Abstract:
A photoresist composition is provided. The photoresist composition includes a polymer resin for forming a photoresist layer, a photosensitive chemical for changing solubility of the photoresist layer when exposed to some form of radiation, and 3-methoxybutyl acetate, 2-heptanone, and 4-butyrolactone as a solvent. The composition has a good photosensitivity and remainder ratio, and no unpleasant odor.
Abstract:
A polymer composition, which is useful as a surfactant, formed by the reaction of an alkylene oxide (such as ethylene oxide), carbon dioxide, and a monocarboxylic acid chain terminator, such as one containing a fatty alkyl group.
Abstract:
The disclosure teaches a blend of a predominant amount of a polyphosphate flame retardant and an effective amount of a liquid crystalline additive for viscosity reduction and compatibilization when blended with a thermoplastic polymer, as compared to use of just the polyphosphate flame retardant alone. The polyphosphate can comprise resorcinol bis(diphenyl phosphate) and/or its higher oligomers. The liquid can be a liquid crystalline segmented block copolymer or a liquid crystalline oligomer.
Abstract:
A single phase, compatiblized blend comprising a polycarbonate resin, a polyester resin, and no more than about 5%, by weight of the combined weight of polycarbonate and polyester, of a liquid crystalline additive as a compatibilizer.
Abstract:
Thermotropic liquid crystalline poly(ester-amide) compositions are disclosed which comprise a bis(4-carbonyl phenylene) terephthalate unit and a unit derived from an N-substituted hydrocarbylenediamine (e.g., one derived from an N,N-dialkylalkylene).
Abstract:
Polyimide films can be laminated to metal foils by the use of an epoxy adhesive composition which consists essentially of a predominant amount of an epoxy resin and a suitable curing agent for the epoxy resin. Optional additives which can be used in lesser amount than the epoxy resin includes flexibilizers, accelerators, solvents and surfactants.
Abstract:
Adhesive compositions are disclosed which comprise: (a) an epoxy resin; (b) a soluble polyimide resin; and (c) a monoepoxy diluent. Such compositions are curable by using conventional epoxy curing agent(s). If desired, conductive adhesives of this type can be formed by blending the composition with a conductive filler component.
Abstract:
The recovery of a polymer product formed by condensing an organo-phosphonic acid dichloride or dibromide, a dihydroxy aromatic compound and, optionally, a crosslinking momomer in an organic solvent reaction medium, as a granular solid is accomplished by combining said organic solvent containing the polymer product and an aqueous solution which contains an effective amount of suspending agent to later induce precipitation of said polymer product and by thereafter agitating the solution while removing the solvent therefrom to affect precipitation of said granular polymer product.