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公开(公告)号：US20090266800A1
公开(公告)日：2009-10-29
申请号：US12414975
申请日：2009-03-31
申请人： Hiroshi Morikazu , Keiji Honjo , Kenji Asano
发明人： Hiroshi Morikazu , Keiji Honjo , Kenji Asano
IPC分类号： B23K26/00
CPC分类号： B23K26/0853 , B23K26/0626 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： A laser processing method for a transparent plate having a predetermined breaking line including the step of applying a pulsed laser beam to the transparent plate along the breaking line to thereby form a laser processed groove. The pulsed laser beam has an absorption wavelength to the transparent plate. The repetition frequency of the pulsed laser beam is set to 200 kHz or more and the energy density per pulse of the pulsed laser beam is set to 3.8 J/cm2 or more.
摘要翻译： 一种具有预定断裂线的透明板的激光加工方法，包括沿着断裂线向脉冲激光束施加脉冲激光束，从而形成激光加工槽。 脉冲激光束具有到透明板的吸收波长。 将脉冲激光束的重复频率设定为200kHz以上，将脉冲激光的每脉冲的能量密度设定为3.8J / cm 2以上。
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公开(公告)号：US07473866B2
公开(公告)日：2009-01-06
申请号：US11483614
申请日：2006-07-11
CPC分类号： B23K26/364 , B23K26/0613 , B23K26/083 , B23K26/40 , B23K2101/40 , B23K2103/172
摘要： A laser processing apparatus comprising a chuck table, laser beam irradiation means for irradiating a workpiece held on the chuck table with a laser beam, and processing feed means for processing-feeding the chuck table and the laser beam irradiation means relative to each other. The laser beam irradiation means includes first laser beam irradiation means for throwing a first pulsed laser beam having a wavelength in the intermediate-infrared radiation region, and second laser beam irradiation means for throwing a second pulsed laser beam having a wavelength in the ultraviolet radiation region. The first laser beam irradiation means and the second laser beam irradiation means are set such that at least a part, in the processing feed direction, of the focus spot of the second pulsed laser beam overlaps the focus spot of the first pulsed laser beam.
摘要翻译： 一种激光加工装置，包括：卡盘台，激光束照射夹持台上夹持的工件的激光束照射装置，以及用于相对于彼此加工卡盘台和激光束照射装置的加工进给装置。 激光束照射装置包括用于投射在中红外辐射区域具有波长的第一脉冲激光束的第一激光束照射装置和用于投射在紫外线辐射区域中具有波长的第二脉冲激光束的第二激光束照射装置 。 第一激光束照射装置和第二激光束照射装置被设置为使得第二脉冲激光束的聚焦点的处理进给方向中的至少一部分与第一脉冲激光束的聚焦点重叠。
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公开(公告)号：US20080153315A1
公开(公告)日：2008-06-26
申请号：US12002036
申请日：2007-12-14
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： H01L21/00
CPC分类号： B23K26/0622 , B23K26/382 , B23K26/40 , B23K2103/50 , H01L21/76898
摘要： In a wafer processing method of radiating a pulsed-laser beam to a wafer from a back surface of a silicon substrate to form via holes reaching respective bonding pads, a plurality of devices being formed on a surface of the silicon substrate, the bonding pads being formed on each of the devices, a thickness of said bonding pad is set as being equal to or larger than 5 μm, a wavelength of the pulsed-laser beam is set to 355 nm, and an energy density per one pulse of the pulsed-laser beam is set in a range of 20 to 35 J/cm2.
摘要翻译： 在从硅衬底的背面向晶片辐射脉冲激光束以形成到达各个接合焊盘的通孔的晶片处理方法中，在硅衬底的表面上形成多个器件，所述接合焊盘为 形成在每个器件上，所述接合焊盘的厚度被设置为等于或大于5μm，脉冲激光束的波长被设置为355nm，脉冲激光束的每个脉冲的能量密度， 激光束设定在20〜35J / cm 2的范围内。
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公开(公告)号：US20080011725A1
公开(公告)日：2008-01-17
申请号：US11822974
申请日：2007-07-11
申请人： Toshio Tsuchiya , Hiroshi Morikazu
发明人： Toshio Tsuchiya , Hiroshi Morikazu
CPC分类号： B23K26/0861 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L21/78
摘要： A laser beam processing machine comprising a chuck table, a laser beam application means for applying a laser beam to a workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction, wherein the laser beam application means comprises a first laser beam oscillation means for oscillating a first pulse laser beam having a wavelength ranging from a visible range to a near infrared range, a second laser beam oscillation means for oscillating a second pulse laser beam having a wavelength of an ultraviolet range, a delay means for delaying the timing of oscillating the second pulse laser beam a predetermined time after the timing of oscillating the first pulse laser beam and a common condenser for converging the first pulse laser beam and the second pulse laser beam.
摘要翻译： 一种激光束处理机，包括：卡盘台，用于将激光束施加到夹持在卡盘台上的工件的激光束施加装置;以及用于相对于彼此移动卡盘台和激光束施加装置的加工进给装置 在处理供给方向上，其中所述激光束施加装置包括用于振荡具有从可见范围到近红外范围的波长的第一脉冲激光束的第一激光束振荡装置，用于振荡 具有紫外线范围波长的第二脉冲激光束，延迟装置，用于在振荡第一脉冲激光束的定时和用于会聚第一脉冲激光束的公共电容器之后的预定时间内延迟振荡第二脉冲激光束的定时 和第二脉冲激光束。
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公开(公告)号：US20080011723A1
公开(公告)日：2008-01-17
申请号：US11822657
申请日：2007-07-09
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： B23K26/00
CPC分类号： B23K26/0853 , B23K26/0622 , B23K26/067 , B23K26/082 , B23K26/16 , B23K26/382 , B23K26/40 , B23K2103/50 , H01L21/67092 , H01L2924/0002 , H01L2924/00
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction and an indexing-feed means for moving the chuck table and the laser beam application means in an indexing-feed direction perpendicular to the processing-feed direction, wherein the laser beam application means comprises a first laser beam application means for applying a first pulse laser beam having an energy density per one pulse of 20 to 60 J/cm2 and a second laser beam application means for applying a second pulse laser beam having an energy density per one pulse of 3 to 20 J/cm2.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到夹持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对于相对于 在处理供给方向上彼此相对并且分度馈送装置用于沿垂直于处理供给方向的分度馈送方向移动卡盘台和激光束施加装置，其中激光束施加装置包括第一激光束 用于施加具有20至60J / cm 2的每个脉冲的能量密度的第一脉冲激光束的施加装置和用于施加具有每个能量密度的第二脉冲激光束的第二激光束施加装置 3〜20J / cm 2的一个脉冲。
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公开(公告)号：US20080011722A1
公开(公告)日：2008-01-17
申请号：US11822972
申请日：2007-07-11
IPC分类号： B23K26/08 , B23K26/02 , B23K26/067
CPC分类号： B23K26/0853 , B23K26/0622 , B23K26/705 , B23K2101/40
摘要： Disclosed a laser processing device capable of recognizing a failure of pulsed laser beam irradiation during a process of pulsed laser beam irradiation and taking appropriate measures. A first judgment section and a second judgment section monitor respectively whether a pulsed laser beam is actually irradiated by an oscillation of a laser oscillator at the timing when a pulse signal is output from a pulse signal output section and whether the pulse signal output section outputs the pulse signal as setting to the laser oscillator at the timing when the pulse signal is output based on the preset pulse number. When there is a failure of the pulsed laser beam irradiation during the processing, the occurrence of failure is recognized and it can be recognized whether the failure is caused by a laser beam irradiating unit or a controller including the pulse signal output section.
摘要翻译： 公开了一种能够识别在脉冲激光束照射过程中脉冲激光束照射失败并采取适当措施的激光加工装置。 第一判断部分和第二判断部分分别监视在从脉冲信号输出部分输出脉冲信号的时刻脉冲激光束是否被激光振荡器的振荡实际照射，以及脉冲信号输出部分是否输出 脉冲信号作为在基于预设脉冲数输出脉冲信号的定时的激光振荡器的设置。 当在处理期间发生脉冲激光束照射失败时，识别故障的发生，并且可以识别是否由激光束照射单元或包括脉冲信号输出部的控制器引起故障。
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公开(公告)号：US20060249496A1
公开(公告)日：2006-11-09
申请号：US11414352
申请日：2006-05-01
IPC分类号： B23K26/08 , B23K26/067
CPC分类号： B23K26/0608 , B23K26/0604 , B23K26/16 , B23K26/364
摘要： A processing method and apparatus using a laser beam, which can expel as much debris, produced upon application of a laser beam, as possible out of a workpiece to minimize the debris remaining on side surfaces of grooves. The processing method and apparatus superpose a first laser beam (30A) having a width D1 of a focal spot, and a second laser beam (30B) having a focal spot (32B) upstream, in a beam advancing direction, of the focal spot of the first laser beam, and having a width D2 of a beam spot at the focal spot of the first laser beam, D2 being larger than D1 (D2>D1); and apply the superposed laser beams to the workpiece.
摘要翻译： 一种使用激光束的处理方法和装置，其可以排除尽可能多的碎片，在施加激光束时可能从工件中产生，以最小化残留在凹槽的侧表面上的碎屑。 处理方法和装置将具有焦点宽度D 1的第一激光束（30A）和在光束前进方向上具有焦斑（32B）上游的第二激光束（30B）叠加在 第一激光束的焦斑，并且在第一激光束的焦斑处具有束斑的宽度D 2，D 2大于D 1（D 2> D 1）; 并将叠加的激光束施加到工件。
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公开(公告)号：US20060163224A1
公开(公告)日：2006-07-27
申请号：US11338761
申请日：2006-01-25
IPC分类号： B23K26/00
CPC分类号： B23K37/0235 , B23K26/0622 , B23K26/0853 , B23K26/0876 , B23K26/40 , B23K37/0408 , B23K37/0435 , B23K2103/172 , B23K2103/50
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the chuck table comprises a body and a workpiece holding member disposed on the top surface of the body, and the workpiece holding member is made of a material which transmits a laser beam having a predetermined wavelength.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到夹持在卡盘台上的工件的激光束施加装置，以及用于移动卡盘台和激光束施加装置的加工进给装置 相对于彼此，其中所述卡盘台包括主体和设置在所述主体的顶表面上的工件保持构件，并且所述工件保持构件由透射具有预定波长的激光束的材料制成。
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公开(公告)号：US08759195B2
公开(公告)日：2014-06-24
申请号：US13331554
申请日：2011-12-20
申请人： Hiroshi Morikazu , Yoko Nishino
发明人： Hiroshi Morikazu , Yoko Nishino
IPC分类号： H01L21/30
CPC分类号： H01L33/0079 , B23K26/364 , B23K26/40 , B23K26/57 , B23K2103/172
摘要： An optical device layer (ODL) in an optical device wafer is transferred to a transfer substrate. The ODL is formed on the front side of an epitaxy substrate through a buffer layer. The ODL is partitioned by a plurality of crossing streets to define regions where a plurality of optical devices are formed. The transfer substrate is bonded to the front side of the ODL, and the epitaxy substrate is cut along crossing streets into a plurality of blocks. A laser beam is applied to the epitaxy substrate from the back side of the epitaxy substrate to the unit of the optical device wafer and the transfer substrate in the condition where the focal point of the laser beam is set in the buffer layer, thereby decomposing the buffer layer. The epitaxy substrate divided into the plurality of blocks is peeled off from the ODL.
摘要翻译： 光学器件晶片中的光学器件层（ODL）被转移到转移衬底。 ODL通过缓冲层形成在外延基板的正面上。 ODL被多个交叉街道划分，以限定形成多个光学装置的区域。 转印衬底粘合到ODL的前侧，并且将外延衬底沿着交叉街道切割成多个块。 在激光束的焦点设置在缓冲层中的状态下，将激光束从外延基板的背面施加到外延基板的单元到光学器件晶片和转印基板的单元，从而将激光束分解 缓冲层。 被划分成多个块的外延衬底从ODL剥离。
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公开(公告)号：US08518803B2
公开(公告)日：2013-08-27
申请号：US12771817
申请日：2010-04-30
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/0624 , B23K26/40 , B23K2103/50 , B23K2103/56 , H01L21/67132 , H01L21/67144 , H01L21/6836 , H01L2221/68336
摘要： A laser processing method for a semiconductor wafer including a groove forming step of applying a pulsed laser beam having an absorption wavelength to the semiconductor wafer along a division line formed on the semiconductor wafer to thereby form a laser processed groove along the division line on the semiconductor wafer, wherein the pulse width of the pulsed laser beam to be applied in the groove forming step is set to 2 ns or less, and the peak energy density per pulse of the pulsed laser beam is set less than or equal to an inflection point where the depth of the laser processed groove steeply increases with an increase in the peak energy density.
摘要翻译： 一种半导体晶片的激光加工方法，包括：沟槽形成工序，沿着形成在半导体晶片上的分割线向半导体晶片施加具有吸收波长的脉冲激光束，从而沿着半导体上的分割线形成激光加工槽 晶片，其中在沟槽形成步骤中施加的脉冲激光束的脉冲宽度设定为2ns以下，脉冲激光束的每个脉冲的峰值能量密度设定为小于或等于拐点， 随着峰值能量密度的增加，激光加工槽的深度急剧增加。
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