Abstract:
A method and apparatus for testing a substrate, wherein a particle beam is directed onto the substrate and emitted secondary particles are detected with a detector and then evaluated. The location of the site at which the secondary particles are emitted on the substrate relative to the position of the detector is taken into consideration during testing.
Abstract:
Method for particle beam testing of substrates for liquid crystal displays (LCD). This is directed to methods wherein, given a substrate (SUB1) for a liquid crystal display, either potentials or, respectively, currents are set in defined fashion with a particle beam (S1, S2 and S4) and/or potentials are measured by detecting secondary electrons (S5) at different switch statuses of the switch elements (T) of the substrate (SUB1). The geometrical integrity and the electrical functionability of the substrate (SUB1) are thereby tested, even though, for example, a supplementary plane electrode is not present for forming a capacitor. An important advantage of the method is that faulty substrates can be repaired or can be segregated even before further-processing and, thus, costs can be reduced.
Abstract:
Method for the recognition of testing errors in a test of microwirings. The method for the recognition of testing errors in the test is used in particular in an electron beam test of microwirings in the form of a printed circuit board (LP) having a plurality of networks (NW1 . . . NW9). Every network has a plurality of contact points (1 . . . 24). Interruptions (U) in networks (NW2) and shorts (K1, K2) between networks (NW1 . . . NW3) of a test group (TG1) or, respectively, shorts (K3) between networks (NW2, NW4) of different test groups (TG1, TG2), that are found in a respective main test, are confirmed in a respective follow-up test or testing errors that arose in the main test, for example due to microfields or surface contaminations, are identified.
Abstract:
Method for the recognition of testing errors in a test of microwirings. The method for the recognition of testing errors in the test is used in particular in an electron beam test of microwirings in the form of a printed circuit board (LP) having a plurality of networks (NW1 . . . NW9). Every network has a plurality of contact points (1 . . . 24). Interruptions (U) in networks (NW 2) and shorts (K1, K2) between networks (NW1 . . . NW3) of a test group (TG1) or, respectively, shorts (K3) between networks (NW2, NW4) of different test groups (TG1, TG2), that are found in a respective main test, are confirmed in a respective follow-up test or testing errors that arose in the main test, for example due to microfields or surface contaminations, are identified.
Abstract:
A method of thermal disposal of sewage sludge. The sludge is dried and incinerated. The flue gases from the incineration are washed. The flue gas dust resulting from the incineration and the sludge resulting from washing of the flue gases are treated together with high temperature combustion which includes melting of solids.