Method of impurity doping into semiconductor
    61.
    发明授权
    Method of impurity doping into semiconductor 失效
    半导体掺杂杂质的方法

    公开(公告)号:US5543356A

    公开(公告)日:1996-08-06

    申请号:US338137

    申请日:1994-11-09

    摘要: A method of impurity doping into a semiconductor, which comprises irradiating energy rays such as excimer laser beam (or UV-rays) to a predetermined region of a hydrogen terminated silicon surface to remove hydrogen atom layers terminating the silicon surface thereby forming a patterned silicon surface region not terminated with hydrogen and selectively adsorbing impurities on the silicon surface region not terminated with hydrogen, to conduct impurity doping. When such an impurity doping method is adopted, junctions having shallow and abrupt distribution for use in a miniaturized MOSFET or the like can be attained with a lesser number of the steps. Since the impurity doping process can be constituted as a clean and all dry in-situ process without using photoresist at all, it can also provide advantageous effect in view of enhanced yield and shortened production period.

    摘要翻译: 一种杂质掺杂到半导体中的方法,其包括将能量射线如准分子激光束(或紫外线)照射到氢封端的硅表面的预定区域以去除终止硅表面的氢原子层,从而形成图案化的硅表面 未被氢终止的区域并且选择性地吸附在未被氢端接的硅表面区域上的杂质,以进行杂质掺杂。 当采用这样的杂质掺杂方法时,可以通过较少数量的步骤来获得用于小型化的MOSFET等中具有浅而突然分布的结。 由于杂质掺杂工艺可以构成干净且全干燥的原位工艺,完全不使用光致抗蚀剂,所以鉴于增加的产量和缩短的生产周期,也可以提供有利的效果。