Abstract:
The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.
Abstract:
An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
Abstract:
An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.
Abstract:
A method (and system) for non-destructive measurement of a depth of a feature in a structure, includes using a scanning electron microscope (SEM) image to navigate to find the feature in an X-ray image, using an electron beam to produce a fluorescent emission in the feature, and using an X-ray count made at a position of the feature in the X-ray image, to determine a depth of the feature.
Abstract:
The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first surface and an opposing second surface. A mesh plug is disposed in the channel for turbulently mixing the coolant within the channel. The first surface of the channel is disposed proximate a semiconductor heat source. In one embodiment the first surface comprises plastic. In one embodiment, the second surface comprises metal, for example, copper. In one embodiment the mesh plug comprises a nickel-coated copper mesh.
Abstract:
An apparatus (and method) for referencing a surface of a workpiece during imprint lithography, includes an air bearing for mechanically referencing a surface of the workpiece, and a lithographic template coupled to the air bearing.
Abstract:
In one embodiment, the present invention is a method and apparatus for chip cooling using a liquid metal thermal interface. One embodiment of an inventive thermal interface for facilitating thermal contact between opposing surfaces of an integrated circuit chip and a heat sink the thermal interface includes a liquid metal layer comprising a thermally conductive liquid metal material. A first barrier layer bonds the liquid metal layer to the surface of the integrated circuit chip, and a second barrier layer bonds the liquid metal layer to the surface of the heat sink.
Abstract:
A heating device for a magnetic recording head includes first and second separating layers, the first separating layer having preferably a higher or equal thermal resistance than the first separating layer, and a heater formed between the first and second separating layers. A magnetic recording head for recording on magnetic medium includes a heating device which generates a heat spot on the magnetic medium which is larger than a magnetic track width, and/or heats a portion of the magnetic recording head which is on a leading edge side of a write gap in the magnetic recording head.
Abstract:
The invention discloses an assembly capable of writing/erasing high-density data, preferably on a phase-change recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the assembly, preferably for writing in a substantially thermal near-field mode. The invention provides advantages of writing densities greater than that of diffraction limited systems, for example, writing densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.
Abstract:
An apparatus suitable for providing near-field measurements of a workpiece. The apparatus comprises a source of electromagnetic radiation for generating an incident wave; means for directing at least a portion of the incident wave to the workpiece; a probe tip acting as an antenna and capable of re-radiating a signal wave, said signal wave developing as an interactive coupling between said workpiece and said probe tip; means for creating an interference signal based on the signal wave and a reference wave; and a detector for interrogating at least one of the phase and amplitude of the interference signal.