Method and apparatus for testing a substrate
    61.
    发明授权
    Method and apparatus for testing a substrate 失效
    用于测试衬底的方法和装置

    公开(公告)号:US06730906B2

    公开(公告)日:2004-05-04

    申请号:US09977549

    申请日:2001-10-15

    CPC classification number: H01J37/244 H01J37/28

    Abstract: A method and apparatus for testing a substrate, wherein a particle beam is directed onto the substrate and emitted secondary particles are detected with a detector and then evaluated. The location of the site at which the secondary particles are emitted on the substrate relative to the position of the detector is taken into consideration during testing.

    Abstract translation: 一种用于测试衬底的方法和装置,其中将粒子束引导到衬底上,并且用检测器检测发射的次级颗粒,然后进行评估。 在测试期间考虑相对于检测器的位置在基底上发射次级粒子的位置的位置。

    Method for particle beam testing of substrates for liquid crystal
displays (LCD)
    62.
    发明授权
    Method for particle beam testing of substrates for liquid crystal displays (LCD) 失效
    液晶显示器(LCD)基板的粒子束测试方法

    公开(公告)号:US5414374A

    公开(公告)日:1995-05-09

    申请号:US123218

    申请日:1993-09-20

    CPC classification number: G01R31/305 G01R31/302 G01R31/308 G02F2001/136254

    Abstract: Method for particle beam testing of substrates for liquid crystal displays (LCD). This is directed to methods wherein, given a substrate (SUB1) for a liquid crystal display, either potentials or, respectively, currents are set in defined fashion with a particle beam (S1, S2 and S4) and/or potentials are measured by detecting secondary electrons (S5) at different switch statuses of the switch elements (T) of the substrate (SUB1). The geometrical integrity and the electrical functionability of the substrate (SUB1) are thereby tested, even though, for example, a supplementary plane electrode is not present for forming a capacitor. An important advantage of the method is that faulty substrates can be repaired or can be segregated even before further-processing and, thus, costs can be reduced.

    Abstract translation: 液晶显示器(LCD)基板的粒子束测试方法。 这涉及以下方法:其中,给定用于液晶显示器的衬底(SUB1),电势或电流分别以粒子束(S1,S2和S4)的形式设定,和/或电位通过检测 在基板(SUB1)的开关元件(T)的不同开关状态下的二次电子(S5)。 因此,即使例如辅助平面电极不存在用于形成电容器,也可以测试基板(SUB1)的几何完整性和电功能性。 该方法的一个重要优点是,即使在进一步处理之前,有缺陷的基板可以被修复或者可以被分离,因此可以降低成本。

    Method for the recognition of testing errors in the test of microwirings
    63.
    发明授权
    Method for the recognition of testing errors in the test of microwirings 失效
    在微波测试中识别测试错误的方法

    公开(公告)号:US5373233A

    公开(公告)日:1994-12-13

    申请号:US105760

    申请日:1993-08-13

    CPC classification number: G01R31/306

    Abstract: Method for the recognition of testing errors in a test of microwirings. The method for the recognition of testing errors in the test is used in particular in an electron beam test of microwirings in the form of a printed circuit board (LP) having a plurality of networks (NW1 . . . NW9). Every network has a plurality of contact points (1 . . . 24). Interruptions (U) in networks (NW2) and shorts (K1, K2) between networks (NW1 . . . NW3) of a test group (TG1) or, respectively, shorts (K3) between networks (NW2, NW4) of different test groups (TG1, TG2), that are found in a respective main test, are confirmed in a respective follow-up test or testing errors that arose in the main test, for example due to microfields or surface contaminations, are identified.

    Abstract translation: 在微波测试中识别测试错误的方法。 用于识别测试中测试误差的方法特别用于具有多个网络(NW1 ... NW9)的印刷电路板(LP)形式的微线的电子束测试中。 每个网络都有多个接触点(1 ... 24)。 测试组(TG1)的网络(NW1 ... NW3)之间的网络(NW2)和短路(K1,K2)中的中断(U)或不同测试的网络(NW2,NW4)之间的短路(K3) 在相应的主要测试中发现的组(TG1,TG2)在相应的随访测试中被确认,或者在主要测试中出现的测试错误,例如由于微场或表面污染而被识别。

    Method for the recognition of testing errors in the test of microwirings
    64.
    发明授权
    Method for the recognition of testing errors in the test of microwirings 失效
    在微波测试中识别测试错误的方法

    公开(公告)号:US5258706A

    公开(公告)日:1993-11-02

    申请号:US906564

    申请日:1992-06-29

    CPC classification number: G01R31/306

    Abstract: Method for the recognition of testing errors in a test of microwirings. The method for the recognition of testing errors in the test is used in particular in an electron beam test of microwirings in the form of a printed circuit board (LP) having a plurality of networks (NW1 . . . NW9). Every network has a plurality of contact points (1 . . . 24). Interruptions (U) in networks (NW 2) and shorts (K1, K2) between networks (NW1 . . . NW3) of a test group (TG1) or, respectively, shorts (K3) between networks (NW2, NW4) of different test groups (TG1, TG2), that are found in a respective main test, are confirmed in a respective follow-up test or testing errors that arose in the main test, for example due to microfields or surface contaminations, are identified.

    Abstract translation: 在微波测试中识别测试错误的方法。 用于识别测试中测试误差的方法特别用于具有多个网络(NW1 ... NW9)的印刷电路板(LP)形式的微线的电子束测试中。 每个网络都有多个接触点(1 ... 24)。 测试组(TG1)的网络(NW1 ... NW3)之间的网络(NW2)和短路(K1,K2)中的中断(U)或分别为不同的网络(NW2,NW4)之间的短路(K3) 在相应的主要测试中发现的测试组(TG1,TG2)在各自的跟踪测试中被确认,或者在主要测试中出现的测试错误(例如由于微场或表面污染物)被识别出来。

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