公开(公告)号：US4839713A

公开(公告)日：1989-06-13

申请号：US156571

申请日：1988-02-17

申请人： Yasuhiro Teraoka ,  Tetsuya Ueda ,  Hideya Yagoura ,  Haruo Shimamoto ,  Shigeyuki Nango ,  Toshinobu Banjo ,  Hiroshi Seki

发明人： Yasuhiro Teraoka ,  Tetsuya Ueda ,  Hideya Yagoura ,  Haruo Shimamoto ,  Shigeyuki Nango ,  Toshinobu Banjo ,  Hiroshi Seki

IPC分类号： H01L23/057 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/50 ,  H01L23/057 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082

摘要： A package structure comprising a metallic cap having a bottom wall to which the bottom surface of the semiconductor chip is electrically and mechanically connected, a side wall extending from said bottom wall and surrounding the semiconductor chip, and a flange extending outwardly from said side wall substantially parallel to said bottom wall, said flange supporting the lead conductors thereon through an electrically insulating material. The electrical connection means is disposed between the metallic cap flange and the lead conductor for establishing an electrical connection therebetween. The electrical connection means may comprise an electrically conductive projection formed on the flange of the metal cap, extending through a notch in the insulating material and electrically connected to the lead conductor. The electrical connection means may be an electrically conductive bonding material filled within a cavity defined by an opening in the flange of the metal cap, a through hole in the insulating material and a connecting pad of the lead conductor.

摘要翻译： 一种包装结构，包括具有底壁的金属盖，半导体芯片的底表面电气和机械连接到该底壁，从所述底壁延伸并围绕半导体芯片的侧壁，以及从所述侧壁向外延伸的凸缘， 平行于所述底壁，所述凸缘通过电绝缘材料在其上支撑引线导体。 电连接装置设置在金属帽凸缘和引线导体之间，用于在它们之间建立电连接。 电连接装置可以包括形成在金属帽的凸缘上的导电突起，延伸穿过绝缘材料中的凹口并电连接到引线导体。 电连接装置可以是填充在由金属盖的凸缘中的开口，绝缘材料中的通孔和引线导体的连接焊盘限定的空腔内的导电接合材料。

公开(公告)号：US4640628A

公开(公告)日：1987-02-03

申请号：US753987

申请日：1985-07-11

申请人： Hiroshi Seki ,  Ryuichiro Kataishi

发明人： Hiroshi Seki ,  Ryuichiro Kataishi

IPC分类号： G08B17/00 ,  G08B29/18 ,  G01K3/00

CPC分类号： G08B29/183 ,  G08B17/00

摘要： A composite fire sensor comprising a first sensor element sensitive to a change in incident infrared rays, a second sensor element having a variable electric conductivity according to gas absorption/desorption, at least one comparator for combining the outputs of the first and second sensor elements, and a delay circuit for delaying the output of at least one of the comparators. Predetermined reference voltages are supplied to the comparators.

摘要翻译： 一种复合火灾传感器，包括对入射红外线变化敏感的第一传感器元件，具有根据气体吸收/解吸的可变电导率的第二传感器元件，用于组合第一和第二传感器元件的输出的至少一个比较器， 以及用于延迟至少一个比较器的输出的延迟电路。 将预定参考电压提供给比较器。