Process for producing anionic clays using magnesium acetate
    52.
    发明授权
    Process for producing anionic clays using magnesium acetate 失效
    使用醋酸镁生产阴离子粘土的方法

    公开(公告)号:US06333290B1

    公开(公告)日:2001-12-25

    申请号:US09247532

    申请日:1999-02-10

    IPC分类号: B01J2116

    摘要: Economical and environment-friendly processes for the synthesis of anionic clays and anionic clay-like materials with acetate anions as the charge-balancing interlayer species are disclosed. The processes involve combining a slurry of a gibbsite or its thermally treated form with a slurry or solution of a magnesium source and magnesium acetate. The product is not washed, needs no filtration and exists in a close-to-neutral pH condition. The product can be spray dried directly to form microspheres, or it can be extruded to form shaped bodies. Because of the absence of foreign salts, the product can be combined with other ingredients in the manufacture of catalysts, absorbents, pharmaceuticals, cosmetics, detergents and other commodity products that contain anionic clays.

    摘要翻译: 公开了用乙酸根阴离子作为电荷平衡层间物质合成阴离子粘土和阴离子粘土样材料的经济和环境友好的方法。 该方法包括将三水铝矿或其热处理形式的浆料与镁源和乙酸镁的浆液或溶液组合。 产品不经过洗涤,不需要过滤,并且处于接近于中性的pH条件下。 该产品可以直接喷雾干燥以形成微球体,或者可将其挤出形成成型体。 由于没有外来的盐,该产品可以与其他成分组合在催化剂,吸收剂,药物,化妆品,洗涤剂和其他含有阴离子粘土的商品中。

    Infra-red radiation sources
    54.
    发明授权
    Infra-red radiation sources 失效
    红外辐射源

    公开(公告)号:US6057532A

    公开(公告)日:2000-05-02

    申请号:US553309

    申请日:1996-03-15

    摘要: There is described an infra-red radiation source comprising an electrically conductive element (2) formed of a plurality of carbon fibres and connection means (3, 4, 5) for connecting the electrically conductive element (2) across an electrical power supply, said connection means (3, 4, 5) including at least one support member (3) formed of carbon and secured to one end of the electrically conductive element (2).

    摘要翻译: PCT No.PCT / GB94 / 01070 Sec。 371日期:1996年3月15日 102(e)1996年3月15日PCT PCT 1994年5月19日PCT公布。 WO94 / 28693 PCT出版物 日本1994年12月8日描述了一种红外辐射源,其包括由多个碳纤维形成的导电元件(2)和连接装置(3,4,5),用于将导电元件(2)跨越 电源,所述连接装置(3,4,5)包括至少一个由碳形成并被固定到导电元件(2)的一端的支撑构件(3)。

    Pillared clays
    55.
    发明授权
    Pillared clays 失效
    柱状粘土

    公开(公告)号:US5486499A

    公开(公告)日:1996-01-23

    申请号:US140007

    申请日:1993-02-03

    CPC分类号: B01J20/12

    摘要: A process for the production of an adsorbent suitable for use in the purification of edible oils such as soya oil comprising treating a layered clay mineral with a solution of a pillaring material such as a suitable aluminum cation so as to cause the adsorption of at least some of the pillaring material into the clay mineral and removing solvent to deposit pillaring material within the clay mineral, the process being characterized by the removal of at least some structural aluminum from the clay mineral by an acid treatment prior to contact with the pillaring material. The resulting pillared material, which can have a higher SiO.sub.2 :Al.sub.2 O.sub.3 ratio than normal as a result of the initial acid treatment can give chlorophyll adsorption capacity above 70% and even, in some instances, up to about 99%.

    摘要翻译: PCT No.PCT / GB92 / 00674 Sec。 371日期:1993年2月3日 102(e)日期1993年2月3日PCT提交1992年4月13日PCT公布。 公开号WO92 / 19533 日期:1992年11月12日。一种用于生产适用于纯化食用油如大豆油的吸附剂的方法,包括用诸如合适的铝阳离子的柱状材料的溶液处理层状粘土矿物,以便 导致至少一些柱状材料吸附到粘土矿物中并除去溶剂以在柱状矿物中沉积柱状材料,该方法的特征在于通过酸性处理从粘土矿物中除去至少一些结构铝,之前为 与支柱材料接触。 作为初始酸处理的结果,可以具有比正常更高的SiO 2 :Al 2 O 3比例的所得柱状材料可以使叶绿素吸附容量高于70%,甚至在一些情况下可达到约99%。

    MODULATED PRESSURE CONTROL OF BEVERAGE FILL FLOW

    公开(公告)号:US20220169492A1

    公开(公告)日:2022-06-02

    申请号:US17671401

    申请日:2022-02-14

    IPC分类号: B67D1/04 B67D1/00

    摘要: A method and apparatus of filing beverage combines pressurized beverage delivery (rather than gravity feed) with variable pressure control of the gas flow from the can during snift. By modulating beverage flow and especially pressure, it is possible to saturate a beverage, or optionally fill a can's widget with gas with a shorter set of fill steps. In addition, the speed of beverage filling can be dramatically increased compared to small scale systems normally used. Unlike known large scale pressure systems, the beverage bowl may be located beneath the rest of the apparatus and modulated pressure may be used, making for a smaller and more portable unit.

    Electronically regulated temperature compression brace

    公开(公告)号:US10912672B1

    公开(公告)日:2021-02-09

    申请号:US15949173

    申请日:2018-04-10

    IPC分类号: A61F7/00 A61H11/00 A61F7/02

    摘要: The electronically regulated temperature compression device is a brace that applies pressure to an appendage. The electronically regulated temperature compression device applies heat therapy and cooling therapy to the appendage. The temperature of the selected therapy is electronically regulated and controlled. The electronically regulated temperature compression device uses a refrigerant-based heat exchange mechanism during the therapy process. The electronically regulated temperature compression device comprises a composite textile, plurality of fasteners, and a controller. The plurality of fasteners attaches the composite textile to the appendage of the patient. The plurality of fasteners controls the pressure applied by the composite textile to the appendage. The composite textile is a temperature controlled textile used to generate a heat exchange between the electronically regulated temperature compression device and the appendage. The controller manages the temperature and flow of the refrigerant during the therapy process.

    CIRCUIT AND METHOD FOR INTERCONNECTING STACKED INTEGRATED CIRCUIT DIES
    59.
    发明申请
    CIRCUIT AND METHOD FOR INTERCONNECTING STACKED INTEGRATED CIRCUIT DIES 有权
    用于互连堆叠集成电路的电路和方法

    公开(公告)号:US20110237029A1

    公开(公告)日:2011-09-29

    申请号:US13156265

    申请日:2011-06-08

    IPC分类号: H01L21/98

    摘要: Signals are routed to and from identical stacked integrated circuit dies by selectively coupling first and second bonding pads on each of the dies to respective circuits fabricated on the dies through respective transistors. The transistors connected to the first bonding pads of an upper die are made conductive while the transistors connected to the second bonding pads of the upper die are made non-conductive. The transistors connected to the second bonding pads of a lower die are made conductive while the transistors connected to the first bonding pads of the lower die are made non-conductive. The second bonding pads of the upper die are connected to the second bonding pads of the lower die through wafer interconnects extending through the upper die. Signals are routed to and from the circuits on the first and second dies through the first and second bonding pads, respectively.

    摘要翻译: 通过选择性地将每个管芯上的第一和第二接合焊盘与通过相应的晶体管在管芯上制造的各个电路相耦合,将信号路由至相同的堆叠集成电路管芯。 连接到上模的第一接合焊盘的晶体管导通,而连接到上模的第二焊盘的晶体管是不导电的。 连接到下模的第二接合焊盘的晶体管被​​导通,而连接到下模的第一焊盘的晶体管导通。 上模的第二接合焊盘通过延伸穿过上模的晶片互连连接到下模的第二焊盘。 信号分别通过第一和第二接合焊盘被引导到第一和第二裸片上的电路和从第一和第二裸片上的电路。