公开(公告)号：US5587882A

公开(公告)日：1996-12-24

申请号：US521480

申请日：1995-08-30

申请人： Chandrakant Patel

发明人： Chandrakant Patel

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L23/3675 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166

摘要： A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a trough formed within a substrate of the MCM. A thermal transfer medium positioned between the heat sink and the chips forms a thermal interface having a low thermal resistance. This cools the chips and ensures reliable operation of the MCM. The trough is filled with a curable adhesive, securing the heat sink to the substrate of the MCM.

摘要翻译： 参考方案提供散热器和多芯片模块（MCM）内的芯片之间的热接口。 参考方案包括具有穿过形成在MCM的衬底内的槽的支撑环的散热器。 位于散热器和芯片之间的热转印介质形成具有低热阻的热界面。 这样可以冷却芯片，确保MCM的可靠运行。 槽中填充有可固化的粘合剂，将散热片固定到MCM的基材上。

公开(公告)号：US5396403A

公开(公告)日：1995-03-07

申请号：US88288

申请日：1993-07-06

申请人： Chandrakant Patel

发明人： Chandrakant Patel

IPC分类号： H01L23/34 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/16152 ,  H01L2924/3011

摘要： A heat sink assembly for a multichip module. A thermally conductive plate is bonded to integrated circuit chips on a multichip module by indium solder. The plate in turn is thermally coupled to a heat sink such as finned aluminum by thermal paste. The plate is made of a material such as silicon carbide or copper-tungsten alloy having a relatively low coefficient of expansion to minimize mechanical stress resulting from lateral motion of the chips due to thermal expansion. Relatively low-power chips may be thermally coupled to the plate by thermal paste instead of being bonded by solder.

摘要翻译： 用于多芯片模块的散热器组件。 导热板通过铟焊料与多芯片组件上的集成电路芯片接合。 该板依次通过热粘贴热耦合到诸如翅片铝的散热器。 该板由诸如碳化硅或铜 - 钨合金的材料制成，具有相对较低的膨胀系数，以最小化由于热膨胀而导致芯片的横向运动引起的机械应力。 相对低功率的芯片可以通过热焊膏热耦合到板上，而不是通过焊料粘合。

公开(公告)号：US08212230B2

公开(公告)日：2012-07-03

申请号：US13244514

申请日：2011-09-25

申请人： Amip Shah ,  Chandrakant Patel ,  Ratnesh Sharma ,  Cullen Bash

发明人： Amip Shah ,  Chandrakant Patel ,  Ratnesh Sharma ,  Cullen Bash

IPC分类号： G11C11/00

CPC分类号： H01L23/34 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments include methods, apparatus, and systems with integrated circuits having phase change devices. One embodiment includes an integrated circuit die and a phase change die having a phase change material that changes phases when a temperature at the integrated circuit die exceeds a threshold for a predetermined amount of time.

摘要翻译： 实施例包括具有具有相变装置的集成电路的方法，装置和系统。 一个实施例包括集成电路管芯和具有相变材料的相变管芯，该相变材料在集成电路管芯的温度超过阈值达预定时间量时改变相位。

公开(公告)号：US20110029153A1

公开(公告)日：2011-02-03

申请号：US12935985

申请日：2008-04-01

申请人： Amip Shah ,  Chandrakant Patel

发明人： Amip Shah ,  Chandrakant Patel

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/206 ,  G06F1/3203 ,  G06F1/3287 ,  G06F1/329 ,  Y02D10/16 ,  Y02D10/171 ,  Y02D10/24

摘要： In a method for managing cooling provisioning in a three-dimensional package containing a plurality of stacked die with a cooling system having at least one active cooling mechanism, at least one of workload on and an environmental condition at or around one of the plurality of stacked die is identified. In addition, at least one of the active cooling mechanism and the one of the plurality of stacked die is controlled based upon at least one of the identified workload and environmental condition.

摘要翻译： 一种用于管理三维包装中的冷却供应的方法，所述三维包装包含具有至少一个主动冷却机构的冷却系统的多个堆叠管芯，所述多个堆叠管芯中的至少一个堆叠 死亡被识别。 此外，基于所识别的工作量和环境条件中的至少一个来控​​制主动冷却机构和多个堆叠管芯中的至少一个。

公开(公告)号：US07707461B2

公开(公告)日：2010-04-27

申请号：US11700482

申请日：2007-01-31

申请人： Michael J. Dougherty ,  Chandrakant Patel

发明人： Michael J. Dougherty ,  Chandrakant Patel

IPC分类号： G06F11/00

CPC分类号： G11B20/1816 ,  G11B19/048 ,  G11B27/36 ,  G11B2220/2516

摘要： A digital media drive failure prediction system comprises a prediction module configured to analyze a current draw associated with a digital media drive measured at least two different operating times of the digital media drive to automatically determine whether a different between the measured current draws indicates an impending failure of the digital media drive.

摘要翻译： 数字媒体驱动器故障预测系统包括预测模块，该预测模块被配置为分析与在数字媒体驱动器的至少两个不同操作时间测量的数字媒体驱动相关联的当前画面，以自动确定所测量的当前画面之间的不同是否表示即将到来 数字媒体驱动器的故障。

公开(公告)号：US20080180084A1

公开(公告)日：2008-07-31

申请号：US11700482

申请日：2007-01-31

申请人： Michael J. Dougherty ,  Chandrakant Patel

发明人： Michael J. Dougherty ,  Chandrakant Patel

IPC分类号： G01S13/00

CPC分类号： G11B20/1816 ,  G11B19/048 ,  G11B27/36 ,  G11B2220/2516

摘要： A digital media drive failure prediction system comprises a prediction module configured to analyze a current draw associated with a digital media drive measured at least two different operating times of the digital media drive to automatically determine whether a different between the measured current draws indicates an impending failure of the digital media drive.

摘要翻译： 数字媒体驱动器故障预测系统包括预测模块，该预测模块被配置为分析与在数字媒体驱动器的至少两个不同操作时间测量的数字媒体驱动相关联的当前画面，以自动确定所测量的当前画面之间的不同是否表示即将到来 数字媒体驱动器的故障。

公开(公告)号：US20060080001A1

公开(公告)日：2006-04-13

申请号：US10960574

申请日：2004-10-08

申请人： Cullen Bash ,  Chandrakant Patel ,  Ratnesh Sharma ,  Abdlmonem Beitelmal

发明人： Cullen Bash ,  Chandrakant Patel ,  Ratnesh Sharma ,  Abdlmonem Beitelmal

IPC分类号： G05B15/00

CPC分类号： G05D23/1934

摘要： In a method for correlating vent tiles with racks based upon vent tile settings and rack inlet temperatures, the vent tiles are set to a first setting, the first vent tile settings are recorded and the temperatures at the inlets of the racks are detected at the first vent tile settings. One of the vent tiles is closed to obtain a second setting, the second vent tile settings are recorded and the temperatures at the inlets of the racks are detected at the second vent tile settings. In addition, the vent tiles and the racks are correlated based upon the settings of the vent tiles and the temperatures detected at the first vent tile settings and the second vent tile settings.

摘要翻译： 在根据排气瓦设置和机架入口温度将通风瓦与机架相关联的方法中，排气瓦被设置为第一设定，记录第一排气瓦设置，并且在第一次检测到机架入口处的温度 通风瓦设置。 一个通风瓦片关闭以获得第二设定，记录第二排气瓦设置，并且在第二排气瓦设置处检测机架入口处的温度。 此外，排气瓦片和机架基于排气瓦片的设置和在第一排气瓦设置和第二排气瓦设置处检测到的温度而相关。

公开(公告)号：US20050173549A1

公开(公告)日：2005-08-11

申请号：US10772318

申请日：2004-02-06

申请人： Cullen Bash ,  David Moore ,  Chandrakant Patel

发明人： Cullen Bash ,  David Moore ,  Chandrakant Patel

IPC分类号： G05D1/02 ,  G05D23/19 ,  G05D23/00

CPC分类号： G05D1/0282 ,  G05D1/0225 ,  G05D1/0246 ,  G05D1/0255 ,  G05D23/1932 ,  G05D2201/0207

摘要： A system for collecting data in a room. The system includes a plurality of sensor devices positioned at various locations in the room. The sensor devices include a sensor configured to detect at least one condition and a controller configured to control the sensor. The system also includes at least one data storage device configured to store the detected at least one condition and an interface mechanism for enabling communication of the stored at least one condition. The system further includes a data collector for interfacing with the interface mechanism to receive the stored at least one condition from the at least one data storage device.

摘要翻译： 用于在房间中收集数据的系统。 该系统包括定位在房间中的各个位置处的多个传感器装置。 传感器设备包括被配置为检测至少一个状态的传感器和被配置为控制传感器的控制器。 该系统还包括被配置为存储检测到的至少一个条件的至少一个数据存储设备和用于实现所存储的至少一个条件的通信的接口机制。 该系统还包括数据收集器，用于与接口机构接口以从至少一个数据存储设备接收存储的至少一个条件。

公开(公告)号：US20050159845A1

公开(公告)日：2005-07-21

申请号：US10759781

申请日：2004-01-15

申请人： Christopher Malone ,  Chandrakant Patel

发明人： Christopher Malone ,  Chandrakant Patel

IPC分类号： G05B13/00 ,  G06F1/20 ,  G06F1/32

CPC分类号： G06F1/206 ,  G06F1/20 ,  G06F1/3203 ,  Y02D10/16

摘要： A computer fan efficiency feedback system and method are presented. In one embodiment, an indication electronic components are operating is received. A cooling system is directed to provide air flow to the electronic components. In one exemplary implementation the cooling system includes a fan. The fan speed is modulated in accordance with a fan speed efficiency control plan. For example, the fan speed efficiency control plan includes directions for changing or modulating the fan speed to a value that maximizes an efficiency ratio of flow work to input power supplied to the fan.

摘要翻译： 提出了一种计算机风扇效率反馈系统和方法。 在一个实施例中，接收正在操作的指示电子组件。 冷却系统被引导以向电子部件提供气流。 在一个示例性实施例中，冷却系统包括风扇。 风扇速度根据风扇转速效率控制计划进行调制。 例如，风扇转速效率控制计划包括将风扇速度改变或调节到将流量的效率比最大化到输入到风扇的输入功率的值的方向。

公开(公告)号：US20050122678A1

公开(公告)日：2005-06-09

申请号：US10728889

申请日：2003-12-08

申请人： Chandrakant Patel ,  Cullen Bash

发明人： Chandrakant Patel ,  Cullen Bash

IPC分类号： G06F1/16 ,  G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： A docking station includes a housing receiving a portable computer. A liquid-filled hollow structure is provided on a portion of the housing. The liquid-filled hollow structure is in thermally conductive relation to the portable computer when the portable computer is docked in the docking station such that heat is transferred from the portable computer to the liquid-filled hollow structure.

摘要翻译： 坞站包括容纳便携式计算机的壳体。 在壳体的一部分上设置充满液体的中空结构。 当便携式计算机对接在对接站中时，液体填充的中空结构与便携式计算机处于导热关系，使得热量从便携式计算机传送到充满液体的中空结构。