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公开(公告)号:US11659759B2
公开(公告)日:2023-05-23
申请号:US17142853
申请日:2021-01-06
Applicant: Applied Materials, Inc.
Inventor: Chung-Chia Chen , Byung-Sung Kwak , Robert Jan Visser
CPC classification number: H01L51/56 , H01L27/3211
Abstract: Embodiments of the present disclosure relate to an apparatus and methods for forming arrays of EL devices and forming the EL devices with overlapped mask plates. The methods utilize overlapping a first mask plate and a second mask plate to form a mask arrangement having first apertures of the first mask plate overlapped with second apertures of the second mask plate forming one or more opening areas. A material is evaporated through the mask arrangement such that layers of the material are formed in a device area of the EL devices. The device area of each of the EL devices corresponds to the opening area of the mask arrangement of the first mask plate and the second mask plate. The method described herein allows for a higher density of the EL devices and creates a smaller deposition area due to the opening area of the mask arrangement.
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公开(公告)号:US11653576B2
公开(公告)日:2023-05-16
申请号:US17163274
申请日:2021-01-29
Applicant: Applied Materials, Inc.
Inventor: Zihao Yang , Mingwei Zhu , Nag B. Patibandla , Nir Yahav , Robert Jan Visser , Adi de la Zerda
CPC classification number: H01L39/12 , G01J1/44 , G02B6/107 , G01J2001/442
Abstract: A superconducting nanowire single photon detector (SNSPD) device includes a substrate having a top surface, an optical waveguide on the top surface of the substrate to receive light propagating substantially parallel to the top surface of the substrate, a seed layer of metal nitride on the optical waveguide, and a superconductive wire on the seed layer. The superconductive wire is a metal nitride different from the metal nitride of the seed layer and is optically coupled to the optical waveguide.
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公开(公告)号:US20220246888A1
公开(公告)日:2022-08-04
申请号:US17676080
申请日:2022-02-18
Applicant: Applied Materials, Inc.
Inventor: Kyuil Cho , Byung Sung Kwak , Robert Jan Visser
Abstract: A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.
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公开(公告)号:US20220223811A1
公开(公告)日:2022-07-14
申请号:US17710939
申请日:2022-03-31
Applicant: Applied Materials, Inc.
Inventor: Gang Yu , Chung-Chia Chen , Wan-Yu Lin , Hyunsung Bang , Lisong Xu , Byung Sung Kwak , Robert Jan Visser
Abstract: A light-emitting diode display including a substrate having a driving circuitry and a plurality of light emitting diode structures disposed on the substrate. Each light-emitting diode structure has a light emitting diode with a light emission zone having a planar portion, and a pigmentless light extraction layer of a UV-cured ink disposed over the light-emitting diode. The light extraction layer has a gradient in index of refraction along an axis normal to the planar portion, and the index of refraction of the light extraction layer decreases with distance from the planar portion.
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公开(公告)号:US11362307B2
公开(公告)日:2022-06-14
申请号:US16698824
申请日:2019-11-27
Applicant: Applied Materials, Inc.
Inventor: Kyuil Cho , Byung Sung Kwak , Robert Jan Visser
Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.
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公开(公告)号:US11327218B2
公开(公告)日:2022-05-10
申请号:US16762869
申请日:2018-11-13
Applicant: Applied Materials, Inc.
Inventor: Michael Yu-tak Young , Wayne McMillan , Rutger Meyer Timmerman Thijssen , Robert Jan Visser
Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.
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公开(公告)号:US11211439B2
公开(公告)日:2021-12-28
申请号:US16698805
申请日:2019-11-27
Applicant: Applied Materials, Inc.
Inventor: Kyuil Cho , Byung Sung Kwak , Robert Jan Visser
IPC: H01L27/32
Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.
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公开(公告)号:US20210226182A1
公开(公告)日:2021-07-22
申请号:US17152688
申请日:2021-01-19
Applicant: Applied Materials, Inc.
Inventor: Yeishin Tung , Byung Sung Kwak , Robert Jan Visser , Guoheng Zhao , Todd J. Egan
Abstract: An organic light-emitting diode (OLED) deposition system includes two deposition chambers, a transfer chamber between the two deposition chambers, a metrology system having one or more sensors to perform measurements of the workpiece within the transfer chamber, and a control system to cause the system to form an organic light-emitting diode layer stack on the workpiece. Vacuum is maintained around the workpiece while the workpiece is transferred between the two deposition chambers and while retaining the workpiece within the transfer chamber. The control system is configured to cause the two deposition chambers to deposit two layers of organic material onto the workpiece, and to receive a first plurality of measurements of the workpiece in the transfer chamber from the metrology system.
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公开(公告)号:US20210208308A1
公开(公告)日:2021-07-08
申请号:US17212500
申请日:2021-03-25
Applicant: Applied Materials, Inc.
Inventor: Tapashree ROY , Rutger Meyer Timmerman Thijssen , Robert Jan Visser
IPC: G02B1/00 , G02F1/1335
Abstract: Embodiments described herein relate to nanostructured trans-reflective filters having sub-wavelength dimensions. In one embodiment, the trans-reflective filter includes a film stack that transmits a filtered light within a range of wavelengths and reflects light not within the first range of wavelengths. The film stack includes a first metal film disposed on a substrate having a first thickness, a first dielectric film disposed on the first metal film having a second thickness, a second metal film disposed on the first dielectric film having a third thickness, and a second dielectric film disposed on the second metal film having a fourth thickness.
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公开(公告)号:US20210159458A1
公开(公告)日:2021-05-27
申请号:US16698824
申请日:2019-11-27
Applicant: Applied Materials, Inc.
Inventor: Kyuil Cho , Byung Sung Kwak , Robert Jan Visser
Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.
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