-
公开(公告)号:US11882637B2
公开(公告)日:2024-01-23
申请号:US17587035
申请日:2022-01-28
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor: Meng-Yong Lin , Ming-Huang Liu , Jer-Hau Hsu , Cheng-Feng Liu
IPC: H05B47/11 , H05B47/17 , H05B47/165 , H05B47/155
CPC classification number: H05B47/11 , H05B47/155 , H05B47/165 , H05B47/17
Abstract: An operation method of a proximity sensor comprises: controlling a light-emitting element by a processing circuit. Such control includes a plurality of light source on and light source off operations. An optical sensor receives light and outputs a sensing signal corresponding to the intensity of the light. The processing circuit computes the sensing signal to produce a sensing result. The plurality of light source on and light source off operations includes a group having two light sources on operations and two light sources off operations. The two light sources on operations in the group or the two light sources off operations in the group are performed consecutively. In this way, the ambient light components of the light source on and off operations may cancel out each other to reduce the ambient light components contained in the sensing results.
-
公开(公告)号:US20240004033A1
公开(公告)日:2024-01-04
申请号:US18100734
申请日:2023-01-24
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor: Han-Chung Hsu , Feng-Jung Hsu
CPC classification number: G01S7/4802 , G01S7/4815 , G01S17/08
Abstract: A light sensor and a control method thereof are revealed. The light sensor comprises a first light-emitting element, a second light-emitting element and a light-sensing element. The first light-emitting element is used to generate a first emitting signal. The first emitting signal has an optical wavelength within a first wavelength range. The second light-emitting element is used to generate a second emitting signal. The wavelength of the second emitting signal has an optical wavelength within a second wavelength range. The first wavelength range is different from the second wavelength range. Thereby, a control circuit sequentially controls the first light-emitting element and the second light emitting-element to emit the first emitting signal and the second emitting signal. When the first emitting signal and the second emitting signal are reflected by an object and received by the light-sensing element, the control circuit may determine the type of the object based on the signal sensed by the light-sensing element.
-
公开(公告)号:US11703983B2
公开(公告)日:2023-07-18
申请号:US17212319
申请日:2021-03-25
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor: Tun-Ju Wang , Ching-Jen Tung , Chi-Huan Lu , Chun-Yu Lin , Yen-Shao Lin
CPC classification number: G06F3/044 , G06F3/04164 , G06F3/04182
Abstract: The application relates to a capacitance sensing circuit, which samples and holds a reference signal to generate an input reference signal, hereby, an input signal is generated to a sensing circuit. Thereby, the sensing circuit generates an output signal according to the input signal and a sensing signal, for the capacitance sensing.
-
公开(公告)号:US11699996B2
公开(公告)日:2023-07-11
申请号:US17301494
申请日:2021-04-05
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor: Wang-An Lin , Ming-Che Yang , Kai Fan Hsieh , Chung-Jung Wu
IPC: G06F1/00 , H03K17/955 , H03K17/96 , G01R27/26 , G01V3/08 , G06F1/3231 , G06F3/01
CPC classification number: H03K17/955 , G01R27/2605 , G01V3/088 , G06F1/3231 , G06F3/011 , H03K17/962
Abstract: The present invention is related to a method for proximity sensing and an applied electronic device thereof. The present invention provides that a movement signal is generated according to a detection data, a move baseline data and a move threshold and cooperated with a proximity signal for generating a judgement signal to judge if the human body or the object body is close to the electronic device.
-
公开(公告)号:US20220140172A1
公开(公告)日:2022-05-05
申请号:US17212362
申请日:2021-03-25
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor: WEN-CHIEH TSOU , YI-HUA CHANG
IPC: H01L31/12 , H01L27/146 , H01L33/62 , H01L23/552
Abstract: A light sensing packaging structure and a packaging method thereof is provided, wherein the light sensing packaging structure comprises a substrate provided with a through-hole between a light-emitting element and a light-sensing element; and a cover body covered the substrate. The cover body comprises a shielding part and an extended part. The shielding part is mounted between the light-emitting element and the light-sensing element, and provided with a metal bonding layer on a surface towards the substrate. The extended part is provided with a metal side wall connected to the metal bonding layer. The through-hole is covered with a conductive glue, and the metal junction contacts the conductive glue. Hereby, the present application may reduce the size of the light sensing device, provide a stable packaging, reduce the packaging cost and improve the reliability of the light sensing product.
-
公开(公告)号:US20220057852A1
公开(公告)日:2022-02-24
申请号:US17301494
申请日:2021-04-05
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor: Wang-An Lin , Ming-Che Yang , Kai Fan Hsieh , Chung-Jung Wu
IPC: G06F1/3231 , G06F3/01
Abstract: The present invention is related to a method for proximity sensing and an applied electronic device thereof. The present invention provides that a movement signal is generated according to a detection data, a move baseline data and a move threshold and cooperated with a proximity signal for generating a judgement signal to judge if the human body or the object body is close to the electronic device.
-
公开(公告)号:US20210250035A1
公开(公告)日:2021-08-12
申请号:US17014253
申请日:2020-09-08
Applicant: SENSORTEK TECHNOLOGY CORP.
Inventor: JER-HAU HSU , MING-HUANG LIU , KIAN-FU WONG
Abstract: A light sensor circuit, which comprising a photodiode and a voltage follower. By setting the voltage follower to reduce the influence from the junction capacitance of the photodiode, a required time of a repeat integration module will not be influenced by the photodiode to efficiently keep the performance and the accuracy of the analog to digital converting device when the light sensor circuit is used to the analog to digital converting device in repeat operation.
-
公开(公告)号:US10183856B2
公开(公告)日:2019-01-22
申请号:US15871083
申请日:2018-01-15
Applicant: SensorTek technology Corp.
Inventor: Hsin-Hung Huang , Wei-Yang Ou
Abstract: A manufacturing method for a Micro-Electro-Mechanical Systems (MEMS) structure includes implementing a surface modification process, to form a transformation layer on the surfaces of the MEMS structure; implementing an anti-stiction coating pre-clean process, to clean the transformation layer on the surfaces towards a particular direction; and implementing an anti-stiction coating process, to coat a monolayer on the surfaces of the MEMS structure.
-
公开(公告)号:US20180375513A1
公开(公告)日:2018-12-27
申请号:US15969786
申请日:2018-05-03
Applicant: SensorTek technology Corp.
Inventor: Kun-Yang Li , Meng-Yong Lin , Sheng-Chun Chen
IPC: H03K17/945 , G01S17/02 , H03K17/968
Abstract: A proximity sensor for a non-aperture mechanism includes a control circuit for generating a control signal; a first light-emitting element for emitting a first light source according to the control signal of the control circuit; a second light-emitting element for emitting a second light source according to the control signal of the control circuit; and a light sensing element coupled to the control circuit, for sensing the first light source and the second light source reflected by an object, and determining a distance between the proximity sensor and the object according to light intensities of the reflected first light source and the reflected sensed second light source; wherein the light sensing element and the first light-emitting element have a first distance therebetween, the light sensing element and the second light-emitting element have a second distance therebetween, and the second distance is greater than the first distance.
-
70.
公开(公告)号:US09865765B2
公开(公告)日:2018-01-09
申请号:US14822906
申请日:2015-08-11
Applicant: SensorTek technology Corp.
Inventor: Feng-Jung Hsu , Chu-Yuan Yang , Yuan-Ching Hsu , Yi-Hua Chang
IPC: H01L31/12 , H01L31/18 , H01L31/0203 , H01L31/0232 , H01L31/173 , G01S17/02 , G01S7/481
CPC classification number: H01L31/173 , G01S7/4813 , G01S17/026 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014
Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.
-
-
-
-
-
-
-
-
-