摘要:
A semiconductor memory device includes a memory cell, a word line, a bit line pair having a first bit line and a second bit line complementary to the first bit line, a p type well, first and second source lines, a source line precharge circuit for precharging the first and second source lines, a sense amplifier connected between the first and second bit lines, driven by the first and second source lines and including first and second n channel MOS transistors formed in the p type well and third and fourth p channel MOS transistors, a first sense amplifier enable transistor connected between a power supply potential node and the first source line, a second sense amplifier enable transistor connected between a ground potential node and the second source line, and a switching circuit connected between the first source line and the p type well, and turning on in response to a control signal when the sense amplifier is active.
摘要:
In the normal mode, a first voltage-down converter down-converts an external power supply voltage to provide a large, first internal power supply voltage to the peripheral circuitry via a first internal power supply voltage supplying line, and a second voltage-down converter down-converts the external power supply voltage to provide a smaller, second internal power supply voltage to a memory cell array via a second internal power supply voltage supplying line. This allows fast operation and reduction in power consumption. In conducting a burn-in test, an external power supply voltage supplying line is connected to the first and second internal power supply voltage supplying lines. Thus, the first and second internal power supply voltage supplying lines directly receive the external power supply voltage. This allows an effective burn-in test. In a burn-in test, the first and second voltage-down converters are inactivated.
摘要:
In a semiconductor integrated circuit device, a voltage setting circuit for setting a voltage level on the sub power source voltage line according to a reference voltage from a reference voltage generating circuit, is provided between a main power source voltage line and a sub power source voltage line. While a current consumption at the standby cycle is reduced, increase of the access delay is prevented. The voltage setting circuit includes a differential amplifier for differentially amplifying a voltage on the sub power source line and the reference voltages and a transistor responsive to an output of the differential amplifier for causing a current flow between the main and sub power source lines, or alternatively a diode-connected insulated gate type transistor receiving the reference voltage at a back gate thereof.
摘要:
In a content addressable memory device, before search operations in two TCAM cells connected to first and second match lines, respectively, a memory controller connects the first match line to a power source and connects the second match line to a ground, and then connects the first and second match lines to each other so as that electric potentials of the first and second match lines are the same as each other.
摘要:
A semiconductor memory device operable for reading and writing in a normal mode and in a test mode is divided into memory cell sections each having blocks of memory cells. Data bus lines are connected to the respective blocks, and switches interconnect data bus lines connected to blocks of the different sections. The switch are made conductive during reading and writing in the normal mode and during writing in the test mode, and nonconductive during reading in the test mode. Input data are applied onto the data bus lines connected to one of the blocks for writing in the blocks of the sections simultaneously during writing in the normal mode and in the test mode. In the normal mode, data are read out of the blocks of the sections through the data bus lines connected to the above-mentioned one of the blocks. In the test mode, the data are read out of the blocks of the sections through the data bus lines connected to the respective blocks.
摘要:
In a metal-oxide semiconductor (MOS) dynamic formed on a semiconductor substrate, data nodes of a first flip-flop are connected to a first pair of folded bit lines. Its power supply node is connected through a switch to a first power supply (Vss). Data nodes of a second flip-flop are connected to a second pair of folded bit lines. Its power supply node is connected through a switch to the first power supply (Vss). A power supply node of a third flip-flop is connected through a switch to a second power supply (Vcc). Data nodes of the third flip-flop are coupled through a first pair of transfer gates to the first pair of the folded bit lines, and through a second pair of transfer gates to the second pair of the folded bit lines. Coupling the first to the third flip-flops forms a first sense amplifier and coupling the second to the third flip-flops forms a second sense amplifier.
摘要:
A CMOS row decoder circuit in which a row decoder for selecting a single word line from a memory cell array and a column decoder for selecting a single bit line can use in common an internal address signal transmission line. The row decoder circuit comprises a series of MOSFETs of a first conductivity type which is turned on or off in response to address signals selected from external address signals, a second MOSFET of a second conductivity type provided between a power supply potential and the series of MOSFETs and having a gate receiving a first timing signal for providing decoding timing of the address signals, a third MOSFET of the first conductivity type provided between the series of MOSFETs and the second MOSFET and having a gate receiving a first operation timing signal, a fourth MOSFET which is turned on or off in response to a second operation timing signal for transmitting the potential of a node of the second MOSFET and the third MOSFET, and a fifth MOSFET having a gate receiving an output of the fourth MOSFET for transmitting a word line driving signal to a corresponding word line.
摘要:
A semiconductor memory device operable for reading and writing in a normal mode and in a test mode is divided into memory cell sections each having blocks of memory cells. Data bus lines are connected to the respective blocks, and switches interconnect data bus lines connected to blocks of the different sections. The switches are made conductive during reading and writing in the normal mode and during writing in the test mode, and nonconductive during reading in the test mode. Input data are applied onto the data bus lines connected to one of the blocks for writing in the blocks of the sections simultaneously during writing in the normal mode and in the test mode. In the normal mode, data are read out of the blocks of the sections through the data bus lines connected to the above-mentioned one of the blocks. In the test mode, the data are read out of the blocks of the sections through the data bus lines connected to the respective blocks.
摘要:
A memory cell array is divided into two groups, one bit line of a pair of bit lines is connected to corresponding memory cells in the first group of the memory cell array, and the other bit line thereof is connected to corresponding memory cells in the second group of the memory cell array.
摘要:
In a semiconductor memory device of a redundancy configuration having lines (rows or columns) of main memory cells and a line of spare memory cells made to substitute a defective line responsive to the address of the defective line, a comparator compares an address input to the memory device, with the address of the defective line which has been programmed in it, and a spare line selector selects the spare line when the input address is found to coincide with the programmed address. The comparator comprises a dynamic NOR gate having discharge paths each formed of a gate element receiving a bit or its inversion of the input address to be opened or closed depending on the value of the particular bit of the input address currently applied, and a PROM element in series with the gate element. The dynamic NOR gate has a first node forming an output thereof and a second node, each of the series connections of the PROM element and the gate element is connected across the first and the second nodes. The potential on the second node is caused to be identical with the potential on the first node during the precharge period.