公开(公告)号：US20230298979A1

公开(公告)日：2023-09-21

申请号：US18322369

申请日：2023-05-23

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/34 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/4821 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/49513 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/48 ,  H01L24/83 ,  H01L24/45 ,  H01L2224/48175

Abstract: In a described example, an apparatus includes: a package substrate having a die pad configured for mounting a semiconductor die, a first lead connected to the die pad, and a second lead spaced from and electrically isolated from the die pad; a spacer dielectric mounted on the die pad; a semiconductor die including a temperature sensor mounted on the spacer dielectric; electrical connections coupling the semiconductor die to the second lead; and mold compound covering the semiconductor die, the die pad, the electrical connections, and a portion of the package substrate, with portions of the first lead and portions of the second lead exposed from the mold compound to form terminals for a packaged temperature sensor device.

公开(公告)号：US11756882B2

公开(公告)日：2023-09-12

申请号：US17138906

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer ,  Alejandro Hernandez-Luna

IPC: H01L23/525 ,  H01L23/528 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48

CPC classification number: H01L23/5256 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/4952 ,  H01L23/49575 ,  H01L23/5283

Abstract: A semiconductor package includes a metallic pad and leads, a semiconductor die including a semiconductor substrate attached to the metallic pad, and a conductor including a sacrificial fuse element above the semiconductor substrate, the sacrificial fuse element being electrically coupled between one of the leads and at least one terminal of the semiconductor die, and a multilayer dielectric between the sacrificial fuse element and the semiconductor substrate, the multilayer dielectric forming one or more planar gaps beneath a profile of the sacrificial fuse element.

公开(公告)号：US20230187348A1

公开(公告)日：2023-06-15

申请号：US17546383

申请日：2021-12-09

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: H01L23/525 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/5256 ,  H01L24/48 ,  H01L23/3107 ,  H01L21/56 ,  H01L24/49 ,  H01L24/43 ,  H01L2224/48175 ,  H01L2224/49421 ,  H01L2224/49427 ,  H01L2224/4321

Abstract: An electronic device has a fuse circuit including a semiconductor die and first and second bond wires, the semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit, the first bond wire having a first end coupled to the bond pad and a second end coupled to a conductive terminal, and the second bond wire having a first end coupled to the second end of the first bond wire and a second end coupled to the conductive terminal.

公开(公告)号：US20230094556A1

公开(公告)日：2023-03-30

申请号：US17491451

申请日：2021-09-30

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: H01L49/02 ,  H01L23/64 ,  H01L25/065 ,  H01L23/00

Abstract: In a described example, an apparatus includes a transformer including: an isolation dielectric layer with a first surface and a second surface opposite the first surface; a first inductor formed over the first surface, the first inductor comprising a first layer of ferrite material, and a first coil at least partially covered by the first layer of ferrite material; and a second inductor formed over the second surface, the second inductor comprising a second layer of ferrite material and a second coil at least partially covered by the second layer of ferrite material.

公开(公告)号：US11614482B1

公开(公告)日：2023-03-28

申请号：US17566607

申请日：2021-12-30

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: G01R31/28 ,  G01R15/20

Abstract: A method includes placing a semiconductor device package in a test handler, the semiconductor device package having leads of a first portion of a package substrate extending from a mold compound and leads of a second portion isolated from the first portion extending from the mold compound; contacting the first portion with a first and a second conductive slug; contacting the second portion with a third and a fourth conductive slug; contacting a first surface of the mold compound with a first plunger having a conductive plate and an insulating tip; contacting an opposite second surface of the mold compound with a second plunger having a conductive plate and an insulating tip; and placing a high voltage on the first conductive slug while placing approximately half the high voltage on the conductive plate of the first plunger, and placing a ground voltage on the third conductive slug.

公开(公告)号：US11598742B2

公开(公告)日：2023-03-07

申请号：US17137251

申请日：2020-12-29

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer ,  Vikas Gupta

IPC: H01L21/768 ,  G01N27/22 ,  H01L23/522 ,  H01L23/00

Abstract: Described examples include a sensor device having at least one conductive elongated first pillar positioned on a central pad of a first conductor layer over a semiconductor substrate, the first pillar extending in a first direction normal to a plane of a surface of the first conductor layer. Conductive elongated second pillars are positioned in normal orientation on a second conductor layer over the semiconductor substrate, the conductive elongated second pillars at locations coincident to via openings in the first conductor layer. The second conductor layer is parallel to and spaced from the first conductor layer by at least an insulator layer, the conductive elongated second pillars extending in the first direction through a respective one of the via openings. The at least one conductive elongated first pillar is spaced from surrounding conductive elongated second pillars by gaps.

公开(公告)号：US20220319988A1

公开(公告)日：2022-10-06

申请号：US17218941

申请日：2021-03-31

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: H01L23/525 ,  H01L23/498 ,  H01L23/00

Abstract: In a described example, an apparatus includes: a package substrate having a die pad configured for mounting a semiconductor die, and leads spaced from the die pad; a semiconductor die mounted on the die pad; a fuse mounted to a lead, the fuse having a fuse element coupled between a fuse cap and the lead, the fuse having a fuse body with an opening surrounding the fuse element, the fuse cap attached to the fuse body; electrical connections coupling the semiconductor die to the fuse; and mold compound covering the semiconductor die, the fuse, the electrical connections, and a portion of the package substrate, with portions of the leads exposed from the mold compound to form terminals.

公开(公告)号：US20220208699A1

公开(公告)日：2022-06-30

申请号：US17138903

申请日：2020-12-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Enis Tuncer

IPC: H01L23/62 ,  H01L23/31 ,  H01L23/24 ,  H02H7/00 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package includes a metallic pad and leads, a semiconductor die including a semiconductor substrate attached to the metallic pad, and a conductor including a sacrificial fuse element above the semiconductor substrate, the sacrificial fuse element being electrically coupled between one of the leads and at least one terminal of the semiconductor die, a shock-absorbing material over a profile of the sacrificial fuse element, and mold compound covering the semiconductor die, the conductor, and the shock-absorbing material, and partially covering the metallic pad and leads, with the metallic pad and the leads exposed on an outer surface of the semiconductor package. Either a glass transition temperature of the shock-absorbing material or a melting point of the shock-absorbing material is lower than a melting point of the conductor.

公开(公告)号：US20220140154A1

公开(公告)日：2022-05-05

申请号：US17088963

申请日：2020-11-04

Applicant: Texas Instruments Incorporated

Inventor： Enis Tuncer

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/173 ,  G01J1/02

Abstract: An optical sensor package includes an IC die including a light sensor element, an output node, and bond pads including a bond pad coupled to the output node. A leadframe includes a plurality of leads or lead terminals, wherein at least some of the plurality of leads or lead terminals are coupled to the bond pads including to the bond pad coupled to the output node. A mold compound provides encapsulation for the optical sensor package including for the light sensor element. The mold compound includes a polymer-base material having filler particles including at least one of infrared or terahertz transparent particle composition provided in a sufficient concentration so that the mold compound is optically transparent for providing an optical transparency of at least 50% for a minimum mold thickness of 500 μm in a portion of at least one of an infrared frequency range and a terahertz frequency range.

公开(公告)号：US20210231729A1

公开(公告)日：2021-07-29

申请号：US17158994

申请日：2021-01-26

Applicant: Texas Instruments Incorporated

Inventor： Ming-Chuan You ,  Andrew Patrick Couch ,  Phillip Marcus Blitz ,  Xinkun Huang ,  Chi-Tsung Lee ,  Roy Deidrick Solomon ,  Enis Tuncer

IPC: G01R31/28

Abstract: An integrated circuit testing assembly that includes: (i) a first slug configured to contact a first surface of a first set of pins of an integrated circuit; (ii) a second slug configured to contact a second surface of the first set of pins of the integrated circuit; (iii) a third slug configured to contact a first surface of a second set of pins of the integrated circuit; and (iv) a fourth slug configured to contact a second surface of the second set of pins of the integrated circuit.