公开(公告)号：US11710812B2

公开(公告)日：2023-07-25

申请号：US17332378

申请日：2021-05-27

申请人： EPISTAR CORPORATION

发明人： Min-Hsun Hsieh ,  Hsin-Mao Liu ,  Ying-Yang Su

IPC分类号： H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L27/15 ,  H01L33/60 ,  H01L23/00

CPC分类号： H01L33/58 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/505 ,  H01L33/60 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L33/50 ,  H01L2224/06102 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83886 ,  H01L2933/0058

摘要： A light-emitting device includes a light-emitting element having a first-type semiconductor layer, a second-type semiconductor layer, an active stack between the first-type semiconductor layer and the second-type semiconductor layer, a bottom surface, and a top surface. A first electrode is disposed on the bottom surface and electrically connected to the first-type semiconductor layer. A second electrode is disposed on the bottom surface and electrically connected to the second-type semiconductor layer. A supporting structure is disposed on the top surface. The supporting structure has a thickness and a maximum width. A ratio of the maximum width to the thickness is of 2˜150.

公开(公告)号：US09656353B2

公开(公告)日：2017-05-23

申请号：US14353495

申请日：2012-10-26

申请人： Hitachi Chemical Company, Ltd.

发明人： Kazuhiro Miyauchi ,  Naoya Suzuki ,  Nozomu Takano ,  Yukihiko Yamashita

IPC分类号： H01L23/00 ,  H01L23/498 ,  B23K35/362 ,  B23K35/26 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  B23K35/02 ,  H01L21/48 ,  H01L23/488 ,  H01L21/56 ,  H05K3/34 ,  B23K1/00 ,  B23K1/06 ,  B23K35/30 ,  B23K35/36 ,  B23K1/012 ,  B23K1/20 ,  B23K101/40 ,  B23K101/42

CPC分类号： B23K35/362 ,  B23K1/0016 ,  B23K1/012 ,  B23K1/06 ,  B23K1/203 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/11436 ,  H01L2224/11522 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/81075 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2224/83886 ,  H01L2224/8391 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

公开(公告)号：US20160254244A1

公开(公告)日：2016-09-01

申请号：US15152530

申请日：2016-05-11

申请人： SunRay Scientific, LLC

发明人： S. Kumar Khanna

IPC分类号： H01L23/00 ,  H05K1/18 ,  H05K1/02 ,  H01L23/66 ,  H05K1/09 ,  H01L33/62 ,  H01L25/065 ,  H01L25/075 ,  H05K1/11 ,  H05K1/03

CPC分类号： H01L24/32 ,  C08K9/08 ,  C09J9/02 ,  C09J11/00 ,  H01L23/66 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0753 ,  H01L33/62 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/16505 ,  H01L2224/2732 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/29395 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29488 ,  H01L2224/2949 ,  H01L2224/29493 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/3213 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/33183 ,  H01L2224/73204 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75264 ,  H01L2224/75272 ,  H01L2224/75804 ,  H01L2224/83001 ,  H01L2224/83055 ,  H01L2224/831 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2224/83906 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/0675 ,  H01L2924/12041 ,  H01L2924/1421 ,  H05K3/323 ,  H05K2203/104 ,  H01L2924/01006 ,  H01L2924/066 ,  H01L2924/00012 ,  H01L2224/83886 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/0635 ,  H01L2924/0625 ,  H01L2924/095

摘要： Illustrative embodiments of systems and method utilizing anisotropic conductive adhesive(s) (“ACA”) are disclosed. In at least one illustrative embodiment, a substrate may comprise one or more electrical contacts, and one or more integrated circuits may be secured to the substrate by ACA. The ACA may comprise a plurality of particles suspended in a binder, where the plurality of particles form electrically conductive and isolated parallel paths between the one or more electrical contacts and the one or more integrated circuits as a result of the ACA being subjected to a magnetic field before or during curing of the binder.

摘要翻译： 公开了使用各向异性导电粘合剂（“ACA”）的系统和方法的说明性实施例。 在至少一个说明性实施例中，衬底可以包括一个或多个电触点，并且一个或多个集成电路可以通过ACA固定到衬底。 ACA可以包括悬挂在粘合剂中的多个颗粒，其中多个颗粒在一个或多个电触点与一个或多个集成电路之间形成导电和隔离的平行路径，作为ACA受到磁性的结果 在粘合剂固化之前或期间。

公开(公告)号：US20140317918A1

公开(公告)日：2014-10-30

申请号：US14325517

申请日：2014-07-08

申请人： Electronics and Telecommunications Research Institute

发明人： Yong Sung EOM ,  Jong Tae MOON ,  Sangwon OH ,  Keonsoo JANG

IPC分类号： H05K3/46

CPC分类号： H05K13/0465 ,  B23K3/0623 ,  B23K35/24 ,  B23K35/34 ,  B23K35/3601 ,  B23K35/3613 ,  B23K2101/36 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/1141 ,  H01L2224/1152 ,  H01L2224/1184 ,  H01L2224/16238 ,  H01L2224/27416 ,  H01L2224/2784 ,  H01L2224/3003 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81355 ,  H01L2224/83886 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/46 ,  H05K2201/026 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/49126

摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

摘要翻译： 提供了用于各向异性导电粘合剂的组合物，形成焊料凸块的方法和使用其形成倒装芯片的方法。 用于各向异性导电粘合剂的组合物包括低熔点焊料颗粒和热固性聚合物树脂。 各向异性导电粘合剂包括通过混合聚合物树脂和固化剂形成混合物，并将变形剂，催化剂或还原剂与混合物混合。

公开(公告)号：US20140317915A1

公开(公告)日：2014-10-30

申请号：US14325482

申请日：2014-07-08

申请人： Electronics and Telecommunications Research Institute

发明人： Yong Sung EOM ,  Jong Tae MOON ,  Sangwon OH ,  Keonsoo JANG

IPC分类号： H05K13/04

CPC分类号： H05K13/0465 ,  B23K3/0623 ,  B23K35/24 ,  B23K35/34 ,  B23K35/3601 ,  B23K35/3613 ,  B23K2101/36 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/1141 ,  H01L2224/1152 ,  H01L2224/1184 ,  H01L2224/16238 ,  H01L2224/27416 ,  H01L2224/2784 ,  H01L2224/3003 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81355 ,  H01L2224/83886 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/46 ,  H05K2201/026 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/49126

摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

公开(公告)号：US08802760B2

公开(公告)日：2014-08-12

申请号：US13835791

申请日：2013-03-15

申请人： Electronics and Telecommunications Research Institute

发明人： Yong Sung Eom ,  Jong Tae Moon ,  Sangwon Oh ,  Keonsoo Jang

IPC分类号： B23K35/24 ,  H05K3/34 ,  H05K13/04 ,  B82Y10/00 ,  B23K3/06 ,  B23K35/36 ,  B23K35/34 ,  H05K3/32

CPC分类号： H05K13/0465 ,  B23K3/0623 ,  B23K35/24 ,  B23K35/34 ,  B23K35/3601 ,  B23K35/3613 ,  B23K2101/36 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/1141 ,  H01L2224/1152 ,  H01L2224/1184 ,  H01L2224/16238 ,  H01L2224/27416 ,  H01L2224/2784 ,  H01L2224/3003 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81355 ,  H01L2224/83886 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/46 ,  H05K2201/026 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/49126

摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

摘要翻译： 提供了用于各向异性导电粘合剂的组合物，形成焊料凸块的方法和使用其形成倒装芯片的方法。 用于各向异性导电粘合剂的组合物包括低熔点焊料颗粒和热固性聚合物树脂。 各向异性导电粘合剂包括通过混合聚合物树脂和固化剂形成混合物，并将变形剂，催化剂或还原剂与混合物混合。

公开(公告)号：US20130200135A1

公开(公告)日：2013-08-08

申请号：US13835791

申请日：2013-03-15

申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTIUTE

发明人： Yong Sung EOM ,  Jong Tae MOON ,  Sangwon OH ,  Keonsoo JANG

IPC分类号： B23K35/24 ,  H05K13/04

CPC分类号： H05K13/0465 ,  B23K3/0623 ,  B23K35/24 ,  B23K35/34 ,  B23K35/3601 ,  B23K35/3613 ,  B23K2101/36 ,  B82Y10/00 ,  H01L24/29 ,  H01L24/30 ,  H01L24/83 ,  H01L2224/1141 ,  H01L2224/1152 ,  H01L2224/1184 ,  H01L2224/16238 ,  H01L2224/27416 ,  H01L2224/2784 ,  H01L2224/3003 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81355 ,  H01L2224/83886 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/46 ,  H05K2201/026 ,  H05K2201/10977 ,  Y10T29/49117 ,  Y10T29/49126

摘要： Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

摘要翻译： 提供了用于各向异性导电粘合剂的组合物，形成焊料凸块的方法和使用其形成倒装芯片的方法。 用于各向异性导电粘合剂的组合物包括低熔点焊料颗粒和热固性聚合物树脂。 各向异性导电粘合剂包括通过混合聚合物树脂和固化剂形成混合物，并将变形剂，催化剂或还原剂与混合物混合。

公开(公告)号：US20120261174A1

公开(公告)日：2012-10-18

申请号：US13518798

申请日：2010-12-17

申请人： Toshiaki Chuma ,  Tomohiro Kagimoto

发明人： Toshiaki Chuma ,  Tomohiro Kagimoto

IPC分类号： H05K7/02 ,  B32B27/42 ,  B32B15/098 ,  B32B5/16 ,  H05K1/11 ,  F27D3/00

CPC分类号： H05K3/3478 ,  C08L63/00 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/1152 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/2912 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/2916 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83205 ,  H01L2224/83222 ,  H01L2224/83801 ,  H01L2224/83862 ,  H01L2224/83885 ,  H01L2224/83886 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/3489 ,  H05K3/4007 ,  H05K2203/0405 ,  H05K2203/0425 ,  H05K2203/043 ,  Y10T428/25 ,  Y10T428/31678 ,  Y10T428/31688 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a conductive connecting material 30 used to form conductive portions on a plurality of terminals 11 of an electronic member having a substrate 10 and the plurality of terminals 11 provided on the substrate 10, comprising a metal layer 110 and a resin layer 120 having a resin component and a filler, in which the metal layer is aggregated on each of terminals to form the conductive portions on the plurality of terminals by bringing the conductive connecting material into contact with the plurality of terminals and heating the conductive connecting material.

摘要翻译： 公开了一种用于在具有基板10的电子部件的多个端子11上形成导电部分的导电连接材料30和设置在基板10上的多个端子11，其包括金属层110和具有 树脂组分和填料，其中通过使导电连接材料与多个端子接触并加热导电连接材料，金属层在每个端子上聚集以在多个端子上形成导电部分。

公开(公告)号：US07911064B2

公开(公告)日：2011-03-22

申请号：US11908087

申请日：2006-02-28

申请人： Shingo Komatsu ,  Seiichi Nakatani ,  Seiji Karashima ,  Toshiyuki Kojima ,  Takashi Kitae ,  Yoshihisa Yamashita

发明人： Shingo Komatsu ,  Seiichi Nakatani ,  Seiji Karashima ,  Toshiyuki Kojima ,  Takashi Kitae ,  Yoshihisa Yamashita

IPC分类号： H01L21/44 ,  H01L23/52 ,  H01L23/40 ,  H01L23/48 ,  H01L21/00

CPC分类号： H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83886 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00

摘要： A mounted body of the present invention includes: a multilayer semiconductor chip 20 including a plurality of semiconductor chips 10 (10a, 10b) that are stacked; and a mounting board 13 on which the multilayer semiconductor chip 20 is mounted. In this mounted body, each of the semiconductor chips 10 (10a, 10b) in the multilayer semiconductor chip 20 has a plurality of element electrodes 12 (12a, 12b) on a chip surface 21 (21a, 21b) facing toward the mounting board 13. On the mounting board 13, electrode terminals 14 are formed so as to correspond to the plurality of element electrodes (12a, 12b), respectively, and the electrode terminals 14 of the mounting board and the element electrodes (12a, 12b) are connected electrically to each other via solder bump formed as a result of assembly of solder particles. With this configuration, a mounted body on which a stacked package is mounted can be manufactured easily.

摘要翻译： 本发明的安装体包括：层叠半导体芯片10（10a，10b）的多层半导体芯片20， 以及安装基板13，其上安装有多层半导体芯片20。 在该安装体中，多层半导体芯片20中的各半导体芯片10（10a，10b）在与安装基板13相对的芯片面21（21a，21b）上具有多个元件电极12（12a，12b） 在安装基板13上分别形成有与多个元件电极（12a，12b）对应的电极端子14，并且安装基板的电极端子14和元件电极（12a，12b）被连接 通过焊料颗粒的组装形成的焊锡凸块彼此电连接。 利用这种结构，可以容易地制造安装有堆叠的包装的安装体。

公开(公告)号：US07850803B2

公开(公告)日：2010-12-14

申请号：US11783750

申请日：2007-04-11

申请人： Tsukasa Shiraishi ,  Seiichi Nakatani

发明人： Tsukasa Shiraishi ,  Seiichi Nakatani

IPC分类号： B32B37/00

CPC分类号： H05K3/3484 ,  B01D21/283 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/31 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H05K3/323 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

摘要翻译： 将分散有导电粒子的液态树脂供给到电路基板与设置为彼此相对的半导体芯片之间，并且具有与电路基板的表面垂直的振幅的超声波，以产生驻波 在树脂中。 然后，分散在树脂中的导电颗粒在驻波的节点处被捕获，以在半导体芯片的连接端子和电路基板的端子之间形成导电颗粒的聚集的连接体。 因此，半导体芯片经由连接体安装在电路基板上。 端子排列成彼此间隔开驻波的一半波长，并且在树脂中的端子之间的位置处产生驻波的每个节点。