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公开(公告)号：US20240151744A1
公开(公告)日：2024-05-09
申请号：US18416771
申请日：2024-01-18
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
CPC classification number: G01R1/07378 , G01R1/06772 , G01R1/07328 , G01R1/07357 , G01R1/07371
Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
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2.发明申请公开(公告)号：US20190302185A1
公开(公告)日：2019-10-03
申请号：US16442394
申请日：2019-06-14
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
IPC: G01R31/319 , G01R1/073 , G01R3/00
Abstract: A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.
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3.发明申请公开(公告)号：US20220034966A1
公开(公告)日：2022-02-03
申请号：US17502600
申请日：2021-10-15
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
IPC: G01R31/319 , G01R1/073 , G01R3/00
Abstract: A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.
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公开(公告)号：US20200072873A1
公开(公告)日：2020-03-05
申请号：US16677581
申请日：2019-11-07
Applicant: TECHNOPROBE S.p.A.
Inventor： Roberto CRIPPA , Flavio MAGGIONI , Raffaele VALLAURI
Abstract: A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.
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公开(公告)号：US20240044940A1
公开(公告)日：2024-02-08
申请号：US18254056
申请日：2021-11-22
Applicant: TECHNOPROBE S.P.A.
Inventor： Roberto CRIPPA , Flavio MAGGIONI
CPC classification number: G01R1/07307 , G01R1/06738
Abstract: A contact probe is disclosed having a first contact end portion adapted to abut onto a contact pad of a device under test, a second contact end portion adapted to abut onto a contact pad of a PCB board of a testing apparatus, and a rod-shaped probe body extended between the first and second contact end portions according to a longitudinal direction. The contact probe also includes an opening that extends along the probe body and along at least one contact end portion, a first opening part defining a pair of arms in the probe body and a second opening part defining a pair of end sections in the contact end portion.
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Patent Agency Ranking
公开(公告)号：US20230417798A1
公开(公告)日：2023-12-28
申请号：US18253442
申请日：2021-11-26
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
CPC classification number: G01R1/07342 , G01R3/00
Abstract: A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and/or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.
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公开(公告)号：US20240012028A1
公开(公告)日：2024-01-11
申请号：US18253444
申请日：2021-11-26
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
CPC classification number: G01R1/07314 , G01R3/00 , G01R1/07357
Abstract: A method of manufacturing a probe card for functionality testing of devices under test (DUT) is disclosed having the steps of providing an interface board configured for interfacing the probe card to a testing apparatus, providing a stiffener, connecting an interposer in the shape of a monobloc of material to the stiffener, cutting the monobloc according to a predetermined pattern after connecting it to the stiffener, thereby defining a plurality of modules which are independent and separated from each other, associating the interface board with the stiffener, and associating a probe head with the interposer. The probe head includes a plurality of contact elements adapted to electrically connect the interposer to contact pads of the devices under test. A probe card obtained by the method is also disclosed.
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公开(公告)号：US20190302148A1
公开(公告)日：2019-10-03
申请号：US16442385
申请日：2019-06-14
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer comprises a plurality of contact elements, each comprising a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements, the guide comprising a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
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公开(公告)号：US20230408548A1
公开(公告)日：2023-12-21
申请号：US18254044
申请日：2021-11-18
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
CPC classification number: G01R1/0735 , G01R1/06772 , H05K1/147 , H05K3/326 , H05K3/4007 , H05K2201/0367
Abstract: A flexible membrane adapted to carry high-frequency power signals is described having a plurality of contact pads in a central portion of the flexible membrane connected to a plurality of micro contact probes and a plurality of contact structures connected to a support plate in a peripheral portion of the flexible membrane, as well as a plurality of conductive tracks connecting the contact pads with the contact structures. The flexible membrane further includes an intermediate portion between the central and peripheral portions. The elastic membrane is divided into a first area having a first total thickness and into a second area having a second total thickness. The first area is contiguous and adjacent to the second area. The first total thickness is less than or equal to 75 μm and the second total thickness is greater than the first total thickness.
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公开(公告)号：US20230333142A1
公开(公告)日：2023-10-19
申请号：US18329475
申请日：2023-06-05
Applicant: TECHNOPROBE S.P.A.
Inventor： Flavio MAGGIONI
CPC classification number: G01R1/07378 , G01R1/07357 , G01R1/07371 , G01R1/06772 , G01R1/07328
Abstract: A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
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