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公开(公告)号：US11226356B2
公开(公告)日：2022-01-18
申请号：US17053228
申请日：2019-05-08
申请人： KOA CORPORATION
发明人： Tamotsu Endo
摘要： Provided is a shunt resistor including: a first terminal and a second terminal each made of an electrically conductive metal material and having a first plane, a second plane, and an outer peripheral surface around the planes; and a resistive body connected to the respective first planes and connecting the first terminal and the second terminal, the first planes of the first terminal and the second terminal opposing each other. A bonding area between the resistive body and the first planes is smaller than an area of the first planes. The first terminal and the second terminal each have a hole penetrating through from the first plane to the second plane. A voltage detection terminal is connected to opposing surface sides of the first terminal and the second terminal.
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公开(公告)号：US20210287829A1
公开(公告)日：2021-09-16
申请号：US17334402
申请日：2021-05-28
摘要： An apparatus including a dielectric layer; and a set of thin-film resistors arranged in a row extending in a first direction on the dielectric layer, wherein lengths of the set of thin-film resistors in a second direction substantially orthogonal to the first direction are substantially the same, wherein the set of thin-film resistors includes a first subset of one or more thin-film resistors with respective terminals spaced apart by a first distance, and wherein the set of thin-film resistors includes a second subset of one or more thin-film resistors with respective terminals spaced apart by a second distance, the first distance being different than the second distance.
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公开(公告)号：US20210225563A1
公开(公告)日：2021-07-22
申请号：US17259856
申请日：2019-07-01
申请人： KOA CORPORATION
发明人： Tamotsu ENDO
摘要： This shunt resistor includes: a first terminal and a second terminal each made of an electrically conductive metal material and having a first planar surface and a second planar surface, the respective first planar surfaces of the first terminal and the second terminal opposing each other; and a resistive body and a support column member each connected to the respective first planar surfaces and connecting the first terminal and the second terminal. The support column member is made of a metal material. An area of bonding between the resistive body and the support column member and the respective first planar surfaces is smaller than an area of the first planar surface. The first terminal and the second terminal each have a hole portion formed so as to penetrate therethrough from the first planar surface to the second planar surface.
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公开(公告)号：US11037734B2
公开(公告)日：2021-06-15
申请号：US16715493
申请日：2019-12-16
发明人： Shuhei Yamada , Kazunobu Hayashi , Kenichi Seki , Hajime Yoda , Toshio Heishi
摘要： A mounting structure minimizes the influence of displacements, along a length direction of a resistor, in mounting positions of capacitor electrodes on the electrical characteristics of a circuit including a parallel circuit composed of a capacitor and the resistor. The capacitor has first and second electrodes, which respectively include first and second side surface portions disposed in parallel to a length direction of the resistor. The resistor has a first resistance body corresponding to the first side surface portions and a second resistance body corresponding to the second side surface portions that are separately disposed along the length direction and connected in series via a wire, and is mounted so that the first resistance body is positioned directly facing the first side surface portions and the second resistance body is positioned directly facing the second side surface portions.
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公开(公告)号：US10937573B2
公开(公告)日：2021-03-02
申请号：US16756413
申请日：2018-10-11
申请人： ROHM CO., LTD.
发明人： Takanori Shinoura
摘要： A chip resistor includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first conductive layer is electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer. The third conductive layer covers the second conductive layer and the insulating layer. The fourth conductive layer covers the second conductive layer and the third conductive layer. Bonding strength between the third and fourth conductive layer is stronger than that between the second and fourth conductive layer.
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公开(公告)号：US10811174B2
公开(公告)日：2020-10-20
申请号：US16466256
申请日：2017-11-30
申请人： Rohm Co., Ltd.
发明人： Wataru Imahashi , Takanori Shinoura
摘要： One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.
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公开(公告)号：US10734176B2
公开(公告)日：2020-08-04
申请号：US16394123
申请日：2019-04-25
发明人： Sebastjan Kamen{hacek over (s)}ek , Tadej Knez , Igor Juri{hacek over (c)}ev , Milenko Vukotić , Thomas Tsovilis , Zafiris G. Politis
IPC分类号： H05K5/00 , H01H37/74 , H01C1/01 , H01C7/12 , H01H85/44 , H01T4/02 , H01T4/08 , H01H37/04 , H01H37/08 , H01H37/46 , H01H79/00 , H01R25/14 , H01R9/26 , H01T4/06 , H01H37/76
摘要： A surge protective device (SPD) module includes a module housing, first and second module electrical terminals mounted on the module housing, a gas discharge tube (GDT) mounted in the module housing, and a fail-safe mechanism mounted in the module housing. The GDT includes a first GDT terminal electrically connected to the first module electrical terminal and a second GDT terminal electrically connected to the second module electrical terminal. The fail-safe mechanism includes: an electrically conductive shorting bar positioned in a ready position and repositionable to a shorting position; a biasing member applying a biasing load to the shorting bar to direct the shorting bar from the ready position to the shorting position; and a meltable member. The meltable member maintains the shorting bar in the ready position and melts in response to a prescribed temperature to permit the shorting bar to transition from the ready position to the shorting position under the biasing load of the biasing member. In the shorting position, the shorting bar forms an electrical short circuit between the first and second GDT terminals to bypass the GDT.
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公开(公告)号：US10729051B2
公开(公告)日：2020-07-28
申请号：US15187451
申请日：2016-06-20
发明人： John E. McConnell , John Bultitude
IPC分类号： H05K13/04 , H05K3/30 , H05K7/12 , H01G4/232 , H01C1/01 , H01G2/06 , H01C13/02 , H01G4/38 , H01C1/14 , H05K3/34 , H05K1/02 , H01G4/30 , H01C7/00
摘要： An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.
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公开(公告)号：US20200176153A1
公开(公告)日：2020-06-04
申请号：US16614036
申请日：2018-05-15
摘要： A power resistor is disclosed, having at least one electrical connection, having a carrier substrate, which has at least one resistor element composed of a thick-film material and at least one contact electrode to which the resistor element electrically connects, having at least one electrical conductor, which is soldered to the contact electrode and produces an electrical connection between the contact electrode and the electrical terminal, and having a housing, which is at least partially filled with at least one casting compound and in which the resistor element and contact electrode are encapsulated, with the electrical conductor protruding out through the casting compound. In order to achieve a simply designed and easy-to-use power resistor, it is proposed for a pin, in particular a soldering pin or press-fitting pin, to constitute the electrical conductor, which pin is placed onto the contact electrode and soldered to it and constitutes the electrical terminal of the power resistor.
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公开(公告)号：US20200066429A1
公开(公告)日：2020-02-27
申请号：US16466256
申请日：2017-11-30
申请人： Rohm Co., Ltd.
发明人： Wataru IMAHASHI , Takanori SHINOURA
摘要： One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.
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