公开(公告)号：US08142670B2

公开(公告)日：2012-03-27

申请号：US12292540

申请日：2008-11-20

申请人： Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda

发明人： Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda

IPC分类号： B44C1/22 ,  C25F3/00

CPC分类号： G02B26/0841 ,  B81B3/0062 ,  B81B2201/033 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/058

摘要： A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force for the oscillating motion of the movable functional portion about the torsional joint. The first comb-tooth electrode includes a plurality of first electrode teeth each having a first conductor, an insulator and a second conductor laminated in the direction of the oscillating motion, where the first conductor and the second conductor are electrically connected with each other. The second comb-tooth electrode includes a plurality of second electrode teeth caused not to face the second conductor but to face the first conductor of the first electrode teeth during non-operation. The second electrode teeth are longer than the first conductor in the direction of the oscillating motion.

摘要翻译： 微振动元件包括框架，可移动功能部分和用于连接框架和功能部分的扭转接头。 微振动元件还包括用于产生用于可动功能部分围绕扭转接头的摆动运动的驱动力的第一和第二梳齿电极。 第一梳齿电极包括多个第一电极齿，每个第一电极齿具有沿振荡运动方向层叠的第一导体，绝缘体和第二导体，其中第一导体和第二导体彼此电连接。 第二梳齿电极包括在不操作期间不面向第二导体而是面对第一电极齿的第一导体的多个第二电极齿。 第二电极齿在摆动运动方向上比第一导体长。

公开(公告)号：US08049394B2

公开(公告)日：2011-11-01

申请号：US12659975

申请日：2010-03-26

申请人： Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Ippei Sawaki

发明人： Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Ippei Sawaki

IPC分类号： G02B26/08 ,  H02N1/00

CPC分类号： H02N1/008 ,  G02B26/0841

摘要： A micro oscillating element includes a frame and an oscillation section connected to the frame via a torsional joining section. The oscillation section includes a movable functional section, an arm section and a first comb-tooth electrode. The arm section extends from the functional section. The first comb-tooth electrode includes first electrode teeth extending from the arm section in a direction intersecting the arm section. The micro oscillating element further includes a second comb-tooth electrode to cooperate with the first comb-tooth electrode for causing the oscillation section to oscillate about an oscillation axis defined by the torsional joining section. The second comb-tooth, electrode includes second electrode teeth extending from the frame in a direction intersecting the arm section.

摘要翻译： 微振荡元件包括框架和经由扭转接合部分连接到框架的振荡部分。 振荡部包括可动功能部，臂部和第一梳齿电极。 臂部分从功能部分延伸。 第一梳齿电极包括从臂部沿与臂部相交的方向延伸的第一电极齿。 微振荡元件还包括第二梳齿电极，与第一梳齿电极配合，用于使振动部分围绕由扭转接合部分限定的摆动轴线摆动。 第二梳齿电极包括从框架沿与臂部相交的方向延伸的第二电极齿。

公开(公告)号：US07751108B2

公开(公告)日：2010-07-06

申请号：US11987899

申请日：2007-12-05

申请人： Osamu Tsuboi ,  Yoshihiro Mizuno ,  Satoshi Ueda ,  Ippei Sawaki ,  Hisao Okuda ,  Fumio Yamagishi ,  Hiromitsu Soneda ,  Norinao Kouma

发明人： Osamu Tsuboi ,  Yoshihiro Mizuno ,  Satoshi Ueda ,  Ippei Sawaki ,  Hisao Okuda ,  Fumio Yamagishi ,  Hiromitsu Soneda ,  Norinao Kouma

IPC分类号： G02B26/08 ,  H02N1/00

CPC分类号： G02B26/0841 ,  G02B26/085 ,  H02N1/008

摘要： The micro-actuation element (X1) includes a movable unit (111), a frame (112) and a coupler (113) for connecting these, where the unit, the frame and the coupler are integrally formed in a material substrate having a multi-layer structure that consists of electroconductive layers (110a-110c), such as a core conduction layer (110b), and insulation layers (110d, 110e) intervening between the electroconductive layers (110a-110c). The movable unit (111) includes a first structure originating in the core conduction layer (110b). The frame (112) includes a second structure originating in the core conduction layer (110b). The coupler (113) includes a plurality of electrically separated torsion bars (113a, 113b) that originate in the core conduction layer (110b) and are connected continuously to the first structure and the second structure.

摘要翻译： 微型致动元件（X1）包括可移动单元（111），框架（112）和用于连接它们的联接器（113），其中单元，框架和耦合器一体地形成在具有多个 由导电层（110a-110c）（例如芯导电层（110b））和介于导电层（110a-110c）之间的绝缘层（110d，110e）组成。 可移动单元（111）包括源于芯导电层（110b）的第一结构。 框架（112）包括源于芯导电层（110b）的第二结构。 耦合器（113）包括多个电分离的扭杆（113a，113b），其产生在芯导电层（110b）中并且连续地连接到第一结构和第二结构。

公开(公告)号：US07550895B2

公开(公告)日：2009-06-23

申请号：US11603006

申请日：2006-11-22

申请人： Osamu Tsuboi ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Mi Xiaoyu ,  Satoshi Ueda ,  Ippei Sawaki ,  Yoshitaka Nakamura

发明人： Osamu Tsuboi ,  Norinao Kouma ,  Hisao Okuda ,  Hiromitsu Soneda ,  Mi Xiaoyu ,  Satoshi Ueda ,  Ippei Sawaki ,  Yoshitaka Nakamura

IPC分类号： H02N1/00 ,  G02B26/08

CPC分类号： H02N1/008

摘要： A micro-oscillation element includes a movable main section, a first frame and a second frame, and a first connecting section that connects the movable main section and the first frame and defines a first axis of rotation for a first rotational operation of the movable main section with respect to the first frame. The element further includes a second connecting section that connects the first frame and the second frame and defines a second axis of rotation for a second rotational operation of the first frame and the movable main section with respect to the second frame. A first drive mechanism is provided for generating a driving force for the first rotational operation. A second drive mechanism is provided for generating a driving force for the second rotational operation. The first axis of rotation and the second axis of rotation are not orthogonal.

摘要翻译： 微振荡元件包括可移动主体部分，第一框架和第二框架，以及第一连接部分，其连接可移动主体部分和第一框架，并且限定第一旋转轴线用于可移动主体的第一旋转操作 相对于第一帧的截面。 元件还包括第二连接部分，其连接第一框架和第二框架并且限定第二旋转轴线用于第一框架和可移动主体部分相对于第二框架的第二旋转操作。 第一驱动机构被提供用于产生用于第一旋转操作的驱动力。 提供第二驱动机构用于产生用于第二旋转操作的驱动力。 第一旋转轴线和第二旋转轴线不正交。

公开(公告)号：US07536068B2

公开(公告)日：2009-05-19

申请号：US11385657

申请日：2006-03-22

申请人： Hiromitsu Soneda ,  Xiaoyu Mi ,  Hisao Okuda ,  Osamu Tsuboi ,  Norinao Kouma ,  Satoshi Ueda

发明人： Hiromitsu Soneda ,  Xiaoyu Mi ,  Hisao Okuda ,  Osamu Tsuboi ,  Norinao Kouma ,  Satoshi Ueda

IPC分类号： G02B6/26

CPC分类号： G02B6/357 ,  G02B6/3518 ,  G02B6/3556 ,  G02B6/3584 ,  Y10S359/90

摘要： A micro movable element includes a micro movable substrate, a package base and an electroconductive connector. The micro movable substrate is provided with a micro movable unit that includes a frame, a pivotally movable portion, a torsion connector connecting the frame and the movable portion, and an actuator to generate driving force for the pivotal motion of the movable portion. The package base includes an internal interconnect structure. The electroconductive connector is provided between the micro movable substrate and the package base for electrically connecting the actuator and the internal interconnect structure to each other.

摘要翻译： 微型可移动元件包括微型可移动基板，封装基座和导电连接器。 微型可移动基板设置有微型可动单元，其包括框架，可枢转运动部分，连接框架和可移动部分的扭转连接器以及用于产生用于可动部分的枢转运动的驱动力的致动器。 封装基座包括内部互连结构。 导电连接器设置在微移动基板和封装基座之间，用于将致动器和内部互连结构彼此电连接。

公开(公告)号：US20080285108A1

公开(公告)日：2008-11-20

申请号：US11987899

申请日：2007-12-05

申请人： Osamu Tsuboi ,  Yoshihiro Mizuno ,  Satoshi Ueda ,  Ippei Sawaki ,  Hisao Okuda ,  Fumio Yamagishi ,  Hiromitsu Soneda ,  Norinao Kouma

发明人： Osamu Tsuboi ,  Yoshihiro Mizuno ,  Satoshi Ueda ,  Ippei Sawaki ,  Hisao Okuda ,  Fumio Yamagishi ,  Hiromitsu Soneda ,  Norinao Kouma

IPC分类号： G02B26/08 ,  H02N1/00

CPC分类号： G02B26/0841 ,  G02B26/085 ,  H02N1/008

摘要： The micro-actuation element (X1) includes a movable unit (111), a frame (112) and a coupler (113) for connecting these, where the unit, the frame and the coupler are integrally formed in a material substrate having a multi-layer structure that consists of electroconductive layers (110a-110c), such as a core conduction layer (110b), and insulation layers (110d, 110e) intervening between the electroconductive layers (110a-110c). The movable unit (111) includes a first structure originating in the core conduction layer (110b). The frame (112) includes a second structure originating in the core conduction layer (110b). The coupler (113) includes a plurality of electrically separated torsion bars (113a, 113b) that originate in the core conduction layer (110b) and are connected continuously to the first structure and the second structure.

摘要翻译： 微致动元件（X 1）包括可移动单元（111），框架（112）和用于连接它们的耦合器（113），其中单元，框架和耦合器一体形成在具有 由导电层（110a-110c），例如芯导电层（110b）和介于导电层（110a-110c）之间的绝缘层（110d，110e））组成的多层结构， 。 可移动单元（111）包括源于芯导电层（110b）的第一结构。 框架（112）包括源于芯导电层（110b）的第二结构。 耦合器（113）包括多个电分离的扭力杆（113a，113b），其产生在芯导电层（110b）中并连续地连接到第一结构和第二结构。

公开(公告)号：US20070268549A1

公开(公告)日：2007-11-22

申请号：US11878525

申请日：2007-07-25

申请人： Mi Xiaoyu ,  Satoshi Ueda ,  Hisao Okuda ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Norinao Kouma ,  Ippei Sawaki ,  Yoshitaka Nakamura

发明人： Mi Xiaoyu ,  Satoshi Ueda ,  Hisao Okuda ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Norinao Kouma ,  Ippei Sawaki ,  Yoshitaka Nakamura

IPC分类号： G02B26/00

CPC分类号： G02B26/0841

摘要： A micro-oscillation element includes an oscillation section and a frame. The oscillation section is provided with a mirror surface and is connected to the frame via trapezoidal first and second springs. The oscillation section is located between the first spring and the second spring. Each of the first spring and the second spring is deformable along with the oscillation of the oscillation section.

摘要翻译： 微振荡元件包括振荡部和框架。 振荡部分设有镜面，通过梯形的第一和第二弹簧与框架相连。 振荡部分位于第一弹簧和第二弹簧之间。 第一弹簧和第二弹簧中的每一个与振荡部的振动一起是可变形的。

公开(公告)号：US07192879B2

公开(公告)日：2007-03-20

申请号：US11207871

申请日：2005-08-22

申请人： Norinao Kouma ,  Osamu Tsuboi ,  Hisao Okuda ,  Hiromitsu Soneda ,  Mi Xiaoyu ,  Satoshi Ueda ,  Ippei Sawaki ,  Yoshitaka Nakamura

发明人： Norinao Kouma ,  Osamu Tsuboi ,  Hisao Okuda ,  Hiromitsu Soneda ,  Mi Xiaoyu ,  Satoshi Ueda ,  Ippei Sawaki ,  Yoshitaka Nakamura

IPC分类号： H01L21/302

CPC分类号： B81C1/00626 ,  B81B2201/0235 ,  B81B2201/042 ,  B81B2203/0136 ,  B81B2203/04

摘要： A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.

摘要翻译： 提供一种微结构单元的制造方法。 通过该方法，在包括第一至第三导电层和两个绝缘层的材料基板上进行微加工，其中一个绝缘层介于第一和第二导电层之间，另一个位于第二和第三导电层之间。 该方法包括在不同厚度的材料基底的层上执行的几个蚀刻步骤。

公开(公告)号：US20060180883A1

公开(公告)日：2006-08-17

申请号：US11352200

申请日：2006-02-13

申请人： Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda

发明人： Norinao Kouma ,  Osamu Tsuboi ,  Hiromitsu Soneda ,  Satoshi Ueda

IPC分类号： H01L29/84 ,  H01L21/00

CPC分类号： G02B26/0841 ,  B81B3/0062 ,  B81B2201/033 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/058

摘要： A micro-oscillating element includes a frame, a movable functional portion, and a torsional joint for joining the frame and the functional portion. The micro-oscillating element also includes first and second comb-tooth electrodes for generation of the driving force for the oscillating motion of the movable functional portion about the torsional joint. The first comb-tooth electrode includes a plurality of first electrode teeth each having a first conductor, an insulator and a second conductor laminated in the direction of the oscillating motion, where the first conductor and the second conductor are electrically connected with each other. The second comb-tooth electrode includes a plurality of second electrode teeth caused not to face the second conductor but to face the first conductor of the first electrode teeth during non-operation. The second electrode teeth are longer than the first conductor in the direction of the oscillating motion.

公开(公告)号：US20060057761A1

公开(公告)日：2006-03-16

申请号：US11256959

申请日：2005-10-25

申请人： Xiaoyu Mi ,  Norinao Kouma ,  Osamu Tsuboi ,  Masafumi Iwaki ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Ippei Sawaki

发明人： Xiaoyu Mi ,  Norinao Kouma ,  Osamu Tsuboi ,  Masafumi Iwaki ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Ippei Sawaki

IPC分类号： H01L21/00

CPC分类号： B81C1/00547 ,  B81B2201/042 ,  B81B2203/0136 ,  B81C2201/0132 ,  B81C2201/0133 ,  G01P15/0802 ,  G02B26/0841

摘要： A method of making a microstructure with thin wall portions (T1-T3) includes a step of performing a first etching process to a material substrate having a laminate structure including a first conductive layer (11) and a second conductive layer (12) having a thickness of the thin wall portions (T1-T3), where the etching is performed from the side of the first conductive layer (11) thereby forming in the second conductive layer (12) pre thin wall portions (T1′-T3′) which has a pair of side surfaces apart from each other in an in-plane direction of the second conductive layer (12) and contact the first conductive layer (11). The method also includes a step of performing a second etching process from the side of the first conductive layer (11) for removing part of the first conductive layer (11) contacting the pre thin wall portions (T1′-T3′) to form the thin wall portions.

摘要翻译： 制造具有薄壁部分（T 1 -T 3）的微结构的方法包括对具有包括第一导电层（11）和第二导电层（12）的层压结构的材料基板进行第一蚀刻工艺的步骤， 具有薄壁部分（T 1 -T 3）的厚度，其中从第一导电层（11）的侧面进行蚀刻，从而在第二导电层（12）中形成预薄壁部分（T 1' -T 3'），其在第二导电层（12）的面内方向上具有彼此分离的一对侧表面，并与第一导电层（11）接触。 该方法还包括从第一导电层（11）侧进行第二蚀刻处理以去除与预薄壁部分（T 1'-T 3'）接触的第一导电层（11）的一部分的步骤 形成薄壁部分。