Method of making high resolution OLED fabricated with overlapped masks

    公开(公告)号:US11659759B2

    公开(公告)日:2023-05-23

    申请号:US17142853

    申请日:2021-01-06

    CPC classification number: H01L51/56 H01L27/3211

    Abstract: Embodiments of the present disclosure relate to an apparatus and methods for forming arrays of EL devices and forming the EL devices with overlapped mask plates. The methods utilize overlapping a first mask plate and a second mask plate to form a mask arrangement having first apertures of the first mask plate overlapped with second apertures of the second mask plate forming one or more opening areas. A material is evaporated through the mask arrangement such that layers of the material are formed in a device area of the EL devices. The device area of each of the EL devices corresponds to the opening area of the mask arrangement of the first mask plate and the second mask plate. The method described herein allows for a higher density of the EL devices and creates a smaller deposition area due to the opening area of the mask arrangement.

    METHOD OF FORMING STRETCHABLE ENCAPSULATION FOR ELECTRONIC DISPLAYS

    公开(公告)号:US20220246888A1

    公开(公告)日:2022-08-04

    申请号:US17676080

    申请日:2022-02-18

    Abstract: A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.

    Encapsulation having polymer and dielectric layers for electronic displays

    公开(公告)号:US11362307B2

    公开(公告)日:2022-06-14

    申请号:US16698824

    申请日:2019-11-27

    Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.

    Method of direct etching fabrication of waveguide combiners

    公开(公告)号:US11327218B2

    公开(公告)日:2022-05-10

    申请号:US16762869

    申请日:2018-11-13

    Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

    Stretchable polymer and dielectric layers for electronic displays

    公开(公告)号:US11211439B2

    公开(公告)日:2021-12-28

    申请号:US16698805

    申请日:2019-11-27

    Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a plurality of first polymer projections on display layer, the plurality of first polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of first polymer projections and any exposed underlying surface in the spaces between the first polymer projections, the dielectric layer forming side walls along sides of the first polymer projections and defining wells in spaces between the side walls.

    IN-LINE MONITORING OF OLED LAYER THICKNESS AND DOPANT CONCENTRATION

    公开(公告)号:US20210226182A1

    公开(公告)日:2021-07-22

    申请号:US17152688

    申请日:2021-01-19

    Abstract: An organic light-emitting diode (OLED) deposition system includes two deposition chambers, a transfer chamber between the two deposition chambers, a metrology system having one or more sensors to perform measurements of the workpiece within the transfer chamber, and a control system to cause the system to form an organic light-emitting diode layer stack on the workpiece. Vacuum is maintained around the workpiece while the workpiece is transferred between the two deposition chambers and while retaining the workpiece within the transfer chamber. The control system is configured to cause the two deposition chambers to deposit two layers of organic material onto the workpiece, and to receive a first plurality of measurements of the workpiece in the transfer chamber from the metrology system.

    NON-ABSORPTIVE TRANS-REFLECTIVE NANOSTRUCTURED RGB FILTERS

    公开(公告)号:US20210208308A1

    公开(公告)日:2021-07-08

    申请号:US17212500

    申请日:2021-03-25

    Abstract: Embodiments described herein relate to nanostructured trans-reflective filters having sub-wavelength dimensions. In one embodiment, the trans-reflective filter includes a film stack that transmits a filtered light within a range of wavelengths and reflects light not within the first range of wavelengths. The film stack includes a first metal film disposed on a substrate having a first thickness, a first dielectric film disposed on the first metal film having a second thickness, a second metal film disposed on the first dielectric film having a third thickness, and a second dielectric film disposed on the second metal film having a fourth thickness.

    Encapsulation Having Polymer and Dielectric Layers for Electronic Displays

    公开(公告)号:US20210159458A1

    公开(公告)日:2021-05-27

    申请号:US16698824

    申请日:2019-11-27

    Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.

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