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公开(公告)号:US06910898B2
公开(公告)日:2005-06-28
申请号:US10614196
申请日:2003-07-08
CPC分类号: H05K7/1023 , H01R12/82
摘要: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.
摘要翻译: 按压盖的盖体具有用于按压裸片的各个侧面的端部的接触片中的基板的按压部分的片状片。
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公开(公告)号:US06905952B2
公开(公告)日:2005-06-14
申请号:US10443813
申请日:2003-05-23
CPC分类号: H01L21/4846 , H01L2924/0002 , H05K3/225 , H05K3/4007 , H01L2924/00
摘要: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.
摘要翻译: 虽然具有预定表面粗糙度的转印板10的转印表面10a与形成在基板44M上的接触片44上的多个凸起44B接触,该基片44 M的线膨胀系数大于转印系数 板10在预定压力下,将衬底44M和转印板10加热到预定温度,以将凸块44B的表面粗糙度恢复到预定值。
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公开(公告)号:US06835318B2
公开(公告)日:2004-12-28
申请号:US10067890
申请日:2002-02-08
申请人: Takeyuki Suzuki , Noriyuki Matsuoka
发明人: Takeyuki Suzuki , Noriyuki Matsuoka
IPC分类号: H01B1300
CPC分类号: H01L23/544 , H01L2223/5442 , H01L2223/54473 , H01L2924/0002 , H05K1/0266 , H05K1/0269 , H05K1/115 , H05K1/116 , H05K2201/09381 , H05K2201/09781 , H05K2201/09854 , H01L2924/00
摘要: A method for forming a recognition mark on the back surface of a substrate for a KGD that can be easily produced at a low manufacturing cost and permits repeated use of a substrate is provided. In the method, wiring patterns are formed on a surface of one side of an insulating substrate. The method includes a step of forming a conductive pattern as a recognition mark on one surface where the wiring patterns are formed, and a step of forming a through hole from a surface where the wiring pattern is not formed toward the conductive pattern. In the substrate, bumps connected with the KGD are formed on the surface on which the wiring patterns are not formed. Also, the conductive pattern may have a shape as the recognition mark or the through hole may have the shape as the recognition mark.
摘要翻译: 提供了一种用于在用于KGD的基板的背面上形成识别标记的方法,其可以以低制造成本容易地制造并且允许重复使用基板。 在该方法中,在绝缘基板的一侧的表面上形成布线图案。 该方法包括在形成布线图案的一个表面上形成作为识别标记的导电图案的步骤,以及从未形成布线图案的表面向导电图案形成通孔的步骤。 在基板上,在没有形成布线图案的表面上形成与KGD连接的凸块。 此外,导电图案可以具有识别标记或通孔可以具有作为识别标记的形状的形状。
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公开(公告)号:US06306950B1
公开(公告)日:2001-10-23
申请号:US09204082
申请日:1998-12-03
申请人: Toshio Okuhara , Takeyuki Suzuki , Minoru Isshiki
发明人: Toshio Okuhara , Takeyuki Suzuki , Minoru Isshiki
IPC分类号: C08J322
CPC分类号: C07D215/22 , C07C235/16 , C07D215/38 , C07D215/40 , C07D215/48 , C07D401/12 , C07D405/04 , C07D405/06
摘要: A chlorinated vinyl chloride resin composition containing a chlorinated vinyl chloride resin which has a polymerization degree of from 600 to 1500 prior to chlorination arid a chlorination degree of from 62 to 70 wt. %, an impact modifier, a stabilizer, a lubricant and titanium dioxide, wherein the content of zinc in titanium dioxide is 0.1% or less, which has improved thermal stability.
摘要翻译: 含氯化氯乙烯树脂的氯化氯乙烯树脂组合物,氯化氯化程度为600〜1500,氯化度为62〜70重量%。 %,抗冲改性剂,稳定剂,润滑剂和二氧化钛,其中二氧化钛中的锌含量为0.1%以下,具有改善的热稳定性。
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