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公开(公告)号:US20220111645A1
公开(公告)日:2022-04-14
申请号:US17560994
申请日:2021-12-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garrett E. Clark , Michael W. Cumbie , Chien-Hua Chen
Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
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公开(公告)号:US11292265B2
公开(公告)日:2022-04-05
申请号:US16761273
申请日:2017-12-02
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Si-Lam Choy , Michael W. Cumbie , Chien-Hua Chen
Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.
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公开(公告)号:US11278892B2
公开(公告)日:2022-03-22
申请号:US16494856
申请日:2017-04-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , Viktor Shkolnikov , Chien-Hua Chen
Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.
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公开(公告)号:US11235574B2
公开(公告)日:2022-02-01
申请号:US15772377
申请日:2016-02-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Garrett E. Clark , Michael W. Cumbie , Chien-Hua Chen
IPC: B01L99/00 , B41J2/05 , B41J2/14 , B01L3/00 , F04B43/04 , B81B1/00 , B81B7/00 , B81C1/00 , F04B19/00
Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
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公开(公告)号:US11235328B2
公开(公告)日:2022-02-01
申请号:US16494827
申请日:2017-04-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , Viktor Shkolnikov , Chien-Hua Chen
IPC: B01L3/00
Abstract: An apparatus includes a polymer base layer having a surface. A die that includes a fluid manipulation surface that is substantially coplanar with the surface of the polymer base layer. The die includes a control electrode to generate an electric field to perform microfluidic manipulation of fluid across the fluid manipulation surface of the die.
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公开(公告)号:US11225086B2
公开(公告)日:2022-01-18
申请号:US16466408
申请日:2017-03-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W Cumbie , Reynaldo V Villavelez , Chien-Hua Chen
IPC: B41J2/335
Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.
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公开(公告)号:US11225074B2
公开(公告)日:2022-01-18
申请号:US16500431
申请日:2017-09-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Chien-Hua Chen
Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber, an opening, and a fluid actuator disposed within the ejection chamber. Each nozzle also includes an inlet passage to deliver fluid into the ejection chamber and an outlet passage to deliver fluid out of the ejection chamber. The fluidic ejection die also includes an array of channels divided into inlet channels and outlet channels. Each inlet channel is fluidly connected to a respective plurality of inlet passages and each outlet channel is fluidly connected to a respective plurality of outlet passages.
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公开(公告)号:US20210370668A1
公开(公告)日:2021-12-02
申请号:US17058690
申请日:2019-01-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Eric Martin , Daryl E. Anderson , James R. Przybyla , Chien-Hua Chen , Diane R. Hammerstad
Abstract: One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.
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公开(公告)号:US20210347169A1
公开(公告)日:2021-11-11
申请号:US17251967
申请日:2019-01-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James R. Przybyla , Eric Martin , Daryl E. Anderson , Chien-Hua Chen
Abstract: One example provides a fluidic device including a substrate, a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A number of conductive traces are disposed in direct contact with the nozzle layer to provide electrical pathways above the substrate.
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公开(公告)号:US20210331165A1
公开(公告)日:2021-10-28
申请号:US16606287
申请日:2018-04-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Viktor Shkolnikov , Chien-Hua Chen
Abstract: An example system includes a microfluidic cavity; a retaining feature within the microfluidic cavity, and a releasing feature. The retaining feature is to position capsules at a predetermined location in the microfluidic cavity. The capsules have a thermally degradable shell enclosing a material therein. The releasing feature is to selectively cause degradation of the shell to release the material into the microfluidic opening. The releasing feature is to generate heat to facilitate degradation of the shell. In some examples, the retaining feature is a physical barrier sized to prevent flow of the capsule and to allow flow of the released materials through the microfluidic cavity.
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