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公开(公告)号：US11867723B2
公开(公告)日：2024-01-09
申请号：US17357833
申请日：2021-06-24
Applicant: Technoprobe S.p.A.
Inventor： Stefano Felici
IPC: G01R1/073
CPC classification number: G01R1/07371
Abstract: A probe head for testing a device under test integrated on a semiconductor wafer includes a plurality of contact probes, each having a first end and a second end, and at least one first lower guide and one second lower guide at the first end. The guides are parallel to each other and have a respective plurality of first and second guide holes for slidingly housing the contact probes. At least one third lower guide is substantially parallel to the first lower guide and to the second lower guide and includes a plurality of third guide holes for slidingly housing the contact probes. The guide holes are disposed in a shifted arrangement to eliminate a scrub movement of the first ends of each contact probe of the probe head.
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公开(公告)号：US20230417798A1
公开(公告)日：2023-12-28
申请号：US18253442
申请日：2021-11-26
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
CPC classification number: G01R1/07342 , G01R3/00
Abstract: A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and/or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.
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公开(公告)号：US20230324438A1
公开(公告)日：2023-10-12
申请号：US18334283
申请日：2023-06-13
Applicant: TECHNOPROBE S.p.A.
Inventor： Roberto Crippa , Flavio Maggioni
CPC classification number: G01R1/07371 , G01R1/06761
Abstract: A testing head comprises a plurality of contact probes, and a guide having a plurality of guide holes for housing the contact probes and including a conductive portion. Each contact probe includes a first end region and a second end region, and a body which extends between the first and second end regions. Suitably, the conductive portion includes a group of the guide holes and electrically connects contact probes of a first group of the contact probes. The contact probes of the first group slide in the guide holes in the conductive portion and are adapted to carry a same signal, and each contact probe of a second group of the plurality of contact probes is surrounded by an insulating coating layer that extends along the body of each contact probe of the second group, thereby insulating the contact probes of the second group from the conductive portion.
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公开(公告)号：US20230305054A1
公开(公告)日：2023-09-28
申请号：US18042159
申请日：2021-08-23
Applicant: TECHNOPROBE S.P.A.
Inventor： Riccardo VETTORI , Roberto CRIPPA
IPC: G01R31/28
CPC classification number: G01R31/2887 , G01R31/2891
Abstract: A probe head for a testing apparatus of electronic devices is disclosed having a plurality of contact probes, a guide provided with a plurality of guide holes for slidingly housing the contact probes, and a containment element which is adapted to support the guide. The containment element includes a first portion and a second portion which is movable with respect to the first portion, movement means adapted to move the second portion of the containment element with respect to the first portion, and a test optical signal distribution element configured to transmit a test optical signal to the device under test. The test optical signal distribution element is associated with the second portion of the containment element and is arranged to be moved integrally therewith. The movement means is configured to allow the alignment of the test optical signal distribution element.
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公开(公告)号：US20230029150A1
公开(公告)日：2023-01-26
申请号：US17783452
申请日：2020-12-18
Applicant: TECHNOPROBE S.P.A.
Inventor： Roberto CRIPPA
IPC: G01R1/073
Abstract: A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.
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Patent Agency Ranking
公开(公告)号：US20230028352A1
公开(公告)日：2023-01-26
申请号：US17783433
申请日：2020-12-10
Applicant: TECHNOPROBE S.P.A.
Inventor： Raffaele VALLAURI , Fabio MORGANA
IPC: G01R1/067
Abstract: A contact probe having a first end portion and a second end portion, a probe body extended along a longitudinal development direction between the first end portion and the second end portion is disclosed. The probe body has a pair of arms separated by a slot and extending according to the longitudinal development direction and a conductive insert extended along the longitudinal development direction, in a bending plane of the contact probe. The conductive insert is made of a first material and the contact probe is made of a second material and the first material has a lower electrical resistivity than an electrical resistivity of the second material. The conductive insert is a power transmission element of the contact probe and the arms are structural support elements of the contact probe during a deformation of the probe body.
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公开(公告)号：US20220155344A1
公开(公告)日：2022-05-19
申请号：US17591349
申请日：2022-02-02
Applicant: Technoprobe, S.p.A.
Inventor： Roberto CRIPPA
Abstract: A manufacturing method for manufacturing at least one contact probe for a probe head of a test equipment of electronic devices, comprising a step of submicrometric 3D printing of the contact probe with at least one printing material selected from a conductor material or a semiconductor material is disclosed.
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公开(公告)号：US11333681B2
公开(公告)日：2022-05-17
申请号：US16931183
申请日：2020-07-16
Applicant: Technoprobe S.p.A.
Inventor： Riccardo Vettori
Abstract: A cantilever probe head includes a support ring associated with a PCB board and a plurality of contact probes, protruding from the support ring in a cantilever manner and being held by a support associated with the support ring. Each contact probe has a rod-like body having a longitudinal axis inclined with respect to a reference plane corresponding to a plane of a wafer of devices under test by the cantilever probe head, as well as at least one first end portion, provided in a first probe section protruding from the support in the direction of the wafer of devices under test, the first end portion being bent with respect to the longitudinal axis starting from a bending point and ending with a contact tip of the contact probe able to abut onto a contact pad of a device under test of the wafer.
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公开(公告)号：US11307221B2
公开(公告)日：2022-04-19
申请号：US16931188
申请日：2020-07-16
Applicant: Technoprobe S.p.A.
Inventor： Riccardo Vettori
Abstract: A cantilever contact probe includes a shaped probe body included between a descending probe section and an ascending probe section. At least one end portion is formed in the descending probe section, and bent with respect to a longitudinal axis starting from a bending point and ending with a contact tip of the cantilever contact probe that is configured to abut onto a contact pad of a device under test of that wafer. Suitably, the shaped probe body comprises at least one base portion, an upper portion extending, starting from the base portion, along a longitudinal extension axis of the shaped probe body, orthogonally to the reference plane and a top portion, connected to the upper portion and having a greater diameter than a diameter of the upper portion to form a T, the upper portion being the stem of the T and the top portion being the crosspiece of the T.
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公开(公告)号：US20220099703A1
公开(公告)日：2022-03-31
申请号：US17545851
申请日：2021-12-08
Applicant: Technoprobe S.p.A.
Inventor： Riccardo LIBERINI
IPC: G01R1/073
Abstract: A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.
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