Active liquid metal thermal spreader
    51.
    发明授权
    Active liquid metal thermal spreader 失效
    主动液态金属散热器

    公开(公告)号:US07265977B2

    公开(公告)日:2007-09-04

    申请号:US11037441

    申请日:2005-01-18

    CPC classification number: H01L23/473 H01L2924/0002 H01L2924/00

    Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

    Abstract translation: 本发明是用于冷却半导体热源的方法和装置。 在一个实施例中,提供了散热器,并且包括用于支撑半导体热源的衬底和耦合到衬底的散热器。 通道设置在散热器和基板之间。 该通道具有至少一个由散热器限定的壁。 由散热器限定的通道壁的表面积为半导体热源的底面的表面积的约10至约100倍。 冷却剂,例如液态金属,在通道内循环。

    Thermal interface apparatus
    52.
    发明申请
    Thermal interface apparatus 有权
    热接口设备

    公开(公告)号:US20070177367A1

    公开(公告)日:2007-08-02

    申请号:US11344657

    申请日:2006-02-01

    CPC classification number: H01L23/42 H01L23/26 H01L2924/0002 H01L2924/00

    Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

    Abstract translation: 一种用于将热量从计算机部件传导到散热器的装置。 本发明可以包括热界面材料(TIM)。 本发明还可以包括至少部分地包围TIM的密封件或垫圈。 垫圈可以有助于将TIM保持在其侧壁内,从而在计算机部件上或附近保持适当的位置。 通常,垫圈可以放置在计算机部件(或者硅板或计算机部件所在的其它材料)和散热器之间。 插入件可以放置在垫圈内并且限定孔。 芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。 干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

    Structure for cooling a surface
    53.
    发明申请
    Structure for cooling a surface 失效
    用于冷却表面的结构

    公开(公告)号:US20060157858A1

    公开(公告)日:2006-07-20

    申请号:US11037670

    申请日:2005-01-18

    CPC classification number: H01L23/473 H01L2924/0002 H01L2924/00

    Abstract: An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.

    Abstract translation: 一种用于冷却表面的装置,其具有由具有高导热性的材料制成的金属结构,并且被设计成在使金属结构和表面之间的机械应力最小化的同时提供有效的表面冷却。

    High turbulence heat exchanger
    55.
    发明申请
    High turbulence heat exchanger 审中-公开
    高湍流换热器

    公开(公告)号:US20060157225A1

    公开(公告)日:2006-07-20

    申请号:US11037918

    申请日:2005-01-18

    CPC classification number: H01L23/473 H01L2924/0002 H01L2924/00

    Abstract: The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first surface and an opposing second surface. A mesh plug is disposed in the channel for turbulently mixing the coolant within the channel. The first surface of the channel is disposed proximate a semiconductor heat source. In one embodiment the first surface comprises plastic. In one embodiment, the second surface comprises metal, for example, copper. In one embodiment the mesh plug comprises a nickel-coated copper mesh.

    Abstract translation: 本发明是用于冷却热源的方法和装置。 在一个实施例中,提供了热交换器,并且包括用于接收冷却剂的通道,该通道具有第一表面和相对的第二表面。 通道中布置网状塞,用于在通道内湍流地混合冷却剂。 通道的第一表面靠近半导体热源设置。 在一个实施例中,第一表面包括塑料。 在一个实施例中,第二表面包括金属,例如铜。 在一个实施例中,网孔包括镀镍铜网。

    Method and apparatus for chip cooling using a liquid metal thermal interface
    57.
    发明申请
    Method and apparatus for chip cooling using a liquid metal thermal interface 审中-公开
    使用液态金属热界面进行芯片冷却的方法和装置

    公开(公告)号:US20060131738A1

    公开(公告)日:2006-06-22

    申请号:US11220825

    申请日:2005-09-06

    Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling using a liquid metal thermal interface. One embodiment of an inventive thermal interface for facilitating thermal contact between opposing surfaces of an integrated circuit chip and a heat sink the thermal interface includes a liquid metal layer comprising a thermally conductive liquid metal material. A first barrier layer bonds the liquid metal layer to the surface of the integrated circuit chip, and a second barrier layer bonds the liquid metal layer to the surface of the heat sink.

    Abstract translation: 在一个实施例中,本发明是一种使用液态金属热界面进行芯片冷却的方法和装置。 用于促进集成电路芯片和散热器的相对表面之间的热接触的本发明热界面的一个实施例,热界面包括包含导热液体金属材料的液态金属层。 第一阻挡层将液态金属层结合到集成电路芯片的表面,并且第二阻挡层将液态金属层结合到散热器的表面。

    Assembly for writing and/or erasing high density data on a media
    59.
    发明授权
    Assembly for writing and/or erasing high density data on a media 有权
    用于在介质上写入和/或擦除高密度数据的组件

    公开(公告)号:US06920088B2

    公开(公告)日:2005-07-19

    申请号:US09774943

    申请日:2001-01-31

    Abstract: The invention discloses an assembly capable of writing/erasing high-density data, preferably on a phase-change recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the assembly, preferably for writing in a substantially thermal near-field mode. The invention provides advantages of writing densities greater than that of diffraction limited systems, for example, writing densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.

    Abstract translation: 本发明公开了一种能够写入/擦除高密度数据的组件,优选地在相变记录介质上。 本发明的优选实施例的特征在于一种新的热近场加热器,其可用于组件中,优选用于以基本上热的近场模式进行写入。 本发明提供了比衍射受限系统的写入密度更大的优点,例如大约大于100Gbit /英寸2的写入密度以及大约大于100MHz的写入速度。

    Interferometric near-field apparatus based on multi-pole sensing
    60.
    发明授权
    Interferometric near-field apparatus based on multi-pole sensing 失效
    基于多极感测的干涉近场设备

    公开(公告)号:US5623338A

    公开(公告)日:1997-04-22

    申请号:US511169

    申请日:1995-08-04

    CPC classification number: G01Q60/22 B82Y20/00 B82Y35/00 Y10S977/862

    Abstract: An apparatus suitable for providing near-field measurements of a workpiece. The apparatus comprises a source of electromagnetic radiation for generating an incident wave; means for directing at least a portion of the incident wave to the workpiece; a probe tip acting as an antenna and capable of re-radiating a signal wave, said signal wave developing as an interactive coupling between said workpiece and said probe tip; means for creating an interference signal based on the signal wave and a reference wave; and a detector for interrogating at least one of the phase and amplitude of the interference signal.

    Abstract translation: 适用于提供工件的近场测量的装置。 该装置包括用于产生入射波的电磁辐射源; 用于将至少一部分入射波引导到工件的装置; 用作天线并能够重新辐射信号波的探针尖端,所述信号波作为所述工件和所述探针尖端之间的交互耦合而发展; 用于基于所述信号波和参考波产生干扰信号的装置; 以及用于询问所述干扰信号的相位和幅度中的至少一个的检测器。

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