Abstract:
Bearing assemblies, apparatuses, and motor assemblies using the same are disclosed. In an embodiment, a bearing assembly may include a plurality of superhard bearing elements distributed circumferentially about an axis. Each of the superhard bearing elements may include a bearing surface. At least one of the plurality of superhard bearing elements may include at least one texture feature that may be formed in a lateral surface thereof. The bearing assembly may also include a support ring that carries the superhard bearing elements.
Abstract:
Methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) include partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDCs may include at least one stress relieving partition.
Abstract:
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
Abstract:
Embodiments of the invention relate to polycrystalline diamond compacts (“PDCs”) comprising a preformed polycrystalline diamond (“PCD”) table including a thermally-stable region having a copper-containing material disposed interstitially between bonded diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a preformed PCD table having an interfacial surface bonded to the substrate and a generally opposing upper surface. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween and defining a plurality of interstitial regions. The preformed PCD table further includes a first region extending inwardly from the upper surface that includes a copper-containing material disposed therein and a second region extending inwardly from the interfacial surface that includes a nickel-containing material disposed therein.
Abstract:
Embodiments of the invention relate to a polycrystalline diamond compact. In an embodiment, the polycrystalline diamond compact includes a substrate and a polycrystalline diamond table including a first polycrystalline diamond layer bonded to the substrate and at least a second polycrystalline diamond layer. At least an un-leached portion of the polycrystalline diamond table includes a plurality of diamond grains defining a plurality of interstitial regions and a metal-solvent catalyst occupying at least a portion of the plurality of interstitial regions. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oe or more and a specific magnetic saturation of about 15 G·cm3/g or less. The second polycrystalline diamond layer exhibits a second average diamond grain size that is less than a first average diamond grain size of the first polycrystalline diamond layer and/or the first polycrystalline diamond layer includes a tungsten-containing material therein.
Abstract:
Embodiments of the invention relate to a polycrystalline diamond compact. In an embodiment, the polycrystalline diamond compact includes a substrate and a polycrystalline diamond table including a first polycrystalline diamond layer bonded to the substrate and at least a second polycrystalline diamond layer. At least an un-leached portion of the polycrystalline diamond table includes a plurality of diamond grains defining a plurality of interstitial regions and a metal-solvent catalyst occupying at least a portion of the plurality of interstitial regions. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit a coercivity of about 115 Oe or more and a specific magnetic saturation of about 15 G·cm3/g or less. The second polycrystalline diamond layer exhibits a second average diamond grain size that is less than a first average diamond grain size of the first polycrystalline diamond layer and/or the first polycrystalline diamond layer includes a tungsten-containing material therein.