公开(公告)号：US20090203169A1

公开(公告)日：2009-08-13

申请号：US11814337

申请日：2006-02-02

申请人： Yoshihiro Tomita ,  Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Toshio Fujii

发明人： Yoshihiro Tomita ,  Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Toshio Fujii

IPC分类号： H01L21/60 ,  H01L21/768

CPC分类号： H05K3/3436 ,  H01L21/565 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/742 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0285 ,  Y02P70/613 ,  H01L2224/05599

摘要： In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.

摘要翻译： 在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接 端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供含有导电颗粒（12）的树脂（13），导电颗粒（12） ）和树脂（13）被加热和熔化，并且施加振动以使其流动。 允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。 树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成 用于以均匀的方式在这些端子之间建立电连接的连接器。

公开(公告)号：US20080142966A1

公开(公告)日：2008-06-19

申请号：US11885562

申请日：2006-03-06

申请人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita

发明人： Koichi Hirano ,  Seiji Karashima ,  Takashi Ichiryu ,  Yoshihiro Tomita

IPC分类号： H01L23/48 ,  H01L21/60 ,  C08K3/10 ,  C08L75/00 ,  C08L67/00 ,  C08G59/00 ,  C08L31/00 ,  C08L9/00 ,  H01L21/44

CPC分类号： H01L24/81 ,  H01L21/6835 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/1152 ,  H01L2224/11524 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/293 ,  H01L2224/294 ,  H01L2224/73104 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： There is provided a composition that is suitably used for a flip chip mounting process or a bump-forming process. The composition comprises a first component 3a, a second component 3b, metal particles 1,1′ and a convection additive. The metal particles 1,1′ are dispersed in the second component 3b. The convection additive is contained in the second component 3b. The first component 3a is contained in an interior of at least one particle 1. When such at least one metal particle 1 melts upon heating, the first component 3a comes in contact with the second component 3b to form a thermoset resin 3c. The convection additive is capable of generating a gas upon heating, so that the gas provides a convection effect in the composition.

摘要翻译： 提供了适合用于倒装芯片安装工艺或凹凸形成工艺的组合物。 组合物包含第一组分3a，第二组分3b，金属颗粒1,1'和对流添加剂。 金属颗粒1,1'分散在第二部件3b中。 对流添加剂包含在第二组分3b中。 第一组分3a包含在至少一个颗粒1的内部。 当这样的至少一种金属颗粒1在加热时熔化时，第一组分3a与第二组分3b接触以形成热固性树脂3c。 对流添加剂能够在加热时产生气体，使得气体在组合物中提供对流效果。