摘要:
A method of providing a freestanding semiconductor layer on a conventional SOI or bulk-substrate silicon device includes forming an amorphous or polycrystalline mandrel on a monocrystalline base structure. A conformal polycrystalline semiconductor layer is then formed on the mandrel and on the base structure, wherein the polycrystalline layer contacts the base structure. The polycrystalline semiconductor layer is then recrystallized so that it has a crystallinity substantially similar to that of the base structure. Thus, a freestanding semiconductor layer is formed with a high degree of control of the thickness and height thereof and maintaining a uniformity of thickness.
摘要:
A field effect transistor and method of fabricating the field effect transistor. The field effect transistor, including: a gate electrode formed on a top surface of a gate dielectric layer, the gate dielectric layer on a top surface of a single-crystal silicon channel region, the single-crystal silicon channel region on a top surface of a Ge including layer, the Ge including layer on a top surface of a single-crystal silicon substrate, the Ge including layer between a first dielectric layer and a second dielectric layer on the top surface of the single-crystal silicon substrate.
摘要:
The present invention provides a one way valve having a valve body, a wall, a fluid inlet, and a fluid outlet. The valve has a plunger which is moveable with respect to the valve body from a first position to a second position. The valve also has a diaphragm positioned in the valve body for movement between a third position and a fourth position when the plunger is in the first position. When the diaphragm is in the third position the fluid outlet is closed and when the diaphragm is in the fourth position the fluid outlet is open.
摘要:
Air-gap insulated interconnection structures and methods of fabricating the structures, the methods including: forming a dielectric layer on a substrate; forming a capping layer on a top surface of the dielectric layer; forming a trench through the capping layer, the trench extending toward said substrate and into but not through, the dielectric layer; forming a sacrificial layer on opposing sidewalls of the trench; filling the trench with a electrical conductor; and removing a portion of the sacrificial layer from between the electrical conductor and the dielectric layer to form air-gaps.
摘要:
A FinFET device and a method of lowering a gate capacitance and extrinsic resistance in a field effect transistor, wherein the method comprises forming an isolation layer comprising a BOX layer over a substrate, configuring source/drain regions above the isolation layer, forming a fin structure over the isolation layer, configuring a first gate electrode adjacent to the fin structure, disposing a gate insulator between the first gate electrode and the fin structure, positioning a second gate electrode transverse to the first gate electrode, and depositing a third gate electrode on the fin structure, the first gate electrode, and the second gate electrode, wherein the isolation layer is formed beneath the insulator, the first gate electrode, and the fin structure. The method further comprises sandwiching the second gate electrode with a dielectric material. The fin structure is formed by depositing an oxide layer over a silicon layer.
摘要:
A method and structure for tuning a threshold voltage of nFET and pFET devices in a double-gate CMOS integrated circuit structure, wherein the method comprises performing a PSP (post silicide processing) electrical test on the double-gate CMOS integrated circuit structure, determining nFET and pFET threshold voltages during the PSP test, and implanting the double-gate CMOS integrated circuit structure with an alkali metal ion, wherein the step of implanting adjusts the nFET and pFET threshold voltages by an amount required to match desired off-currents for the nFET and pFET devices. According to the method, prior to the step of performing, the method comprises forming a fin structure over an isolation layer, forming source/drain regions over the fin structure, depositing a gate oxide layer adjacent to the source/drain regions, and forming a gate region over the gate oxide layer and the fin structure. The metal ion comprises any of cesium and rubidium.
摘要:
The present invention provides a container assembly having: (1) a flexible wall defining fluid tight chamber; (2) a valve body attached to the flexible; (3) a plunger associated with the valve body and moveable with respect to the valve body from a first position to a second position; and (4) a diaphragm positioned in the valve body for opening and closing the valve.
摘要:
The present invention provides a method for treating a surface of a layered polymeric structure. The method includes the steps of: (1) providing a film having a layered structure formed by adhering first and second non-molten polymeric sheets in an overlap and texturing a surface of the first or second non-molten sheets with a chill roll to form fluid pathways on a surface of the film; (2) attaching an access member to the film; and (3) forming the film into a container having a peripheral seal defining a chamber, and having the fluid pathways facing the chamber and having the fitment providing access to the chamber.
摘要:
A method of forming a semiconductor device. A first dielectric layer is deposited on and in direct mechanical contact with the substrate. A first hard mask is deposited on the first dielectric layer. A first and second trench is formed within the first dielectric layer and the first hard mask. The second trench is wider than the first trench. A first conformal liner is deposited over the first hard mask and within the first and second trenches, a portion of which is removed, leaving a remaining portion of the first conformal liner in direct physical contact with the substrate, the first dielectric layer, and the first hard mask, and not on the first hard mask. Copper is deposited over the first conformal liner to overfill fill the first and second trenches and is planarized to remove an excess thereof to form a planar surface of the copper.
摘要:
A serving tray assembly includes a serving platter and a receptacle platter. The serving platter has a central aperture extending there through and a serving area defined between the central aperture and a perimeter thereof. The receptacle platter has a bottom and a peripheral wall extending from the bottom at a perimeter thereof. The serving platter and the receptacle platter are releasably coupled to one another.