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公开(公告)号：US20220021103A1
公开(公告)日：2022-01-20
申请号：US17488636
申请日：2021-09-29
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Hyoung PARK , Myeong Woo HAN , Jae Yeong KIM , Young Sik HUR , Sung Yong AN , Dae Ki LIM
Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
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公开(公告)号：US20210376490A1
公开(公告)日：2021-12-02
申请号：US17399572
申请日：2021-08-11
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong KIM , Sung Nam CHO , Ju Hyoung PARK , Jeong Ki RYOO , Kyu Bum HAN , Sung Yong AN
Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
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公开(公告)号：US20210151853A1
公开(公告)日：2021-05-20
申请号：US16803243
申请日：2020-02-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Hyoung PARK , Myeong Woo HAN , Jae Yeong KIM , Young Sik HUR , Sung Yong AN , Dae Ki LIM
Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
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4.发明申请ELECTROMAGNETIC INDUCTION MODULE FOR WIRELESS CHARGING ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开用于无线充电元件的电磁感应模块及其制造方法公开(公告)号：US20140176281A1
公开(公告)日：2014-06-26
申请号：US13888945
申请日：2013-05-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chang Ryul JUNG , Dong Hyeok CHOI , Sung Yong AN
IPC: H01F27/28
CPC classification number: H01F27/2804 , H01F38/14 , Y10T29/49073
Abstract: There is provided an electromagnetic induction module for a wireless charging element, including a laminate formed by laminating magnetic sheets, each magnetic sheet including magnetic particles and having a groove portion of a coil pattern formed in one surface thereof, and a coil disposed in the groove portion.
Abstract translation: 提供了一种用于无线充电元件的电磁感应模块，其包括通过层压磁性片形成的层压体，每个磁性片包括磁性颗粒，并且在其一个表面中形成有线圈图案的槽部分，以及设置在凹槽中的线圈 一部分。
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5.发明申请DOUBLE-LAYER COMPOSITE METAL POWDER PARTICLE, MANUFACTURING METHOD THEREOF, AND METHOD OF MANUFACTURING SOFT MAGNETIC CORE 审中-公开双层复合金属粉末颗粒及其制造方法和制造软磁芯的方法公开(公告)号：US20140175702A1
公开(公告)日：2014-06-26
申请号：US13888818
申请日：2013-05-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hak Kwan KIM , Sung Yong AN , No Il PARK , Dong Hyeok CHOI
CPC classification number: H01F3/08 , H01F1/24 , H01F1/33 , H01F41/0246
Abstract: There is provided a method of manufacturing a double-layer composite metal powder particle, the method including preparing an iron (Fe)-based powder particle, forming an insulating layer on a surface of the iron (Fe)-based powder particle, and forming a lubricating wax coating layer on the insulating layer.
Abstract translation: 提供一种制造双层复合金属粉末颗粒的方法，该方法包括制备基于铁（Fe）的粉末颗粒的铁（Fe）基粉末颗粒，在铁（Fe）基粉末颗粒的表面上形成绝缘层，并形成 绝缘层上的润滑蜡涂层。
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Patent Agency Ranking
公开(公告)号：US20130335184A1
公开(公告)日：2013-12-19
申请号：US13633544
申请日：2012-10-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jin Woo HAHN , Myeong Gi KIM , Sung Yong AN , Ic Seob KIM , Byeong Cheol MOON
IPC: H01F5/00
CPC classification number: H01F3/14 , H01F17/0013 , H01F17/0033 , H01F27/292
Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 μm≦Tg≦7 μm, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.
Abstract translation: 提供一种多层芯片电子部件，其包括：包括2016尺寸以下的多层磁性层的多层体; 导电图案在堆叠方向上电连接以形成多层体内的线圈图案; 以及形成在多层磁性层之间的层叠多层体的表面上的非磁性间隙层，其厚度Tg在1mum @ Tg @7μm的范围内，其中非磁隙层数 可以具有在磁性层中的至少四层之间的范围内的间隙层的数量和线圈图案的匝数。
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公开(公告)号：US20210384609A1
公开(公告)日：2021-12-09
申请号：US17022239
申请日：2020-09-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Yong AN , Joong Jin NAM , Jae Yeong KIM
Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.
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公开(公告)号：US20210175613A1
公开(公告)日：2021-06-10
申请号：US17177545
申请日：2021-02-17
Applicant: Samsung Electro-Mechanics.,Co., Ltd.
Inventor： Seong Hee CHOI , Sang Jong LEE , Sung Yong AN , Jae Yeong KIM , Ju Hyoung PARK
Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
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公开(公告)号：US20200083593A1
公开(公告)日：2020-03-12
申请号：US16456048
申请日：2019-06-28
Applicant: Samsung Electro-Mechanics.,Co., Ltd.
Inventor： Seong Hee CHOI , Sang Jong LEE , Sung Yong AN , Jae Yeong KIM , Ju Hyoung PARK
Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
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公开(公告)号：US20190067820A1
公开(公告)日：2019-02-28
申请号：US15993225
申请日：2018-05-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong KIM , Sung Yong AN
Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 μm to 500 μm.
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