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公开(公告)号:US20250039019A1
公开(公告)日:2025-01-30
申请号:US18784145
申请日:2024-07-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangwook HAN , Junho LEE , Yoojin CHOI
Abstract: A method of operating a base station, includes: transmitting a reference signal to an electronic device comprising a first model and a third model; receiving a first intermediate output from the electronic device; obtaining a second intermediate output by inputting the first intermediate output to a partial model excluding an output layer from a second model comprising a second neural network for data decompression; transmitting the second intermediate output to the electronic device; receiving a first gradient value from the electronic device and updating weight parameters of the partial model; and generating a second gradient value different from the first gradient value and transmitting the second gradient value to the electronic device.
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公开(公告)号:US20250038083A1
公开(公告)日:2025-01-30
申请号:US18438719
申请日:2024-02-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
IPC: H01L23/498
Abstract: A semiconductor device according to embodiments includes a semiconductor package, a package pad positioned on a surface of the semiconductor package, and a solder ball positioned on the package pad. The package pad includes a package center pad positioned at the center of the semiconductor package, and a package edge pad positioned on an edge portion of the semiconductor package, the package edge pad covers a side surface extending from a surface of the semiconductor package.
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公开(公告)号:US20250003812A1
公开(公告)日:2025-01-02
申请号:US18810429
申请日:2024-08-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaebum LEE , Hyunggwang KANG , Youngho KIM , Junho LEE , Seokmin JANG , Hyunju HONG
Abstract: An electronic device according to various embodiments of the disclosure may include a first housing, a second housing configured to be slid into the first housing and slid out from the first housing, a substrate part disposed between the front surface and the rear surface in the first housing and including at least one heat source, a first temperature sensor disposed on the substrate part, a second temperature sensor disposed in the second housing, and at least one processor. The at least one processor is configured to calculate a temperature of the electronic device based on at least one of a measurement value of the first temperature sensor or a measurement value of the second temperature sensor. Various other embodiments may be possible.
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54.
公开(公告)号:US20240243149A1
公开(公告)日:2024-07-18
申请号:US18409347
申请日:2024-01-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangyun LEE , Sookyoung ROH , Seokho YUN , Junho LEE
IPC: H01L27/146
CPC classification number: H01L27/14627 , H01L27/14621
Abstract: Provided is an image sensor that includes a sensor substrate including a plurality of pixels, a nano-photonic lens array including a plurality of nano-structures that are disposed to color-separate incident light and condense the color-separated incident light onto the plurality of pixels, and a color filter layer including a plurality of color filters, wherein the total number of color filters transmitting the light of a first wavelength band is greater than a number of color filters transmitting the light of a second wavelength band and the number of the color filters transmitting the light of a third wavelength band, and the plurality of nano-structures of the nano-photonic lens array color-separate and condense the light of the second wavelength band and the light of the third wavelength band, and condense the light of the first wavelength band without color-separation.
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公开(公告)号:US20240230960A1
公开(公告)日:2024-07-11
申请号:US18405938
申请日:2024-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangeun MUN , Sungmo AHN , Sookyoung ROH , Junho LEE , Choonlae CHO
CPC classification number: G02B3/0043 , H04N23/55 , G02B2207/101
Abstract: An image sensor includes a sensor substrate including a plurality of pixels that detect light, and a nano-optical microlens array arranged on the sensor substrate and including a plurality of nano-optical microlenses that focus incident light on the plurality of pixels, wherein the nano-optical microlens array includes a plurality of lens groups, each of the plurality of lens groups includes first, second, third, and fourth nano-optical microlenses, and each of the first, second, third, and fourth nano-optical microlenses includes a plurality of nanostructures arranged to focus incident light on a corresponding pixel, and centers of the first, second, third, and fourth nano-optical microlenses in each of the plurality of peripheral groups in the plurality of lens groups are offset with respect to a center of the corresponding pixel, and offset distances of at least two of the first, second, third, and fourth nano-optical microlenses are different from each other.
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56.
公开(公告)号:US20240195466A1
公开(公告)日:2024-06-13
申请号:US18582227
申请日:2024-02-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Federico PENNA , Hyukjoon KWON , Dongwoon BAI , Jaein KIM , Junho LEE , Hui Won JE
IPC: H04B7/0456 , H04B7/06 , H04L5/00
CPC classification number: H04B7/0456 , H04B7/0632 , H04L5/0094
Abstract: The disclosure provides methods of providing implicit channel state information (CSI) feedback from a user equipment (UE). A method performed by a first device includes determining a feedback parameter selection decision metric; selecting a particular method from a plurality of methods, based on the feedback parameter selection decision metric; determining, based at least in part on the particular method, and based on a configuration of an associated second device, one or more values associated with precoding; and transmitting the one or more values to the second device.
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公开(公告)号:US20240145295A1
公开(公告)日:2024-05-02
申请号:US18226372
申请日:2023-07-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun LEE , Junho LEE , Kang Joon LEE
IPC: H01L21/768 , H01L21/56 , H01L23/00 , H01L23/498 , H01L23/532 , H01L25/18
CPC classification number: H01L21/768 , H01L21/565 , H01L23/49816 , H01L23/53209 , H01L24/48 , H01L25/18 , H01L2224/48151 , H01L2924/1431 , H01L2924/1434
Abstract: A semiconductor package includes a first structure that includes an upper connection pattern; a second structure that includes a lower connection pattern; and a connection structure that connects the upper connection pattern of the first structure to the lower connection pattern of the second structure, wherein the connection structure includes a lower conductor connected to the upper connection pattern of the first structure; an upper conductor connected to the lower conductor and the lower connection pattern of the second structure; and a dielectric pattern that at least partially surrounds the upper conductor, and the dielectric pattern includes a first surface in contact with the upper conductor; and a second surface in contact with the lower conductor.
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公开(公告)号:US20240079429A1
公开(公告)日:2024-03-07
申请号:US18236652
申请日:2023-08-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sungmo AHN , Sangeun MUN , Choonlae CHO , Sookyoung ROH , Hyunsung PARK , Seokho YUN , Sangyun LEE , Junho LEE
IPC: H01L27/146
CPC classification number: H01L27/14625 , H01L27/14605 , H01L27/14621
Abstract: An image sensor includes a sensor substrate including a plurality of unit pixel groups each including a first pixel, a second pixel, a third pixel, and a fourth pixel arranged in a Bayer pattern, and a color separating lens array which separates incident light according to wavelengths and condenses the light on each of the first to fourth pixels, wherein the color separating lens array a plurality of pixel corresponding groups respectively corresponding to the plurality of unit pixel groups, and the plurality of pixel corresponding groups each include first to fourth pixel corresponding regions corresponding to the first to fourth pixels and a plurality of nanoposts. From among the plurality of pixel corresponding groups, relative positional relationships between the nanoposts of the first to fourth pixel corresponding regions in each of the plurality of peripheral groups that are located out of the center of the color separating lens array may be different from each other.
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公开(公告)号:US20240040273A1
公开(公告)日:2024-02-01
申请号:US18227095
申请日:2023-07-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sookyoung ROH , Junho LEE , Seokho YUN
IPC: H04N25/17 , H04N25/704 , H04N23/67 , H01L27/146 , G02B3/00 , G02B7/36
CPC classification number: H04N25/17 , H04N25/704 , H04N23/67 , H01L27/14645 , H01L27/14627 , G02B3/0037 , G02B7/36
Abstract: Provided is an image sensor including a pixel array including a plurality of imaging pixels and a plurality of autofocusing pixels, and a lens array including a plurality of micro lenses facing the plurality of imaging pixels, respectively, and one or more super lenses facing the plurality of autofocusing pixels, wherein each imaging pixel of the plurality of imaging pixels includes a first red meta-photodiode configured to selectively absorb light of a red wavelength band, a first green meta-photodiode configured to selectively absorb light of a green wavelength band, and a first blue meta-photodiode configured to selectively absorb light of a blue wavelength band.
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公开(公告)号:US20230420480A1
公开(公告)日:2023-12-28
申请号:US18210946
申请日:2023-06-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junho LEE , Sookyoung Roh , Sangeun Mun , Seokho Yun
IPC: H01L27/146 , H01L31/0352 , H01L31/105
CPC classification number: H01L27/14645 , H01L27/14625 , H01L31/035281 , H01L31/105
Abstract: An image sensor may include a pixel array including a plurality of two-dimensionally arranged pixels. Each pixel may include a first meta-photodiode absorbing light of a first wavelength band; a second meta-photodiode absorbing light in a second wavelength band; and a third meta-photodiode absorbing light of a third wavelength band, wherein the first meta-photodiode, the second meta-photodiode, and the third meta-photodiode may be arranged in an area having a size less than a diffraction limit. The arrangement form of the first meta-photodiode, the second meta-photodiode, and the third meta-photodiode arranged in the plurality of pixels in a central portion of the pixel array may be the same as the arrangement form of the first meta-photodiode, the second meta-photodiode, and the third meta-photodiode arranged in the plurality of pixels in a periphery of the pixel array.
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