Abstract:
An active matrix substrate including a substrate, a plurality of scan lines, a plurality of data lines and a plurality of sub-pixels is provided. The scan lines and the data lines are disposed on the substrate, and define a plurality of sub-pixel regions distributed in a delta arrangement. The sub-pixels corresponding to the sub-pixel regions are disposed on the substrate. The sub-pixels are electrically connected with corresponding scan lines and corresponding data lines. Between two sub-pixel regions corresponding to any two adjacent sub-pixels at a same side of one scan line, there are two data lines. Each sub-pixel includes an active device and a pixel electrode. The active device is electrically connected with a corresponding scan line and a corresponding data line. The pixel electrode is electrically connected with the active device, and extends from the sub-pixel region corresponding to the sub-pixel to a position over the data line.
Abstract:
The present invention discloses a method for depositing a coating layer on an article without edge bead formation by integrating the steps of an edge bead rinsing process with a coating spin-out process such that an edge portion of the wafer can be efficiently cleaned with a cleaning solvent when the coating material is still in its liquid state. While the present invention method can be applied to any coating materials and to any coated substrate, it is particularly suitable for cleaning a spin-on-glass material from a semiconductor wafer such that the wafer edge is not coated with a SOG material and thus particulate contamination caused by cracked SOG from the wafer edge can be avoided.
Abstract:
A new method of metal deposition with reduced metal residue after metal etching by cooling the wafer before metal deposition is described. A first patterned conducting layer is provided overlying a dielectric layer on the surface of a semiconductor substrate. The wafer is cooled to a temperature of less than about 20.degree. C. Thereafter, a metal layer is deposited overlying the first patterned conducting layer. The metal layer is etched away where it is not covered by a mask to complete formation of the metal line. Cooling of the wafer before metal deposition decreases the metal residue found after metal etching.
Abstract:
A pixel structure and a manufacturing method thereof are provided. The pixel structure includes a substrate, a scan line, a data line, a first insulating layer, an active device, a second insulating layer, a common electrode and a first pixel electrode. The data line crossed to the scan line is disposed on the substrate and includes a linear transmitting part and a cross-line transmitting part. The first insulating layer covering the scan line and the linear transmitting part is disposed between the scan line and the cross-line transmitting part. The active device, including a gate, an oxide channel, a source and a drain, is connected to the scan line and the data line. The second insulating layer is disposed on the oxide channel and the linear transmitting part. The common electrode is disposed above the linear transmitting part. The first pixel electrode is connected to the drain.
Abstract:
A pixel structure includes a scan line, a data line, an active element, a first passivation layer, a second passivation layer and a pixel electrode. The data line includes a first data metal segment and a second data metal layer. The active element includes a gate electrode, an insulating layer, a channel layer, a source and a drain. The channel layer is positioned on the insulating layer above the gate electrode. The source and the drain are positioned on the channel layer. The source is coupled to the data line. The first passivation layer and the second passivation layer cover the active element and form a first contact hole to expose a part of the drain. The second passivation layer covers a part edge of the drain. The pixel electrode is disposed across the second passivation layer and coupled to the drain via the first contact hole.
Abstract:
A tri-gate pixel structure includes three sub-pixel regions, three gate lines, a data line, three thin film transistors (TFTs), three pixel electrodes, and a common line. The gate lines are disposed along a first direction, and the data line is disposed along a second direction. The TFTs are disposed in the sub-pixel regions respectively, wherein each TFT has a gate electrode electrically connected to a corresponding gate line, a source electrode electrically connected to the data line, and a drain electrode. The three pixel electrodes are disposed in the three sub-pixel regions respectively, and each pixel electrode is electrically connected to the drain electrode of one TFT respectively. The common line crosses the gate lines and partially overlaps the three gate lines, and the common line and the three pixel electrodes are partially overlapped to respectively form three storage capacitors.
Abstract:
A liquid crystal display (LCD) panel and a manufacturing method thereof are provided. The manufacturing method includes providing a panel including a first substrate having scan lines, data lines, an active device electrically connecting the scan and data lines, and a pixel electrode electrically connecting the active device, a second substrate having an opposite electrode, and a liquid crystal (LC) layer disposed between the first and the second substrates and having a monomer material. A first curing voltage and a second curing voltage are applied to the scan and data lines, respectively. The second curing voltage is thus transmitted to the pixel electrode. The first curing voltage is higher than an absolute value of the second curing voltage. The monomer material is polymerized to form a first polymer stabilized alignment (PSA) layer between the LC layer and the first substrate and a second PSA layer between the LC layer and the second substrate. The electrical field is then removed.
Abstract:
A liquid crystal display unit structure and the manufacturing method thereof are provided. The liquid crystal display unit structure comprises a patterned first metal layer with a first data line segment and a gate line on a substrate; a patterned dielectric layer covering the first data line and the gate line having a plurality of first openings and a second opening therein, a patterned etch stop layer having a first portion located above the first data line segment and a second portion; a patterned second metal layer including a common electrode line, a second data line segment, a source electrode and a drain electrode, wherein the first portion of the patterned etch stop layer is between the first data line segment and the common line; a patterned passivation layer and a patterned transparent conductive layer.
Abstract:
The present invention in one aspect relates to a solar cell formed on a substrate, a bottom electrode member formed on the solar cell, an electrophoretic display panel formed on the bottom electrode member, having a plurality of electrophoretic cell structures spatially arranged in a matrix form, each electrophoretic cell structure containing a plurality of charged particles movable in the electrophoretic cell structure responsively to applied fields, and a top electrode member formed on the electrophoretic display panel, where at least one of the bottom electrode member and the top electrode member includes a plurality of in-plane switching (IPS) electrodes. Each IPS electrode is positioned in relation to a corresponding electrophoretic cell structure for controlling movements of the charged particles therein along a horizontal direction parallel to the electrophoretic display panel.
Abstract:
An active device array substrate and its fabricating method are provided. According to the subject invention, the elements of an array substrate such as the thin film transistors, gate lines, gate pads, data lines, data pads and storage electrodes, are provided by forming a patterned first metal layer, an insulating layer, a patterned semiconductor layer and a patterned metal multilayer. Furthermore, the subject invention uses the means of selectively etching certain layers. Using the aforesaid means, the array substrate of the subject invention has some layers with under-cut structures, and thus, the number of the time-consuming and complicated mask etching process involved in the production of an array substrate can be reduced. The subject invention provides a relatively simple and time-saving method for producing an array substrate.