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    Thermal interface apparatus
    1.
    发明申请
    Thermal interface apparatus 有权
    热接口设备

    公开(公告)号：US20070177367A1

    公开(公告)日：2007-08-02

    申请号：US11344657

    申请日：2006-02-01

    申请人： Sean Bailey ,  Richard Blanco ,  David Edwards ,  Supratik Guha ,  Michael Hillman ,  Yves Martin ,  Phillip Mort ,  Roger Schmidt ,  Prabjit Singh ,  Ronald Smith ,  Gregory Tice ,  Theodore van Kessel

    发明人： Sean Bailey ,  Richard Blanco ,  David Edwards ,  Supratik Guha ,  Michael Hillman ,  Yves Martin ,  Phillip Mort ,  Roger Schmidt ,  Prabjit Singh ,  Ronald Smith ,  Gregory Tice ,  Theodore van Kessel

    IPC分类号： H05K7/12

    CPC分类号： H01L23/42 ,  H01L23/26 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

    摘要翻译： 一种用于将热量从计算机部件传导到散热器的装置。 本发明可以包括热界面材料（TIM）。 本发明还可以包括至少部分地包围TIM的密封件或垫圈。 垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。 通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。 插入件可以放置在垫圈内并且限定孔。 芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。 干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

    Heterogeneous thermal interface for cooling
    3.
    发明申请
    Heterogeneous thermal interface for cooling 有权
    用于冷却的异质热界面

    公开(公告)号：US20060157223A1

    公开(公告)日：2006-07-20

    申请号：US11037913

    申请日：2005-01-18

    申请人： Jeffrey Gelorme ,  Supratik Guha ,  Nancy LaBianca ,  Yves Martin ,  Theodore Van Kessel

    发明人： Jeffrey Gelorme ,  Supratik Guha ,  Nancy LaBianca ,  Yves Martin ,  Theodore Van Kessel

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3733 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

    摘要翻译： 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。

    Grid-line-free contact for a photovoltaic cell
    4.
    发明授权
    Grid-line-free contact for a photovoltaic cell 有权
    光伏电池的无栅极接触

    公开(公告)号：US08115097B2

    公开(公告)日：2012-02-14

    申请号：US12621685

    申请日：2009-11-19

    申请人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. van Kessel

    发明人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. van Kessel

    IPC分类号： H01L31/18 ,  H01L31/00

    CPC分类号： H01L31/1804 ,  H01L31/02245 ,  H01L31/0682 ,  Y02E10/547 ,  Y02P70/521

    摘要： Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.

    摘要翻译： 与光伏电池正面的电接触由导电贯穿衬底通孔的阵列以及可选地位于光伏电池正面的导电块的阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电贯穿衬底通孔的连续区域，同时暴露光伏电池的背面的一部分。 导电材料层沉积在光伏电池的背表面上，并被图案化以形成第一导电布线结构，其电连接导电贯穿衬底通孔和第二导电布线结构，该第二导电布线结构提供与光伏背面的电连接 细胞。

    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL
    5.
    发明申请
    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL 有权
    光伏电池的免网格联系人

    公开(公告)号：US20100218816A1

    公开(公告)日：2010-09-02

    申请号：US12621685

    申请日：2009-11-19

    申请人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. van Kessel

    发明人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. van Kessel

    IPC分类号： H01L31/00 ,  H01L31/18

    CPC分类号： H01L31/1804 ,  H01L31/02245 ,  H01L31/0682 ,  Y02E10/547 ,  Y02P70/521

    摘要： Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.

    摘要翻译： 与光伏电池正面的电接触由导电贯穿衬底通孔的阵列以及可选地位于光伏电池正面的导电块的阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电贯穿衬底通孔的连续区域，同时暴露光伏电池的背面的一部分。 导电材料层沉积在光伏电池的背表面上，并被图案化以形成第一导电布线结构，其电连接导电贯穿衬底通孔和第二导电布线结构，该第二导电布线结构提供与光伏背面的电连接 细胞。

    Grid-line-free contact for a photovoltaic cell
    6.
    发明授权
    Grid-line-free contact for a photovoltaic cell 有权
    光伏电池的无栅极接触

    公开(公告)号：US08669466B2

    公开(公告)日：2014-03-11

    申请号：US13364171

    申请日：2012-02-01

    申请人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. van Kessel

    发明人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. van Kessel

    IPC分类号： H01L31/18 ,  H01L31/02

    CPC分类号： H01L31/1804 ,  H01L31/02245 ,  H01L31/0682 ,  Y02E10/547 ,  Y02P70/521

    摘要： Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.

    摘要翻译： 与光伏电池正面的电接触由导电贯穿衬底通孔的阵列以及可选地位于光伏电池正面的导电块的阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电贯穿衬底通孔的连续区域，同时暴露光伏电池的背面的一部分。 导电材料层沉积在光伏电池的背表面上，并被图案化以形成第一导电布线结构，其电连接导电贯穿衬底通孔和第二导电布线结构，该第二导电布线结构提供与光伏背面的电连接 细胞。

    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL
    7.
    发明申请
    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL 有权
    光伏电池的无线联系

    公开(公告)号：US20120125433A1

    公开(公告)日：2012-05-24

    申请号：US13364171

    申请日：2012-02-01

    申请人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. Van Kessel

    发明人： Supratik Guha ,  Yves Martin ,  Naim Moumen ,  Robert L. Sandstrom ,  Theodore G. Van Kessel

    IPC分类号： H01L31/0224 ,  H01L31/18

    CPC分类号： H01L31/1804 ,  H01L31/02245 ,  H01L31/0682 ,  Y02E10/547 ,  Y02P70/521

    摘要： Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.

    摘要翻译： 与光伏电池正面的电接触由导电贯穿衬底通孔的阵列以及可选地位于光伏电池正面的导电块的阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电贯穿衬底通孔的连续区域，同时暴露光伏电池的背面的一部分。 导电材料层沉积在光伏电池的背表面上，并被图案化以形成第一导电布线结构，其电连接导电贯穿衬底通孔和第二导电布线结构，该第二导电布线结构提供与光伏背面的电连接 细胞。

    Heterogeneous thermal interface for cooling
    8.
    发明授权
    Heterogeneous thermal interface for cooling 有权
    用于冷却的异质热界面

    公开(公告)号：US07219713B2

    公开(公告)日：2007-05-22

    申请号：US11037913

    申请日：2005-01-18

    申请人： Jeffrey D. Gelorme ,  Supratik Guha ,  Nancy C. LaBianca ,  Yves Martin ,  Theodore G. Van Kessel

    发明人： Jeffrey D. Gelorme ,  Supratik Guha ,  Nancy C. LaBianca ,  Yves Martin ,  Theodore G. Van Kessel

    IPC分类号： F28F7/00

    CPC分类号： H01L23/3733 ,  H01L23/4093 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

    摘要翻译： 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。