摘要:
An angle grinder including at least one boost mode unit configured to provide a boost mode, and a switching-over unit configured to switch over between a conventional mode and the boost mode.
摘要:
A sanding tool includes a handle assembly with a support member and a head assembly that includes a sanding member that is rotatable relative to the handle assembly about a drive axis. The sanding tool also includes a pivot assembly that pivotably couples the head assembly to the support member of the handle assembly. The support member pivotably supports the pivot assembly, the drive axis extends through the pivot assembly, and the head assembly is pivotable about a plurality of different axes relative to the support member. The plurality of different axes includes an axis that is substantially aligned with the drive axis.
摘要:
A balancing method and apparatus is used for dynamically balancing an out of balance condition in a rotating body caused by resistance forces acting tangentially to the body. A device having a rotatable component and automatic or dynamic balancing includes a housing, a shaft rotatably mounted in the housing, the shaft supporting the component near one end of the shaft, at least one counterweight fixedly mounted on the shaft and at least one automatically adjusting balancer mounted on the shaft. The automatically adjusting balancer includes one or more compensating masses contained to move about a path relative to the shaft to compensate for variable imbalanced forces acting on the component.
摘要:
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
摘要:
A device and method to convert ordinary rotary motion of input frequency Ω into a composite motion with the same primary frequency Ω plus an eccentric motion at a higher frequency ω enables a low speed rotary input to drive a higher-speed eccentric motion. A preferred embodiment enables an existing rotary motion machine to be easily adapted to provide compound rotary and eccentric motion. Optional attachments are used to collect waste products generated by rotary motion machine.
摘要:
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
摘要:
The invention relates to an arrangement for a mobile surfacing machine, preferably for the surfacing of stone floors. A frame supports a drive motor with a motor shaft. A planet disc is rotatably mounted in the fame, with three surfacing discs arranged on shafts rotatably mounted on the planet disc. The surfacing discs are in operative connection with a belt pulley arranged on the drive shaft of the motor via a drive belt running around first belt pulleys arranged on the aforementioned shafts. The shafts of the surfacing discs are so arranged, for the purpose of controlling the rotation of the planet disc, as to be in operative connection with the frame. The operative connection comprises, for example, a belt pulley attached to the frame, second belt pulleys arranged on the shafts of the surfacing discs, and a second belt running around these and the belt pulley attached to the frame.
摘要:
An oscillating spindle sander having a spindle rotatably mounted in a cabinet. An external end of the spindle is adapted to receive a sanding drum. An upper cam pulley is fixedly attached to the spindle and a lower cam pulley is rotatably attached to the spindle within the cabinet. The upper and lower cam pulleys have face-to-face annular cam surfaces having complementary sinusoidal contours with diametrically opposite lobes and diametrically opposite valleys. The upper and lower cam pulleys have a toothed rim connected by individual drive belts to a common drive pulley rotated by an electric motor. The number of teeth on the toothed rims of the upper and lower cam pulleys are different, causing the upper and lower cam pulleys to rotate relative to each other. The annular cam surfaces cause the upper cam pulley and the spindle to be oscillated in a vertical direction in response to the relative rotation between upper and lower cam pulleys.
摘要:
In order to achieve a compact spindle drive which is also lightweight and consisting of few components, and where the drive motor (8) is mounted in a stationary manner in relation to the spindle drive, the spindle drive according to the invention is configured with two sets of bevel gears comprising a first larger pair of gears (11, 13) and a second smaller pair of gears (12, 14).The spindles (15, 17) can hereby be mounted in star formation in the housing and alternately enter into engagement with the first gear (11) and the second gear (12), and thus alternatively rotate the one way and the other way.At the same time, all of the spindles (15, 17) are suspended in the same plane, whereby a very uniform machining operation is achieved.Finally, the housing can be provided with a turning motor (21), which via a pinion (2, 19) can revolve the housing (1) at the same time that the spindles rotate.
摘要:
A drive mechanism for a wafer processing machine of the kind which holds a silicon wafer on a vacuum chuck and rotates the wafer for processing operations on the wafer periphery or upper surface incorporates a low-speed motor, a high-speed motor and an overrunning clutch. The low-speed motor is connected to a drive shaft for the chuck through the overrunning clutch and rotates the chuck and wafer at a relatively low and precisely-controlled speed while the edge of the wafer is contoured by a grinding wheel or while the upper surface is mechanically cleaned by a brush engaged with the upper surface of the wafer. The high-speed motor is directly connected to the drive shaft and, when energized for a rinsing and drying operation, rotates the chuck and wafer in the same direction of rotation as the low-speed motor but at high speed while the wafer is being rinsed and dried after the grinding or cleaning operation. During the grinding or cleaning operation the high-speed motor is energized toward rotation in a direction opposed to the direction of rotation produced by the low-speed motor. The biasing torque so produced insures against any slack or rebounding through the overrunning clutch which could result in skipping or chattering of the engagement of the grinding wheel with the periphery of the wafer during the contouring of the periphery of the wafer or which could result in loss of clamping contact between the chuck and the wafer.