公开(公告)号：US10526235B2

公开(公告)日：2020-01-07

申请号：US15328777

申请日：2015-07-23

Applicant: SAINT-GOBAIN GLASS FRANCE

Inventor： Thierry Dumenil ,  Dominique Bureloux

IPC: C03B33/04 ,  C03B33/02 ,  C03B33/023 ,  C03B33/033 ,  C03B33/03 ,  C03B33/037

Abstract: The process relates to the manufacture of a plurality of glazings of complex shape from a rectangular sheet of float glass of large dimensions. The process includes at a first station for cutting the glass sheet, scoring at least one cutting line corresponding to at least one ready-to-shape edge of the glazings; a first breaking operation; at a second cutting station, scoring at least one cutting line corresponding to at least one other ready-to-shape edge of the glazings, and a second breaking operation.

公开(公告)号：US20190381686A1

公开(公告)日：2019-12-19

申请号：US16486359

申请日：2018-08-09

Applicant: LISEC Austria GmbH

Inventor： Franz HASELMAYR

IPC: B26F3/00 ,  C03B33/02

Abstract: In a water-jet cutting installation for machining substantially vertical material panels such as glass panes, at least one section of the high-pressure line is guided, by a guide system including at least one guide element, to the rear of the device in order to improve access to the intake and/or discharge region of the machining installation and to increase operator safety.

公开(公告)号：US20190366484A1

公开(公告)日：2019-12-05

申请号：US15771994

申请日：2017-03-24

Applicant: Beijing University of Technology

Inventor： Lingfei Ji ,  Tianyang Yan ,  Lin Li ,  Na An ,  Zhenyuan Lin ,  Wenhao Wang

IPC: B23K26/53 ,  B23K26/70 ,  C03C15/00 ,  C03B33/02

Abstract: The present disclosure relates to a method for high precision laser processing of sapphire with submicron roughness cutting surface using a picosecond pulse laser which has high transmittance wavelength to sapphire. The laser triggers ultrafine phase transformation points or electronic state removal points from a lower surface of sapphire. After elevating focal points, a trace which is parallel to laser incident direction is formed. Under a chemical corrosion environment, points of the laser trace are arranged to intersect with other another according to the cutting route to form the corresponding phase transformation region and electronic state removal region. At the same time, by utilizing the catalysis effect of microthermal effect of picosecond laser on chemical corrosion, separation of the sapphire sample along the processing path is obtained. The present disclosure overcomes the limitation of Gaussian beam focusing mode and realizes high precision sapphire cutting with zero tapers and no heat-affected zone. Cutting of hyperfine sapphire and other materials with the high quality cutting surface in micron and submicron ranges with no limitation on the thickness and process path is achieved.

公开(公告)号：US20190353941A1

公开(公告)日：2019-11-21

申请号：US16318536

申请日：2017-08-31

Applicant: HKC CORPORATION LIMITED ,  CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： CHUNG-KUANG CHIEN

IPC: G02F1/13 ,  G02F1/1333 ,  G02F1/1339 ,  C03B33/02

Abstract: A processing process and processing device for a display panel are provided. The processing process for a display panel includes: an insulating spacer layer is arranged between a cutting region of a glass panel to be cut of a liquid crystal board and an array pad; a single-sided glass panel of the liquid crystal board is subjected to single glass cutting process; residual material is taken out from split pieces on a split region of the cut glass panel of the liquid crystal board; and the spacer layer is removed, the array pad is exposed, and then the liquid crystal board is outputted.

公开(公告)号：US10438039B2

公开(公告)日：2019-10-08

申请号：US16131247

申请日：2018-09-14

Applicant: CORNING INCORPORATED

Inventor： Yuhui Jin ,  Matthew Evan Wilhelm

IPC: C03C15/00 ,  G06K9/00 ,  C03B33/02 ,  B23K26/53 ,  B23K26/00 ,  C03C23/00 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/22 ,  H05K3/40 ,  H05K5/00 ,  C03C17/36 ,  C03C21/00 ,  B23K26/382 ,  B23K26/386 ,  B23K26/402 ,  B23K101/42 ,  B23K103/00

Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.

公开(公告)号：US20190300417A1

公开(公告)日：2019-10-03

申请号：US16362110

申请日：2019-03-22

Applicant: Corning Incorporated

Inventor： Uwe Stute

IPC: C03B33/02 ,  C03B33/10 ,  B23K26/40 ,  B23K26/364

Abstract: A method for processing a transparent workpiece comprises forming an optically modified region in or on a transparent workpiece and forming a contour in the transparent workpiece, the contour comprising a plurality of defects in the transparent workpiece positioned laterally offset from the optically modified region. Forming the contour comprises directing a primary laser beam comprising a quasi-non diffracting beam oriented along a beam pathway onto the transparent workpiece such that a first caustic portion of the primary laser beam is directed into the transparent workpiece, thereby generating an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece and a second caustic portion of the primary laser beam is modified by the optically modified region. Further, translating the transparent workpiece and the primary laser beam relative to each other along a contour line and laterally offset from the optically modified region.

公开(公告)号：US10399184B2

公开(公告)日：2019-09-03

申请号：US15083088

申请日：2016-03-28

Applicant: ROFIN-SINAR TECHNOLOGIES INC.

Inventor： S Abbas Hosseini ,  Peter R. Herman

IPC: B23K26/53 ,  B23K26/06 ,  B26F3/00 ,  H01L21/263 ,  C03B33/02 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/08 ,  C03C23/00 ,  B23K103/00 ,  H01L21/78

Abstract: A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation and increasing the filament length.

公开(公告)号：US20190248698A1

公开(公告)日：2019-08-15

申请号：US16310752

申请日：2017-06-15

Applicant: Nippon Sheet Glass Company, Limited

Inventor： Keiji TSUNETOMO ,  Haruhiko MAMADA ,  Teruhide INOUE

IPC: C03C3/093 ,  C03B33/02 ,  C03C15/00 ,  C03C3/095 ,  C03C4/00

CPC classification number: C03C3/093 ,  B23K26/53 ,  C03B33/02 ,  C03B33/0222 ,  C03C3/091 ,  C03C3/095 ,  C03C4/0071 ,  C03C15/00 ,  C03C17/25 ,  C03C2204/00

Abstract: The present invention provides a low-alkali or alkali-free glass for laser processing, the glass reducing occurrence of laser irradiation-induced cracks and allowing formation of circular through holes. The present invention relates to the glass for laser processing, the glass having a glass composition including, in mol %: 45.0%≤SiO2≤70.0%; 2.0%≤B2O3≤20.0%; 3.0%≤Al2O3≤20.0%; 0%≤ZnO≤9.0%; and (I) 0.1%≤CuO≤2.0% and 0%≤TiO2≤15.0%; or (II) 0.1%≤TiO2

公开(公告)号：US10351460B2

公开(公告)日：2019-07-16

申请号：US13477391

申请日：2012-05-22

Applicant: James William Brown ,  Cho-Cheng (George) Hsieh ,  Michael Albert Joseph, II ,  Yen Chia (Gina) Pai

Inventor： James William Brown ,  Cho-Cheng (George) Hsieh ,  Michael Albert Joseph, II ,  Yen Chia (Gina) Pai

IPC: C03B33/02 ,  B26F3/00 ,  C03B33/023 ,  C03B33/10 ,  C03C21/00

Abstract: A method of separating a strengthened glass sheet includes positioning a serrated scribing wheel at a position spaced apart from a first edge of the glass sheet and offset below a top surface of the glass sheet, where the glass sheet comprises a surface compression layer of layer depth DOL and a central region. The method also includes translating the serrated scribing wheel in a first direction at an initiation speed such that the serrated scribing wheel forms a crack initiation site comprising surface indentations extending into the surface compression layer, accelerating the serrated scribing wheel in the first direction from the initiation speed to a scoring speed to scribe a score line extending into the glass sheet to a median crack depth greater than DOL, and stopping the serrated scribing wheel in the first direction before the score line reaches a second edge of the glass sheet.

公开(公告)号：US10335902B2

公开(公告)日：2019-07-02

申请号：US15325893

申请日：2015-07-14

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Stephan Lvovich Logunov ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Pushkar Tandon ,  Sergio Tsuda

IPC: B23K26/402 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/08 ,  B23K26/359 ,  B23K26/57 ,  B23K26/53 ,  B23K26/073 ,  C03B33/07 ,  C03B33/02 ,  B23K103/00

Abstract: A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.