Method of imprinting tilt angle light gratings

    公开(公告)号:US10955606B2

    公开(公告)日:2021-03-23

    申请号:US16191340

    申请日:2018-11-14

    Abstract: Embodiments described herein relate to methods of fabricating waveguide structures with gratings having front angles less than about 45° and back angles less than about 45°. The methods include imprinting stamps into nanoimprint resists disposed on substrates. The nanoimprint resists are subjected to a cure process. The stamps are released from the nanoimprint resist at a release angle ϑ using a release method. The nanoimprint resists are subjected to an anneal process to form a waveguide structure comprising a plurality of gratings with a front angle α and a back angle β relative to a second plane of the surface of the substrate less than about 45°.

    Method of direct etching fabrication of waveguide combiners

    公开(公告)号:US11662516B2

    公开(公告)日:2023-05-30

    申请号:US17730280

    申请日:2022-04-27

    CPC classification number: G02B6/0065 G02B6/0038 G03F7/0002 G03F7/0005

    Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

    Method of direct etching fabrication of waveguide combiners

    公开(公告)号:US11327218B2

    公开(公告)日:2022-05-10

    申请号:US16762869

    申请日:2018-11-13

    Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

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