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    Cutting apparatus
    1.
    发明授权
    Cutting apparatus 有权
    切割设备

    公开(公告)号：US09314853B2

    公开(公告)日：2016-04-19

    申请号：US14333170

    申请日：2014-07-16

    申请人： DISCO CORPORATION

    发明人： Nobuhiko Wakita

    IPC分类号： B23B31/30 ,  B28D5/02 ,  B28D7/04 ,  B24B45/00 ,  B27B5/30 ,  B27B5/32 ,  B24B27/06

    CPC分类号： B23B31/307 ,  B24B27/06 ,  B24B45/00 ,  B27B5/30 ,  B27B5/32 ,  B28D5/02 ,  B28D5/022 ,  B28D7/04 ,  Y10T83/647

    摘要： A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.

    摘要翻译： 切割单元包括主轴，主轴壳体，主轴前部的支撑凸缘，可拆卸地支撑在支撑凸缘上的切割刀片以及用于将切割刀片固定到支撑凸缘的固定凸缘。 支撑凸缘包括适于插入穿过切割刀片的中心开口的凸台部分，用于支撑切割刀片的一个侧面的凸缘部分和用于接合主轴前部的圆柱形部分。 凸缘部具有朝向固定凸缘开口的吸入孔，圆筒部具有与吸入孔连通的连通孔。 连通孔通过固定到主轴壳体的旋转接头连接到真空源，使得连通孔和真空源之间的连通通过开关阀选择性地进行。

    WAFER PROCESSING METHOD
    3.
    发明申请
    WAFER PROCESSING METHOD 有权
    WAFER加工方法

    公开(公告)号：US20170069537A1

    公开(公告)日：2017-03-09

    申请号：US15254681

    申请日：2016-09-01

    申请人： DISCO CORPORATION

    发明人： Tetsukazu Sugiya ,  Xin Lu

    IPC分类号： H01L21/78 ,  H01L21/268 ,  H01L21/56 ,  H01L23/544 ,  H01L23/31 ,  H01L21/02

    CPC分类号： H01L21/78 ,  B23K26/364 ,  B23K2103/56 ,  B28D5/00 ,  B28D5/02 ,  H01L21/268 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/31058 ,  H01L21/561 ,  H01L21/67092 ,  H01L21/6836 ,  H01L23/3114 ,  H01L2221/68327 ,  H01L2221/6834

    摘要： A wafer is divided into device chips each of which is surrounded by a mold resin. The wafer has a plurality of devices arranged like a matrix with a spacing having a predetermined width, the front side of each device being covered with the mold resin, the spacing being filled with the mold resin to form a street between any adjacent ones of the devices. The wafer processing method includes a division start point forming step of forming a division start point along each street at the lateral center of the mold resin filling the spacing and a dividing step of applying an external force to the wafer after performing the division start point forming step, thereby laterally dividing each street into two parts at the division start point to obtain the device chips divided from each other, each device chip being surrounded by the mold resin.

    摘要翻译： 将晶片分成各自被模制树脂包围的装置芯片。 晶片具有多个排列成具有预定宽度的间隔矩阵的装置，每个装置的前侧均被模制树脂覆盖，该间隔用模制树脂填充，以形成任何相邻的 设备。 晶片处理方法包括：分割开始点形成步骤，在填充间隔的模制树脂的横向中心沿着每个街道形成分割开始点;以及分割步骤，在进行分割开始点形成之后，向晶片施加外力 从而在划分开始点将每个街道横向划分为两部分，以获得彼此分开的装置芯片，每个装置芯片被模制树脂包围。

    Semiconductor wafer processing method
    5.
    发明授权
    Semiconductor wafer processing method 有权
    半导体晶片加工方法

    公开(公告)号：US07550387B2

    公开(公告)日：2009-06-23

    申请号：US12180283

    申请日：2008-07-25

    申请人： Kazuma Sekiya ,  Yusuke Kimura

    发明人： Kazuma Sekiya ,  Yusuke Kimura

    IPC分类号： H01L21/00

    CPC分类号： H01L21/31058 ,  B23C3/00 ,  B28D5/02 ,  H01L21/31053

    摘要： A semiconductor wafer processing method for planarizing an additional layer formed on the front side of a semiconductor wafer. First, the wafer is held on a chuck table included in a cutting device in the condition where the additional layer is exposed, and a table base supporting the chuck table is moved toward a working position. In concert with the movement of the table base, the exposed surface of the additional layer is cut by a bit of a cutting tool rotationally driven by a spindle motor. Thereafter, the exposed surface of the additional layer is polished by a polishing device to planarize the exposed surface of the additional layer.

    摘要翻译： 一种用于平坦化形成在半导体晶片的正面上的附加层的半导体晶片处理方法。 首先，在附加层露出的状态下，将晶片保持在包括在切割装置中的卡盘台上，并且支撑卡盘台的台架基座朝向工作位置移动。 与台座的移动一致，附加层的暴露表面被一些由主轴电动机旋转驱动的切割工具切割。 此后，通过抛光装置抛光附加层的暴露表面以使附加层的暴露表面平坦化。

    Method for removing the circumferential edge of a dielectric layer
    6.
    发明申请
    Method for removing the circumferential edge of a dielectric layer 有权

    公开(公告)号：US20030084922A1

    公开(公告)日：2003-05-08

    申请号：US09985687

    申请日：2001-11-05

    发明人： Yu-Ling Huang ,  Lung Hui Tsai

    IPC分类号： B08B007/04

    CPC分类号： H01L21/67051 ,  B28D1/041 ,  B28D5/02 ,  H01L21/31105

    摘要： A method for removing the circumferential edge of a dielectric layer on a semiconductor wafer is disclosed. First, a semiconductor wafer having a dielectric layer on its upper surface is provided. Second, the semiconductor wafer is placed and secured on a susceptor. Third, the circumferential edge of the dielectric layer is removed by a ring cutter. Then, the semiconductor wafer is cleaned from its central portion to its edge portion by water jets.

    Two motor drive for a wafer processing machine
    7.
    发明授权
    Two motor drive for a wafer processing machine 失效
    两台电机驱动器用于晶圆加工机

    公开(公告)号：US4227347A

    公开(公告)日：1980-10-14

    申请号：US942268

    申请日：1978-09-14

    申请人： Johann Tam

    发明人： Johann Tam

    IPC分类号： B24B9/06 ,  B24B47/12 ,  B28D5/02 ,  B24B47/00

    CPC分类号： B24B47/12 ,  B24B9/065 ,  B28D5/02

    摘要： A drive mechanism for a wafer processing machine of the kind which holds a silicon wafer on a vacuum chuck and rotates the wafer for processing operations on the wafer periphery or upper surface incorporates a low-speed motor, a high-speed motor and an overrunning clutch. The low-speed motor is connected to a drive shaft for the chuck through the overrunning clutch and rotates the chuck and wafer at a relatively low and precisely-controlled speed while the edge of the wafer is contoured by a grinding wheel or while the upper surface is mechanically cleaned by a brush engaged with the upper surface of the wafer. The high-speed motor is directly connected to the drive shaft and, when energized for a rinsing and drying operation, rotates the chuck and wafer in the same direction of rotation as the low-speed motor but at high speed while the wafer is being rinsed and dried after the grinding or cleaning operation. During the grinding or cleaning operation the high-speed motor is energized toward rotation in a direction opposed to the direction of rotation produced by the low-speed motor. The biasing torque so produced insures against any slack or rebounding through the overrunning clutch which could result in skipping or chattering of the engagement of the grinding wheel with the periphery of the wafer during the contouring of the periphery of the wafer or which could result in loss of clamping contact between the chuck and the wafer.

    摘要翻译： 用于在真空卡盘上保持硅晶片并使晶片旋转以用于在晶片周边或上表面上进行处理操作的晶片处理机的驱动机构包括低速电动机，高速电动机和超速离合器 。 低速电动机通过超越离合器连接到用于卡盘的驱动轴，并且以相对较低且精确控制的速度旋转卡盘和晶片，同时晶片的边缘由砂轮构成，或者当上表面 通过与晶片的上表面接合的刷子进行机械清洁。 高速电机直接连接到驱动轴上，当通电用于冲洗和干燥操作时，旋转卡盘和晶片与低速电机相同的旋转方向，但是在冲洗晶片的同时高速运转 并在研磨或清洁操作后干燥。 在研磨或清洁操作期间，高速电动机沿与低速电动机产生的旋转方向相反的方向被激励。 所产生的偏置扭矩确保抵抗超越离合器的任何松弛或反弹，这可能导致在晶片周边轮廓形成期间磨轮与晶圆周边的接合跳跃或颤动，或者可能导致损失 卡盘和晶片之间的夹紧接触。

    Sectioners
    8.
    发明授权
    Sectioners 失效
    部分

    公开(公告)号：US3745716A

    公开(公告)日：1973-07-17

    申请号：US3745716D

    申请日：1971-03-30

    申请人： TURNER R

    发明人： TURNER R

    IPC分类号： B24B19/02 ,  B24B41/06 ,  B28D5/00 ,  B28D5/02

    CPC分类号： B24B41/06 ,  B24B19/028 ,  B28D5/0058 ,  B28D5/02

    摘要： A machine for sectioning and measuring thin layered materials such as are used in semiconductors in which: the workpiece is positioned in a mechanical chuck which supports and protects the workpiece during the operations of sectioning, cleaning, staining, transfer and measurement, the machine includes electromagnetic elements for biasing the workpiece into engagement with a rotary abrasive tool of precisely known radius and the force of the electromagnet is manually adjusted by a rheostat having a pointer dial and an index of section width marks so referenced to the dial and the rheostat that setting the pointer dial to any width mark of the index results in application of the correct bias force of the workpiece toward the rotary tool for the section width to which the dial is set. Contamination of the work area by spent coolant is prevented by applying the coolant to the rotary abrasive tool at a controlled rate by a positive displacement pump, spreading it evenly over the surface of the tool and removing it with a resilient blade before it exceeds a film thickness at which adhesive and cohesive forces are greater than the centrifugal forces acting upon it. Damage to work pieces is prevented by an automatic time delay relay which delays the application of the selected bias force for several seconds after the start of each sectioning operation.

    摘要翻译： 一种用于切割和测量诸如半导体中的薄层状材料的机器，其中：工件位于机械夹头中，其在切片，清洁，染色，转印和测量的操作期间支撑和保护工件，该机器包括电磁 用于将工件偏置成与具有精确已知半径的旋转研磨工具接合的元件，并且电磁体的力由具有指针拨盘的变阻器和与刻度盘和变阻器相关的部分宽度标记的索引手动调节， 指针拨盘指向索引的任何宽度标记会导致工件向旋转工具施加正确的偏置力，用于设置刻度盘的部分宽度。 通过利用正排量的泵将冷却剂以可控制的速度施加到旋转研磨工具上来防止工作区域的污染，将其均匀地铺展在工具的表面上，并且在其超过膜之前用弹性刀片去除它 粘合力和内聚力大于作用在其上的离心力的厚度。 通过自动延时继电器来防止工件损坏，每个切片操作开始后延迟所选择的偏压力的施加几秒钟。