公开(公告)号：US20090284936A1

公开(公告)日：2009-11-19

申请号：US12466976

申请日：2009-05-15

申请人： Klaus BACKHAUS

发明人： Klaus BACKHAUS

IPC分类号： H05K1/00

CPC分类号： H05K5/006 ,  H05K1/0271 ,  H05K1/18 ,  H05K1/189 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/105

摘要： A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board.

摘要翻译： 主载体和印刷电路板的组合。 轻和重的电气和/或电子部件被固定在印刷电路板上，其中至少一个重的部件机械地固定地连接到主载体上并与导电连接到印刷电路板的第一部分的导体轨道。 印刷电路板的第一部分导电地连接到印刷电路板的第二部分，并且借助于去耦装置与印刷电路板的第二部分相关的机械振动解耦。 去耦装置可以是例如在所述印刷电路板中形成的柔性部分或凹部。

公开(公告)号：US20090277682A1

公开(公告)日：2009-11-12

申请号：US12406710

申请日：2009-03-18

申请人： Keiichiro BUNGO

发明人： Keiichiro BUNGO

IPC分类号： H05K5/00 ,  B23P11/00

CPC分类号： H05K3/284 ,  H05K5/064 ,  H05K2201/105 ,  H05K2203/1316 ,  Y10T29/49826

摘要： In a protective structure for a circuit board (1) that includes a casing (3) for receiving the circuit board, the casing is provided with a recess (11) for receiving a large component part protruding from the circuit board therein, and potting material (6) is filled in a space defined between the large component part and a surrounding wall of the recess. Typically, the potting material is filled in a gap between the large component part and the surrounding wall of the recess without substantially extending out of the recess. Because the large component part is not only supported by the circuit board but also by the casing via the cured potting material, the stress acting on a connection part that connects the large component part to the circuit board is minimized, and this enhances the mechanical integrity of the circuit board assembly. Because the use of the potting material is limited to the recess, the required amount of the potting material can be minimized, and this means a lower material cost and a reduced weight. Reducing the amount of the potting material means a shorter period of time required for curing it, and this improves the production efficiency of the circuit board assembly. If the protection of the component parts from intrusion of moisture is desired, protective coating may be additionally applied to the circuit board.

摘要翻译： 在包括用于接收电路板的壳体（3）的电路板（1）的保护结构中，壳体设置有用于容纳从其中的电路板突出的大部件的凹部（11），以及灌封材料 （6）填充在大部件与凹部的周围壁之间的空间中。 通常，灌封材料填充在大部件和凹部的周围壁之间的间隙中，而基本上不延伸出凹部。 由于大部件不仅由电路板支撑，而且通过固化灌封材料由壳体支撑，所以作用在连接大部件与电路板的连接部分上的应力最小化，从而提高了机械完整性 的电路板组件。 因为灌封材料的使用被限制在凹槽中，所以灌封材料的所需量可以最小化，这意味着较低的材料成本和减轻的重量。 减少灌封材料的量意味着固化所需的较短时间，这提高了电路板组件的生产效率。 如果需要保护组件免受潮湿侵入，则可以向电路板额外施加保护涂层。

公开(公告)号：US5345040A

公开(公告)日：1994-09-06

申请号：US967498

申请日：1992-10-28

申请人： Horst Stade ,  Helmut Deringer

发明人： Horst Stade ,  Helmut Deringer

IPC分类号： H01R12/04 ,  B60T8/36 ,  H05K1/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04

CPC分类号： B60T8/3675 ,  H05K13/0482 ,  H05K3/326 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2203/0165 ,  H05K2203/1189 ,  H05K3/281 ,  H05K3/306 ,  H05K3/3447 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T83/748

摘要： A device including a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, a device including an electrically reliably gap free conducting connection is attained even if the contact pins are eccentrically associated with the soldering lands.

摘要翻译： 一种包括具有电气部件的接触销的导体轨道箔的装置。 导体轨道箔包括两个绝缘层，其中间导电层具有上层中的焊盘，用于将导电层焊接到电气部件的接触引脚上。 通过使用安装装置将导体轨迹箔位置正确地下降到电气部件上。 在顶部没有绝缘层的焊盘的底部绝缘层和导电层被与导体轨道箔成直角延伸的接触销刺穿。 导线轨道箔由安装装置释放。 在焊盘和接触针之间形成焊接连接​​。 结果，即使接触针偏心地与焊接区相关联，也可以获得包括电气可靠的无间隙导电连接的装置。

公开(公告)号：US5289629A

公开(公告)日：1994-03-01

申请号：US68070

申请日：1992-10-28

申请人： Horst Stade ,  Helmut Deringer

发明人： Horst Stade ,  Helmut Deringer

IPC分类号： H01R12/04 ,  B60T8/36 ,  H05K1/00 ,  H05K1/11 ,  H05K3/28 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K13/04 ,  B23P19/04 ,  B26D7/02

CPC分类号： B60T8/3675 ,  H05K13/0482 ,  H05K3/326 ,  H05K1/118 ,  H05K2201/091 ,  H05K2201/1003 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2203/0165 ,  H05K2203/1189 ,  H05K3/281 ,  H05K3/306 ,  H05K3/3447 ,  Y10S29/044 ,  Y10T29/49144 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T83/748

摘要： A mounting apparatus for attaining a tolerance-insensitive connection of a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, an electrically reliably gap free conducting connection is attainable even if the contact pins are eccentrically associated with the soldering lands.

摘要翻译： 一种用于实现导体轨迹箔与电气部件的接触销的公差不敏感连接的安装装置。 导体轨道箔包括两个绝缘层，其中间导电层具有上层中的焊盘，用于将导电层焊接到电气部件的接触引脚上。 通过使用安装装置将导体轨迹箔位置正确地下降到电气部件上。 在顶部没有绝缘层的焊盘的底部绝缘层和导电层被与导体轨道箔成直角延伸的接触销刺穿。 导线轨道箔由安装装置释放。 在焊盘和接触针之间形成焊接连接​​。 结果，即使接触针偏心地与焊接区相关联，也可以实现电气可靠的无间隙的导电连接。