Semi-solid molding method
    51.
    发明授权
    Semi-solid molding method 有权
    半固态成型法

    公开(公告)号:US07299854B2

    公开(公告)日:2007-11-27

    申请号:US11373565

    申请日:2006-03-10

    CPC classification number: B22D17/12 B22D17/007 Y10S164/90

    Abstract: A metal alloy is heated to a molten state, and a grain refiner may be added. The molten alloy is poured into a shallow chamber of a shot sleeve of a vertical die cast press and on top of a shot piston. The shot sleeve is transferred to an injection station while the molten alloy cools to a semi-solid slurry with a globular, generally non-dendritic micro structure. An inner portion of the shallow slurry is injected upwardly by the piston through a gate opening into a die cavity while an outer more solid portion of the slurry is entrapped in an annular recess. After the slurry solidifies, the shot piston retracts, and the shot sleeve is transferred to a position where the residual biscuit is removed. The shot piston may have internal grooves to provide a large heat transfer area for cooling water to absorb heat from the molten alloy.

    Abstract translation: 将金属合金加热至熔融状态,并且可以加入晶粒细化剂。 将熔融合金倒入垂直压铸机的喷射套筒的浅室中,并在射出活塞的顶部。 当熔融合金冷却成具有球形,通常非树枝状微结构的半固体浆料时,将喷射套筒转移到喷射站。 浅浆料的内部部分通过活塞通过闸门向上注入模腔,同时浆料的外部更固体部分被截留在环形凹部中。 浆料固化后,喷射活塞缩回,喷射套筒转移到残留饼干被去除的位置。 喷射活塞可以具有内部凹槽,以提供大的传热区域用于冷却水以从熔融合金吸收热量。

    Ultrathin copper foil with carrier and printed circuit board using same
    53.
    发明申请
    Ultrathin copper foil with carrier and printed circuit board using same 有权
    超薄铜箔带载体和印刷电路板使用相同

    公开(公告)号:US20070141381A1

    公开(公告)日:2007-06-21

    申请号:US11639439

    申请日:2006-12-15

    Abstract: An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.

    Abstract translation: 一种超薄铜箔,其载体不会在剥离层界面引起起泡,具有低的载体剥离力,对环境友好,并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔,并且印刷 电路板,其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量,即具有载体的超薄铜箔,其包含载体箔,扩散防止层,释放 层和超薄铜箔,其中剥离层由用于保持剥离性的金属A形成,并且金属B用于促进超薄铜箔的镀覆,金属A的含量a和金属的含量b B形成释放层,满足以下等式:<?in-line-formula description =“In-line Formulas”end =“lead”?> 10 <= a /(a + b)* 100 <= 70 < line-formula description =“In-Line Formulas”end =“尾”?和通过使用这种超薄铜箔与载体制备的印刷电路板。

    Method and apparatus for producing amorphous alloy sheet, and amorphous alloy sheet produced using the same
    55.
    发明申请
    Method and apparatus for producing amorphous alloy sheet, and amorphous alloy sheet produced using the same 审中-公开
    用于制造非晶合金板的方法和装置以及使用其制造的非晶态合金板

    公开(公告)号:US20060102315A1

    公开(公告)日:2006-05-18

    申请号:US10529291

    申请日:2003-09-26

    Abstract: The present invention provides a method for producing a bulk amorphous alloy sheet with high quality at low production cost, by which an alloy melt can be directly transformed into a sheet form without using other additional processes. The method comprises preparing a melt containing alloy components; feeding the melt into a gap defined between two rolls, which rotate in opposite direction to each other, and each of which is provided with heat exchange means; and cooling the melt at a cooling rate higher than the critical cooling rate for transformation of the melt into an amorphous solid phase, when the melt passes through the gap defined between the two rolls. The present invention also provides an apparatus for producing a bulk amorphous alloy sheet with high quality at low production cost, and a bulk amorphous alloy sheet.

    Abstract translation: 本发明提供了一种以低成本生产高品质的块状非晶态合金板的方法,通过该方法可以将合金熔体直接转化为片状而不使用其它附加工艺。 该方法包括制备含熔融物的合金成分; 将熔体进入限定在两个辊之间的间隙中,所述两个辊彼此相反地旋转,并且每个辊设置有热交换装置; 并且当熔体通过两个辊之间限定的间隙时,以高于用于将熔体转变为无定形固相的临界冷却速率的冷却速率冷却熔体。 本发明还提供了一种用于以低成本生产高质量的块状非晶态合金片和大块非晶合金片的装置。

    Near liquidus injection molding process
    56.
    发明申请
    Near liquidus injection molding process 失效
    近液相线注射成型工艺

    公开(公告)号:US20060096733A1

    公开(公告)日:2006-05-11

    申请号:US10985879

    申请日:2004-11-10

    Inventor: Frank Czerwinski

    CPC classification number: B22D17/007 B22D27/003 Y10S164/90

    Abstract: An injection-molding process for molding a metal alloy into a near net shape article that is characterized in that the processing temperature of the alloy at injection is approaching the liquidus, preferably having a maximum solids content of 5%, whereby a net-shape molded article can be produced that has a homogeneous, fine equi-axed structure without directional dendrites, and a minimum of entrapped porosity. Advantageously, the resulting solid article has optimal mechanical properties without the expected porosity and solidification shrinkage attributed to castings made from super-heated melts.

    Abstract translation: 一种用于将金属合金模塑成近净形状制品的注射成型方法,其特征在于,注射时的合金的加工温度接近液相线,优选具有5%的最大固体含量,由此形成网状 可以制造具有均匀,细小的等轴结构而没有定向枝晶的制品,以及最小的夹带孔隙度。 有利地,所得固体制品具有最佳的机械性能,而不会由于由超加热熔体制成的铸件引起预期的孔隙率和凝固收缩。

    Method of molding low melting point metal alloy
    57.
    发明授权
    Method of molding low melting point metal alloy 失效
    低熔点金属合金成型方法

    公开(公告)号:US07036551B2

    公开(公告)日:2006-05-02

    申请号:US11066598

    申请日:2005-02-25

    CPC classification number: B22D17/007 B22D17/2023 B22D17/32 Y10S164/90

    Abstract: The present invention relates to a method of molding a low-melting-point metal alloy which exhibits thixotropy properties in a solid-phase and liquid-phase coexisting temperature region. In this method, a temperature of a heating holding cylinder is increased to a liquidus temperature or higher at the start of a molding operation. Then a remaining material in the preceding molding remaining in the heating holding cylinder in a solid state is wholly melted. After that a temperature of the heating holding cylinder is lowered to a temperature in the solid-phase and a liquid-phase coexisting temperature region. At the same time a molding material is supplied and a provisional molding is carried out. After the temperature has reached the solid-phase and liquid-phase coexisting temperature region, a regular molding is started. By the present invention a problem of a remaining material in the heating holding cylinder, which becomes a trouble at the start of molding by injection, is solved.

    Abstract translation: 本发明涉及在固相和液相共存温度区域中显示触变性的低熔点金属合金的成型方法。 在该方法中,在成型操作开始时,加热保持筒的温度升高至液相线温度以上。 然后,保持在固体状态的加热保持筒中的前述成型体中的剩余材料完全熔化。 之后,将加热保持筒的温度降低到固相和液相共存温度区域的温度。 同时提供成型材料并进行临时成型。 在温度达到固相和液相共存温度区域之后,开始规则的成型。 通过本发明,解决了通过注射成型开始成为故障的加热保持筒中的剩余材料的问题。

    Article having a surface protected by a silicon-containing diffusion coating
    58.
    发明申请
    Article having a surface protected by a silicon-containing diffusion coating 审中-公开
    具有被含硅扩散涂层保护的表面的物品

    公开(公告)号:US20060057416A1

    公开(公告)日:2006-03-16

    申请号:US11109160

    申请日:2005-04-19

    CPC classification number: C23C10/46 C23C10/08 Y10T428/12458 Y10T428/12674

    Abstract: A surface of an article is protected by coating the surface with a silicon-containing coating by preparing a coating mixture of silicon, a halide activator, and an oxide powder, positioning the surface of the article in gaseous communication with the coating mixture, and heating the surface of the article and the coating mixture to a coating temperature of from about 1150° F. to about 1500° F. The article is preferably a component of a gas turbine engine made of a nickel-base superalloy.

    Abstract translation: 通过制备硅,卤化物活化剂和氧化物粉末的涂料混合物,通过用含硅涂层涂覆表面来保护制品的表面,将制品的表面与涂料混合物气态连通并加热 制品的表面和涂料混合物的涂覆温度为约1150°F至约1500°F。制品优选为由镍基超级合金制成的燃气涡轮发动机的部件。

    Aluminum alloy
    59.
    发明申请
    Aluminum alloy 审中-公开
    铝合金

    公开(公告)号:US20050161128A1

    公开(公告)日:2005-07-28

    申请号:US11085086

    申请日:2005-03-22

    CPC classification number: C22C21/02 B22D17/007 B22D21/007 C22C1/005

    Abstract: All aluminum alloy is disclosed that includes 6.5 to 8.5 percent silicon, 0.6 to 1.0 percent iron, 0.3 to 0.5 percent manganese, 0.35 to 0.65 percent magnesium, 0.01 to 1.0 percent zinc, 0.11 to 0.2 percent titanium, 2.0 to 2.5 percent copper, and aluminum as the remainder with further one or more other elements that are 0.001 to 0.15 percent of the weight of the aluminum alloy. An aluminum alloy of the above composition is high in strength and suitable for use with SSM methods of casting, such as Rheocasting and Thixocasting.

    Abstract translation: 公开了所有的铝合金,其包括6.5至8.5%的硅,0.6至1.0%的铁,0.3至0.5%的锰,0.35至0.65%的镁,0.01至1.0%的锌,0.11至0.2%的钛,2.0至2.5%的铜,以及 铝作为其余部分,还有一种或多种其它元素,其为铝合金重量的0.001至0.15%。 上述组合物的铝合金的强度高,适用于SSM铸造方法,如Rheocasting和Thixocasting。

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