开(公告)日：2021-06-10
申请号：US17177545
申请日：2021-02-17
Applicant: Samsung Electro-Mechanics.,Co., Ltd.
Inventor： Seong Hee CHOI , Sang Jong LEE , Sung Yong AN , Jae Yeong KIM , Ju Hyoung PARK
Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
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公开(公告)号：US20200083593A1
公开(公告)日：2020-03-12
申请号：US16456048
申请日：2019-06-28
Applicant: Samsung Electro-Mechanics.,Co., Ltd.
Inventor： Seong Hee CHOI , Sang Jong LEE , Sung Yong AN , Jae Yeong KIM , Ju Hyoung PARK
Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
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公开(公告)号：US20190067820A1
公开(公告)日：2019-02-28
申请号：US15993225
申请日：2018-05-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong KIM , Sung Yong AN
Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 μm to 500 μm.
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公开(公告)号：US20220085510A1
公开(公告)日：2022-03-17
申请号：US17149968
申请日：2021-01-15
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Juhyoung PARK , Daeki LIM , Youngsik HUR , Sungyong AN , Jae Yeong KIM , Chin Mo KIM
Abstract: An antenna device includes first and second dielectric layers. The first dielectric layer includes first and second sides facing each other in a third direction. The second dielectric layer includes third and fourth sides facing each other in the third direction. A first antenna patch is disposed on the first side of the first dielectric layer. A second antenna patch is disposed on the third side of the second dielectric layer. Signals with a first frequency bandwidth are transmitted or received electrical signals applied to the first antenna patch. Signals with a different second frequency bandwidth are transmitted or received by an electrical signal applied to the second antenna patch. A height of the second dielectric layer measured to the third side from the fourth side in a direction parallel to a third direction is greater than a height of the first dielectric layer measured to the first side from the second side.
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Patent Agency Ranking
公开(公告)号：US20220021103A1
公开(公告)日：2022-01-20
申请号：US17488636
申请日：2021-09-29
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Hyoung PARK , Myeong Woo HAN , Jae Yeong KIM , Young Sik HUR , Sung Yong AN , Dae Ki LIM
Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
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公开(公告)号：US20210376490A1
公开(公告)日：2021-12-02
申请号：US17399572
申请日：2021-08-11
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong KIM , Sung Nam CHO , Ju Hyoung PARK , Jeong Ki RYOO , Kyu Bum HAN , Sung Yong AN
Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
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公开(公告)号：US20210151853A1
公开(公告)日：2021-05-20
申请号：US16803243
申请日：2020-02-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Hyoung PARK , Myeong Woo HAN , Jae Yeong KIM , Young Sik HUR , Sung Yong AN , Dae Ki LIM
Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
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公开(公告)号：US20150115193A1
公开(公告)日：2015-04-30
申请号：US14228243
申请日：2014-03-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Yeong KIM , Sung-Yong AN , Hak-Kwan KIM , Jung-Wook SEO
IPC: H01F1/01
CPC classification number: H01F1/0054
Abstract: The present invention related to ferromagnetic nano-metal powders and more particularly, to ferromagnetic nano-metal powders for increasing packing density by decreasing the porosity between micro-sized soft magnetic metal powders. According to an embodiment of the present invention, the ferromagnetic nano-metal powder allows high packing density and high magnetic property at a high frequency to fill the pores inevitably generated during the manufacturing process of an inductor using the soft magnetic metal powders.
Abstract translation: 本发明涉及铁磁性纳米金属粉末，更具体地，涉及通过降低微尺寸软磁性金属粉末之间的孔隙率来提高填充密度的铁磁性纳米金属粉末。 根据本发明的一个实施方案，铁磁性纳米金属粉末允许在高频下的高填充密度和高磁性能填充在使用软磁金属粉末的电感器的制造过程中不可避免地产生的孔。
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公开(公告)号：US20230049220A1
公开(公告)日：2023-02-16
申请号：US17862733
申请日：2022-07-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Juhyoung PARK , Daeki LIM , Jeongki RYOO , Sungyong AN , Jae Yeong KIM
IPC: H01Q9/04
Abstract: An antenna device is provided. The antenna device includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed between the first dielectric layer and the second dielectric layer; a feed via configured to penetrate the first dielectric layer; a first feed pattern disposed between the first dielectric layer and the third dielectric layer; a second feed pattern disposed between the second dielectric layer and the third dielectric layer and configured to overlap the first feed pattern; and a patch antenna pattern disposed on the second dielectric layer and configured to overlap the first feed pattern and the second feed pattern, wherein a dielectric constant of the third dielectric layer is less than a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer.
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