SEMICONDUCTOR DEVICE HAVING FREESTANDING SEMICONDUCTOR LAYER
    61.
    发明申请
    SEMICONDUCTOR DEVICE HAVING FREESTANDING SEMICONDUCTOR LAYER 有权
    具有自动半导体层的半导体器件

    公开(公告)号:US20060231929A1

    公开(公告)日:2006-10-19

    申请号:US11426698

    申请日:2006-06-27

    IPC分类号: H01L29/06

    摘要: A method of providing a freestanding semiconductor layer on a conventional SOI or bulk-substrate silicon device includes forming an amorphous or polycrystalline mandrel on a monocrystalline base structure. A conformal polycrystalline semiconductor layer is then formed on the mandrel and on the base structure, wherein the polycrystalline layer contacts the base structure. The polycrystalline semiconductor layer is then recrystallized so that it has a crystallinity substantially similar to that of the base structure. Thus, a freestanding semiconductor layer is formed with a high degree of control of the thickness and height thereof and maintaining a uniformity of thickness.

    摘要翻译: 在传统的SOI或体衬底硅器件上提供独立半导体层的方法包括在单晶基底结构上形成非晶或多晶心轴。 然后在心轴和基底结构上形成共形多晶半导体层,其中多晶层接触基底结构。 然后将多晶半导体层重结晶,使其具有与基础结构基本相似的结晶度。 因此,以高度控制其厚度和高度的方式形成独立的半导体层并保持厚度的均匀性。

    One way valve and container
    63.
    发明申请
    One way valve and container 有权
    单向阀和容器

    公开(公告)号:US20060131328A1

    公开(公告)日:2006-06-22

    申请号:US11092384

    申请日:2005-03-29

    申请人: Brent Anderson

    发明人: Brent Anderson

    IPC分类号: B65D35/28

    摘要: The present invention provides a one way valve having a valve body, a wall, a fluid inlet, and a fluid outlet. The valve has a plunger which is moveable with respect to the valve body from a first position to a second position. The valve also has a diaphragm positioned in the valve body for movement between a third position and a fourth position when the plunger is in the first position. When the diaphragm is in the third position the fluid outlet is closed and when the diaphragm is in the fourth position the fluid outlet is open.

    摘要翻译: 本发明提供一种具有阀体,壁,流体入口和流体出口的单向阀。 该阀具有可从第一位置到第二位置相对于阀体移动的柱塞。 阀还具有位于阀体中的隔膜,用于当柱塞处于第一位置时在第三位置和第四位置之间移动。 当隔膜处于第三位置时,流体出口关闭,当隔膜处于第四位置时,流体出口打开。

    FINFET WITH LOW GATE CAPACITANCE AND LOW EXTRINSIC RESISTANCE
    65.
    发明申请
    FINFET WITH LOW GATE CAPACITANCE AND LOW EXTRINSIC RESISTANCE 有权
    具有低门电容和低极限电阻的FINFET

    公开(公告)号:US20060043616A1

    公开(公告)日:2006-03-02

    申请号:US10711170

    申请日:2004-08-30

    IPC分类号: H01L31/109

    摘要: A FinFET device and a method of lowering a gate capacitance and extrinsic resistance in a field effect transistor, wherein the method comprises forming an isolation layer comprising a BOX layer over a substrate, configuring source/drain regions above the isolation layer, forming a fin structure over the isolation layer, configuring a first gate electrode adjacent to the fin structure, disposing a gate insulator between the first gate electrode and the fin structure, positioning a second gate electrode transverse to the first gate electrode, and depositing a third gate electrode on the fin structure, the first gate electrode, and the second gate electrode, wherein the isolation layer is formed beneath the insulator, the first gate electrode, and the fin structure. The method further comprises sandwiching the second gate electrode with a dielectric material. The fin structure is formed by depositing an oxide layer over a silicon layer.

    摘要翻译: FinFET器件和降低场效应晶体管中的栅极电容和非固有电阻的方法,其中所述方法包括在衬底上形成包括BOX层的隔离层,在隔离层上方构成源/漏区,形成鳍结构 在所述隔离层上方配置与所述鳍结构相邻的第一栅电极,在所述第一栅电极和所述鳍结构之间设置栅极绝缘体,将第二栅电极定位成横向于所述第一栅电极,以及将第三栅电极 鳍结构,第一栅电极和第二栅电极,其中隔离层形成在绝缘体下方,第一栅电极和鳍结构之下。 该方法还包括用电介质材料夹住第二栅电极。 翅片结构通过在硅层上沉积氧化物层而形成。

    METHOD AND STRUCTURE FOR PROVIDING TUNED LEAKAGE CURRENT IN CMOS INTEGRATED CIRCUIT
    66.
    发明申请
    METHOD AND STRUCTURE FOR PROVIDING TUNED LEAKAGE CURRENT IN CMOS INTEGRATED CIRCUIT 失效
    在CMOS集成电路中提供调谐漏电流的方法和结构

    公开(公告)号:US20050275015A1

    公开(公告)日:2005-12-15

    申请号:US10710006

    申请日:2004-06-11

    摘要: A method and structure for tuning a threshold voltage of nFET and pFET devices in a double-gate CMOS integrated circuit structure, wherein the method comprises performing a PSP (post silicide processing) electrical test on the double-gate CMOS integrated circuit structure, determining nFET and pFET threshold voltages during the PSP test, and implanting the double-gate CMOS integrated circuit structure with an alkali metal ion, wherein the step of implanting adjusts the nFET and pFET threshold voltages by an amount required to match desired off-currents for the nFET and pFET devices. According to the method, prior to the step of performing, the method comprises forming a fin structure over an isolation layer, forming source/drain regions over the fin structure, depositing a gate oxide layer adjacent to the source/drain regions, and forming a gate region over the gate oxide layer and the fin structure. The metal ion comprises any of cesium and rubidium.

    摘要翻译: 一种用于在双栅极CMOS集成电路结构中调谐nFET和pFET器件的阈值电压的方法和结构,其中该方法包括在双栅极CMOS集成电路结构上执行PSP(后硅化物处理)电测试,确定nFET 和PSFET测试期间的pFET阈值电压,以及用碱金属离子注入双栅极CMOS集成电路结构,其中注入步骤将nFET和pFET阈值电压调整为与nFET匹配期望的截止电流所需的量 和pFET器件。 根据该方法,在执行步骤之前,该方法包括在隔离层上形成翅片结构,在翅片结构上形成源极/漏极区域,在栅极/漏极区域附近沉积栅极氧化物层,并形成 栅极区域在栅极氧化物层和鳍结构上。 金属离子包括任何铯和铷。

    One way valve for fluid evacuation from a container
    67.
    发明授权
    One way valve for fluid evacuation from a container 有权
    用于从容器排出液体的单向阀

    公开(公告)号:US07552907B2

    公开(公告)日:2009-06-30

    申请号:US12080134

    申请日:2008-04-01

    申请人: Brent Anderson

    发明人: Brent Anderson

    IPC分类号: F16K31/44

    CPC分类号: B65D81/2038

    摘要: The present invention provides a container assembly having: (1) a flexible wall defining fluid tight chamber; (2) a valve body attached to the flexible; (3) a plunger associated with the valve body and moveable with respect to the valve body from a first position to a second position; and (4) a diaphragm positioned in the valve body for opening and closing the valve.

    摘要翻译: 本发明提供了一种容器组件,其具有:(1)限定流体密封室的柔性壁; (2)安装在柔性件上的阀体; (3)与所述阀体相关联并且能够相对于所述阀体从第一位置移动到第二位置的柱塞; 和(4)位于阀体中的用于打开和关闭阀的隔膜。

    Fluids container
    68.
    发明申请
    Fluids container 审中-公开
    流体容器

    公开(公告)号:US20080199110A1

    公开(公告)日:2008-08-21

    申请号:US11207563

    申请日:2005-08-19

    IPC分类号: B65D30/10 B65D30/02 B29C63/48

    摘要: The present invention provides a method for treating a surface of a layered polymeric structure. The method includes the steps of: (1) providing a film having a layered structure formed by adhering first and second non-molten polymeric sheets in an overlap and texturing a surface of the first or second non-molten sheets with a chill roll to form fluid pathways on a surface of the film; (2) attaching an access member to the film; and (3) forming the film into a container having a peripheral seal defining a chamber, and having the fluid pathways facing the chamber and having the fitment providing access to the chamber.

    摘要翻译: 本发明提供了一种处理层状聚合物结构的表面的方法。 该方法包括以下步骤:(1)提供具有层叠结构的薄膜,该薄膜通过将第一和第二非熔融聚合物薄片以重叠的方式粘合而形成,并使第一或第二非熔融薄片的表面具有冷却辊以形成 膜表面上的流体路径; (2)将访问构件附接到所述胶片; 和(3)将膜形成为具有限定腔室的周边密封件的容器,并且具有面向腔室的流体通道并且具有提供通向腔室的通路的容器。

    METHOD OF FORMING DAMASCENE FILAMENT WIRES
    69.
    发明申请
    METHOD OF FORMING DAMASCENE FILAMENT WIRES 有权
    形成大片纤维线的方法

    公开(公告)号:US20080096384A1

    公开(公告)日:2008-04-24

    申请号:US11839767

    申请日:2007-08-16

    IPC分类号: H01L21/4763

    摘要: A method of forming a semiconductor device. A first dielectric layer is deposited on and in direct mechanical contact with the substrate. A first hard mask is deposited on the first dielectric layer. A first and second trench is formed within the first dielectric layer and the first hard mask. The second trench is wider than the first trench. A first conformal liner is deposited over the first hard mask and within the first and second trenches, a portion of which is removed, leaving a remaining portion of the first conformal liner in direct physical contact with the substrate, the first dielectric layer, and the first hard mask, and not on the first hard mask. Copper is deposited over the first conformal liner to overfill fill the first and second trenches and is planarized to remove an excess thereof to form a planar surface of the copper.

    摘要翻译: 一种形成半导体器件的方法。 第一电介质层沉积在衬底上并与衬底直接机械接触。 第一硬掩模沉积在第一介电层上。 第一和第二沟槽形成在第一介电层和第一硬掩模内。 第二沟槽比第一沟槽宽。 第一保形衬垫沉积在第一硬掩模之上并且在第一和第二沟槽内,其一部分被去除,留下第一保形衬垫的剩余部分与衬底,第一介电层和 第一个硬面罩,而不是在第一个硬面罩。 铜沉积在第一保形衬垫上以过满填充第一和第二沟槽,并被平坦化以除去其过量以形成铜的平坦表面。