公开(公告)号：US20250140917A1

公开(公告)日：2025-05-01

申请号：US18926768

申请日：2024-10-25

Applicant: Cyntec Co., Ltd. ,  National Tsing Hua University

Inventor： I-Sheng Wang ,  Wen-Hsuan Lu ,  Yen-Lin Chen ,  Han-Yi Chen

IPC: H01M10/0562 ,  H01M10/0525

Abstract: A solid-state electrolyte of a lithium-ion battery is provided. The lithium-ion battery has a negative electrode including a lithium-containing material in contact with the solid-state electrolyte. The solid-state electrolyte includes a multiple-doping material with a chemical formula of LixTiyMm(PO4)3, wherein 0.8≤x≤1.5, 0

公开(公告)号：US20250125084A1

公开(公告)日：2025-04-17

申请号：US18918160

申请日：2024-10-17

Applicant: CYNTEC CO., LTD.

Inventor： SEN-HUEI CHEN ,  Chi Shiuan Shie ,  I-AN CHEN

IPC: H01F27/29 ,  H01F27/02 ,  H01F27/24 ,  H01F27/32

Abstract: A coupled inductor, comprising: a first conductive body, comprising a first lateral portion, a first top portion, and a second lateral portion, wherein the first conductive body extends from the first lateral portion to the second lateral portion via the first top portion; a second conductive body, comprising a third lateral portion, a second top portion, and a fourth lateral portion, wherein the second conductive body extends from the third lateral portion to the fourth lateral portion via the second top portion; and a molding body, encapsulating the first lateral portion, the first top portion, and the second lateral portion of the first conductive body.

公开(公告)号：US20250091126A1

公开(公告)日：2025-03-20

申请号：US18964226

申请日：2024-11-29

Applicant: Cyntec Co., Ltd.

Inventor： Chih Hung Wei ,  Chung Kai Liao

IPC: B22F1/00 ,  B22F1/052 ,  B22F1/14 ,  B22F1/16 ,  B22F3/10 ,  H01F1/153 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: A magnetic component is adapted to be used in a power inductor. The magnetic component includes a magnetic body containing amorphous magnetic powders and/or nano-crystalline magnetic powders and at least one silicon-free glass material distributed among the amorphous magnetic powders and/or nano-crystalline magnetic powders; a coil embedded in the magnetic body; and a pair of electrodes electrically connected to two terminals of the coil, respectively.

公开(公告)号：US20250029765A1

公开(公告)日：2025-01-23

申请号：US18223033

申请日：2023-07-18

Applicant: CYNTEC CO., LTD.

Inventor： Hsin-Jung Cheng ,  Po-Hsiu Chien ,  Yung-Shou Hsu ,  Hun-Neng Chen ,  Hsieh-Shen Hsieh

IPC: H01F27/22 ,  H01F5/06

Abstract: A magnetic component includes a core, at least one spacer and at least two coils. The core includes an inner leg and at least two outer legs. The at least two coils and the at least one spacer are stacked with each other and directly sleeved on the inner leg. Each of the at least two coils is formed by winding a wire covered by at least three misaligned layers of insulating tape.

公开(公告)号：US20240428978A1

公开(公告)日：2024-12-26

申请号：US18748081

申请日：2024-06-19

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Shiuan Shie ,  Chia-Hsing Chou

IPC: H01F27/26 ,  H01F27/30

Abstract: A magnetic component includes a core, a first winding, a second winding and at least one magnetic filler. The core includes an inner leg. The first winding is disposed in the core and wound around the inner leg. The second winding is disposed in the core and surrounds the first winding. At least one filling region and at least one non-filling region are formed between the first winding and the second winding. The at least one magnetic filler is filled in at least a part of the at least one filling region.

公开(公告)号：US12094644B2

公开(公告)日：2024-09-17

申请号：US18132365

申请日：2023-04-08

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chi-Feng Huang

IPC: H01F27/32 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H05K1/16

CPC classification number: H01F27/327 ,  H01F27/24 ,  H01F27/2804 ,  H01F27/292 ,  H05K1/165

Abstract: An electronic structure comprising: a circuit board, wherein electronic devices and a transformer are disposed on the circuit board, wherein the transformer comprises a first coil, a second coil, and a magnetic body comprising a pillar with at least one portion of the pillar being disposed in a through-opening of the circuit board, wherein the first coil is wound around an upper portion of the pillar and the second coil is wound around a lower portion of the pillar for forming the transformer.

公开(公告)号：US12046408B2

公开(公告)日：2024-07-23

申请号：US17584333

申请日：2022-01-25

Applicant: CYNTEC CO., LTD.

Inventor： Shuen-Chang Hung ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F27/36 ,  H01F38/14 ,  H01F41/06 ,  H02J50/10

CPC classification number: H01F27/288 ,  H01F27/2804 ,  H01F27/2823 ,  H01F27/2866 ,  H01F27/2885 ,  H01F27/29 ,  H01F27/32 ,  H01F27/36 ,  H01F38/14 ,  H01F41/06 ,  H02J50/10 ,  H01F27/2871

Abstract: A shielding layer that is made of conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor to shield the coil from the external magnetic field and make the resistance and the power loss of the inductor lower.

公开(公告)号：US20240243527A1

公开(公告)日：2024-07-18

申请号：US18413058

申请日：2024-01-16

Applicant: CYNTEC CO., LTD.

Inventor： Shih-Hsien Tseng ,  Sheng-Ju Chou ,  Ming-Feng Chiang

IPC: H01R13/6585 ,  H01R12/77 ,  H01R12/79 ,  H01R13/6461

CPC classification number: H01R13/6585 ,  H01R12/771 ,  H01R12/79 ,  H01R13/6461

Abstract: A connecting structure includes a flexible flat cable. The flexible flat cable includes a first end portion, a second end portion, a connecting portion, a first pad region, a second pad region and a slot. The connecting portion is connected between the first end portion and the second end portion. The first pad region is disposed on the first end portion. The second pad region is disposed on the second end portion. The slot is formed in the connecting portion. The slot is extended along a length direction of the flexible flat cable. The flexible flat cable is a laminated structure including at least one set of signal trace pattern and at least one shielding structure. The at least one shielding structure correspondingly surrounds the at least one set of signal trace pattern in the connecting portion.

公开(公告)号：US20240242880A1

公开(公告)日：2024-07-18

申请号：US18416870

申请日：2024-01-18

Applicant: CYNTEC CO., LTD.

Inventor： Chin Hung Wei ,  Min Lian Kuo ,  Chung Kai Liao

IPC: H01F27/32 ,  H01F27/02 ,  H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H05K1/18 ,  H01L25/07

CPC classification number: H01F27/327 ,  H01F27/022 ,  H01F27/22 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/2852 ,  H01F27/29 ,  H05K1/18 ,  H01L25/072 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515

Abstract: A method to form a plurality of inductors in a single process by placing multiple coils on a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.

公开(公告)号：US12014868B2

公开(公告)日：2024-06-18

申请号：US17165933

申请日：2021-02-02

Applicant: CYNTEC CO., LTD.

Inventor： Yi-Cheng Lin

IPC: H05K1/09 ,  H01F27/255 ,  H01F41/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H01F1/22

CPC classification number: H01F41/0233 ,  H01F27/255 ,  H01F41/0246 ,  H05K1/09 ,  H05K1/111 ,  H05K1/18 ,  H05K3/341 ,  H05K3/40 ,  H01F1/22 ,  H05K2201/09009 ,  H05K2201/10007

Abstract: An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.